Patents by Inventor Naoki Kohyama

Naoki Kohyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230366068
    Abstract: A metal wire has a total elongation of at least 5% and at most 16%; a tensile strength of at least 1600 MPa and at most 2400 MPa; and a diameter of less than 40 ?m.
    Type: Application
    Filed: October 4, 2021
    Publication date: November 16, 2023
    Applicant: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Tomohiro KANAZAWA, Yoshihiro KODAMA, Naoki KOHYAMA, Tatsuya TANIWAKI, Kenshi TSUJI, Tomohiro SAWA, Tetsuya NAKAAZE
  • Patent number: 11761065
    Abstract: A tungsten wire is a tungsten wire containing tungsten or a tungsten alloy, a diameter of the tungsten wire is at most 100 ?m, and a total number of torsional rotations to breakage per length of 50 mm of the tungsten wire is greater than or equal to 250×exp(?0.026×D) when a tension that is 50% of a breakage tension of the tungsten wire is applied as a load, D denoting the diameter of the tungsten wire.
    Type: Grant
    Filed: April 13, 2020
    Date of Patent: September 19, 2023
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tomohiro Kanazawa, Naoki Kohyama, Yoshihiro Iguchi, Yui Nakai
  • Publication number: 20230227951
    Abstract: A tungsten wire that contains tungsten or a tungsten alloy is provided. An average width of surface crystal grains in a direction perpendicular to an axis of the tungsten wire is at most 98 nm. The tungsten wire has a tensile strength of at least 3900 MPa. The tungsten wire has a diameter of at least 100 ?m and at most 225 ?m.
    Type: Application
    Filed: May 26, 2021
    Publication date: July 20, 2023
    Inventors: Tomohiro KANAZAWA, Naoki KOHYAMA, Kenshi TSUJI, Yoshihiro IGUCHI, Yui NAKAI, Tetsuya NAKAAZE
  • Publication number: 20230002867
    Abstract: A metal wire, which is one of a tungsten wire and a tungsten alloy wire, includes alkali metal on the surface thereof. The amount of alkali metal is at most 2.0 ?g per 1 g of the metal wire.
    Type: Application
    Filed: December 4, 2020
    Publication date: January 5, 2023
    Applicant: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Akitoshi KASAHARA, Naoki KOHYAMA, Tomohiro KANAZAWA, Kenshi TSUJI, Yoshiyuki KITA, Atsushi SHIMADA, Yuuki SASAGAWA
  • Publication number: 20220220591
    Abstract: A tungsten wire is a tungsten wire containing tungsten or a tungsten alloy, a diameter of the tungsten wire is at most 100 ?m, and a total number of torsional rotations to breakage per length of 50 mm of the tungsten wire (10) is greater than or equal to 250×exp(?0.026×D) when a tension that is 50% of a breakage tension of the tungsten wire is applied as a load, D denoting the diameter of the tungsten wire.
    Type: Application
    Filed: April 13, 2020
    Publication date: July 14, 2022
    Applicant: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Tomohiro KANAZAWA, Naoki KOHYAMA, Yoshihiro IGUCHI, Yui NAKAI
  • Publication number: 20220098708
    Abstract: A tungsten wire contains tungsten or a tungsten alloy. An average width of surface crystal grains in a direction perpendicular to an axis of the tungsten wire is at most 76 nm. The tungsten wire has a tensile of at least 4800 MPa, and a diameter of at most 100 ?m.
    Type: Application
    Filed: November 18, 2019
    Publication date: March 31, 2022
    Applicant: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Tomohiro KANAZAWA, Yoshihiro IGUCHI, Naoki KOHYAMA, Atsushi SHIMADA, Kenshi TSUJI, Yui NAKAI
  • Patent number: 10967447
    Abstract: A metal wire containing tungsten is provided. A tungsten content of the metal wire is at least 90 wt %. A tensile strength of the metal wire is at least 4000 MPa. An elastic modulus of the metal wire is at least 350 GPa and at most 450 GPa. A diameter of the metal wire is at most 60 ?m. An average crystal grain size of the metal wire in a cross-section orthogonal to an axis of the metal wire is at most 0.20 ?m.
    Type: Grant
    Filed: January 24, 2019
    Date of Patent: April 6, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tomohiro Kanazawa, Naoki Kohyama, Yoshihiro Iguchi, Yuuki Sasagawa, Tetsuji Shibata, Toshiyuki Tani
  • Patent number: 10722962
    Abstract: A saw wire and various methods of use and manufacture are provided. The saw wire includes a metal wire containing at least one of tungsten and a tungsten alloy. A nickel plating layer is provided over the metal wire. An adhesion layer is provided at an interface between the metal wire and the nickel plating layer. The adhesion layer contains nickel and tungsten. A plurality of abrasive particles are provided at a surface of the nickel plating layer.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: July 28, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tomohiro Kanazawa, Tetsuji Shibata, Kazushige Sugita, Hiroshi Gouda, Naoki Kohyama
  • Patent number: 10723042
    Abstract: A saw wire includes a metal wire containing rhenium-tungsten alloy. A rhenium content of the metal wire is at least 0.1 wt % and at most 10 wt % with respect to a total weight of rhenium and tungsten, an elastic modulus of the metal wire is at least 350 GPa and at most 450 GPa, a tensile strength of the metal wire is at least 3500 MPa, and a diameter of the metal wire is at most 60 ?m.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: July 28, 2020
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Tomohiro Kanazawa, Tetsuji Shibata, Kazushige Sugita, Hiroshi Gouda, Naoki Kohyama
  • Publication number: 20190232404
    Abstract: A metal wire containing tungsten is provided. A tungsten content of the metal wire is at least 90 wt %. A tensile strength of the metal wire is at least 4000 MPa. An elastic modulus of the metal wire is at least 350 GPa and at most 450 GPa. A diameter of the metal wire is at most 60 ?m. An average crystal grain size of the metal wire in a cross-section orthogonal to an axis of the metal wire is at most 0.20 ?m.
