Patents by Inventor Naoki Kohyama

Naoki Kohyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10722962
    Abstract: A saw wire and various methods of use and manufacture are provided. The saw wire includes a metal wire containing at least one of tungsten and a tungsten alloy. A nickel plating layer is provided over the metal wire. An adhesion layer is provided at an interface between the metal wire and the nickel plating layer. The adhesion layer contains nickel and tungsten. A plurality of abrasive particles are provided at a surface of the nickel plating layer.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: July 28, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tomohiro Kanazawa, Tetsuji Shibata, Kazushige Sugita, Hiroshi Gouda, Naoki Kohyama
  • Patent number: 10723042
    Abstract: A saw wire includes a metal wire containing rhenium-tungsten alloy. A rhenium content of the metal wire is at least 0.1 wt % and at most 10 wt % with respect to a total weight of rhenium and tungsten, an elastic modulus of the metal wire is at least 350 GPa and at most 450 GPa, a tensile strength of the metal wire is at least 3500 MPa, and a diameter of the metal wire is at most 60 ?m.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: July 28, 2020
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Tomohiro Kanazawa, Tetsuji Shibata, Kazushige Sugita, Hiroshi Gouda, Naoki Kohyama
  • Publication number: 20190232404
    Abstract: A metal wire containing tungsten is provided. A tungsten content of the metal wire is at least 90 wt %. A tensile strength of the metal wire is at least 4000 MPa. An elastic modulus of the metal wire is at least 350 GPa and at most 450 GPa. A diameter of the metal wire is at most 60 ?m. An average crystal grain size of the metal wire in a cross-section orthogonal to an axis of the metal wire is at most 0.20 ?m.
    Type: Application
    Filed: January 24, 2019
    Publication date: August 1, 2019
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tomohiro KANAZAWA, Naoki KOHYAMA, Yoshihiro IGUCHI, Yuuki SASAGAWA, Tetsuji SHIBATA, Toshiyuki TANI
  • Publication number: 20180326518
    Abstract: A saw wire and various methods of use and manufacture are provided. The saw wire includes a metal wire containing one of tungsten and a tungsten alloy. A surface roughness Ra of the metal wire is at most 0.15 ?m. A diameter of the metal wire is at most 60 ?m.
    Type: Application
    Filed: May 9, 2018
    Publication date: November 15, 2018
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tomohiro KANAZAWA, Masato WADA, Takayuki IMAI, Tetsuji SHIBATA, Kazushige SUGITA, Naoki KOHYAMA, Hiroshi GOUDA, Yoshitaka MIZUGUCHI
  • Publication number: 20180326519
    Abstract: A saw wire and various methods of use and manufacture are provided. The saw wire includes a metal wire containing at least one of tungsten and a tungsten alloy. A surface roughness Ra of the metal wire is at most 0.15 ?m. A tensile strength of the metal wire is at least 3500 MPa. A diameter of the metal wire is at most 60 ?m.
    Type: Application
    Filed: May 9, 2018
    Publication date: November 15, 2018
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tomohiro KANAZAWA, Masato WADA, Takayuki IMAI, Tetsuji SHIBATA, Kazushige SUGITA, Naoki KOHYAMA, Hiroshi GOUDA, Yoshitaka MIZUGUCHI
  • Publication number: 20180326517
    Abstract: A saw wire and various methods of use and manufacture are provided. The saw wire includes a metal wire containing at least one of tungsten and a tungsten alloy. A nickel plating layer is provided over the metal wire. An adhesion layer is provided at an interface between the metal wire and the nickel plating layer. The adhesion layer contains nickel and tungsten. A plurality of abrasive particles are provided at a surface of the nickel plating layer.
    Type: Application
    Filed: May 9, 2018
    Publication date: November 15, 2018
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LT D.
    Inventors: Tomohiro KANAZAWA, Tetsuji SHIBATA, Kazushige SUGITA, Hiroshi GOUDA, Naoki KOHYAMA
  • Publication number: 20180281231
    Abstract: A saw wire includes a metal wire containing rhenium-tungsten alloy. A rhenium content of the metal wire is at least 0.1 wt % and at most 10 wt % with respect to a total weight of rhenium and tungsten, an elastic modulus of the metal wire is at least 350 GPa and at most 450 GPa, a tensile strength of the metal wire is at least 3500 MPa, and a diameter of the metal wire is at most 60 ?m.
    Type: Application
    Filed: February 26, 2018
    Publication date: October 4, 2018
    Inventors: Tomohiro KANAZAWA, Tetsuji SHIBATA, Kazushige SUGITA, Hiroshi GOUDA, Naoki KOHYAMA
  • Patent number: 7211955
    Abstract: A lamp includes a glass bulb 2 with a concave portion 1, a base 7 attached so as to cover at least part of the concave portion, a lead 11 for supplying electrical power with an end section located in the concave portion 1, and lead-free solder 17. The lead free solder 17 is composed mainly of Sn, and further contains, at least, between 5% and 40% inclusive of Sb and between 0% and 10% inclusive of Cu by mass, and has a solidus temperature of at least 235° C.
    Type: Grant
    Filed: September 9, 2004
    Date of Patent: May 1, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takeshi Meguro, Tsutomu Koino, Naoki Kohyama
  • Publication number: 20060061281
    Abstract: A lamp includes a glass bulb 2 with a concave portion 1, a base 7 attached so as to cover at least part of the concave portion, a lead 11 for supplying electrical power with an end section located in the concave portion 1, and lead-free solder 17. The lead free solder 17 is composed mainly of Sn, and further contains, at least, between 5% and 40% inclusive of Sb and between 0% and 10% inclusive of Cu by mass, and has a solidus temperature of at least 235° C.
    Type: Application
    Filed: September 9, 2004
    Publication date: March 23, 2006
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takeshi Meguro, Tsutomu Koino, Naoki Kohyama