Patents by Inventor Naoki Komukai

Naoki Komukai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7977162
    Abstract: A semiconductor device includes a semiconductor chip, and a multicomponent alloy layer formed on a face of the semiconductor chip, the multicomponent alloy layer being in a solid-liquid coexisting state in a specific temperature range, and including a surface having concavity and convexity caused by solidification segregation.
    Type: Grant
    Filed: July 9, 2008
    Date of Patent: July 12, 2011
    Assignee: Seiko Epson Corporation
    Inventor: Naoki Komukai
  • Publication number: 20090032936
    Abstract: A semiconductor device includes a semiconductor chip, and a multicomponent alloy layer formed on a face of the semiconductor chip, the multicomponent alloy layer being in a solid-liquid coexisting state in a specific temperature range, and including a surface having concavity and convexity caused by solidification segregation.
    Type: Application
    Filed: July 9, 2008
    Publication date: February 5, 2009
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Naoki KOMUKAI