    Type: Application
    Filed: January 24, 2019
    Publication date: August 1, 2019
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tomohiro KANAZAWA, Naoki KOHYAMA, Yoshihiro IGUCHI, Yuuki SASAGAWA, Tetsuji SHIBATA, Toshiyuki TANI
  • Publication number: 20180326519
    Abstract: A saw wire and various methods of use and manufacture are provided. The saw wire includes a metal wire containing at least one of tungsten and a tungsten alloy. A surface roughness Ra of the metal wire is at most 0.15 ?m. A tensile strength of the metal wire is at least 3500 MPa. A diameter of the metal wire is at most 60 ?m.
    Type: Application
    Filed: May 9, 2018
    Publication date: November 15, 2018
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tomohiro KANAZAWA, Masato WADA, Takayuki IMAI, Tetsuji SHIBATA, Kazushige SUGITA, Naoki KOHYAMA, Hiroshi GOUDA, Yoshitaka MIZUGUCHI
  • Publication number: 20180326517
    Abstract: A saw wire and various methods of use and manufacture are provided. The saw wire includes a metal wire containing at least one of tungsten and a tungsten alloy. A nickel plating layer is provided over the metal wire. An adhesion layer is provided at an interface between the metal wire and the nickel plating layer. The adhesion layer contains nickel and tungsten. A plurality of abrasive particles are provided at a surface of the nickel plating layer.
    Type: Application
    Filed: May 9, 2018
    Publication date: November 15, 2018
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LT D.
    Inventors: Tomohiro KANAZAWA, Tetsuji SHIBATA, Kazushige SUGITA, Hiroshi GOUDA, Naoki KOHYAMA
  • Publication number: 20180326518
    Abstract: A saw wire and various methods of use and manufacture are provided. The saw wire includes a metal wire containing one of tungsten and a tungsten alloy. A surface roughness Ra of the metal wire is at most 0.15 ?m. A diameter of the metal wire is at most 60 ?m.
    Type: Application
    Filed: May 9, 2018
    Publication date: November 15, 2018
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tomohiro KANAZAWA, Masato WADA, Takayuki IMAI, Tetsuji SHIBATA, Kazushige SUGITA, Naoki KOHYAMA, Hiroshi GOUDA, Yoshitaka MIZUGUCHI
  • Publication number: 20180281231
    Abstract: A saw wire includes a metal wire containing rhenium-tungsten alloy. A rhenium content of the metal wire is at least 0.1 wt % and at most 10 wt % with respect to a total weight of rhenium and tungsten, an elastic modulus of the metal wire is at least 350 GPa and at most 450 GPa, a tensile strength of the metal wire is at least 3500 MPa, and a diameter of the metal wire is at most 60 ?m.
    Type: Application
    Filed: February 26, 2018
    Publication date: October 4, 2018
    Inventors: Tomohiro KANAZAWA, Tetsuji SHIBATA, Kazushige SUGITA, Hiroshi GOUDA, Naoki KOHYAMA
  • Patent number: 7211955
    Abstract: A lamp includes a glass bulb 2 with a concave portion 1, a base 7 attached so as to cover at least part of the concave portion, a lead 11 for supplying electrical power with an end section located in the concave portion 1, and lead-free solder 17. The lead free solder 17 is composed mainly of Sn, and further contains, at least, between 5% and 40% inclusive of Sb and between 0% and 10% inclusive of Cu by mass, and has a solidus temperature of at least 235° C.
    Type: Grant
    Filed: September 9, 2004
    Date of Patent: May 1, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takeshi Meguro, Tsutomu Koino, Naoki Kohyama
  • Publication number: 20060061281
    Abstract: A lamp includes a glass bulb 2 with a concave portion 1, a base 7 attached so as to cover at least part of the concave portion, a lead 11 for supplying electrical power with an end section located in the concave portion 1, and lead-free solder 17. The lead free solder 17 is composed mainly of Sn, and further contains, at least, between 5% and 40% inclusive of Sb and between 0% and 10% inclusive of Cu by mass, and has a solidus temperature of at least 235° C.
    Type: Application
    Filed: September 9, 2004
    Publication date: March 23, 2006
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takeshi Meguro, Tsutomu Koino, Naoki Kohyama