Patents by Inventor Naoki Kurosu

Naoki Kurosu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6676005
    Abstract: The present invention enhances the reliability of wire-bonding strength by reducing a variation in the entire transformation amount of a wire. At point P1, a bonding wedge 21 abuts the wire 71, whereby a load is exerted on the wire 71. The wire 71 transforms by an amount of transformation A, and the transformation stops at point P2. The transformation amount A varies greatly. At point P3 (T1), ultrasonic wave vibration is exerted and the transformation of the wire 71 is restarted. At this stage, a variation in the transformation amount A is absorbed by an amount of transformation B and therefore a variation in the transformation amount A+B becomes small. At point P4 (T1+T2), the transformation amount A+B is maintained substantially constant. At this point P4, the transformation amount of the wire 71 is set to 0 and the measurement of the transformation amount of the wire 71 is started.
    Type: Grant
    Filed: July 17, 2002
    Date of Patent: January 13, 2004
    Assignee: International Business Machines Corporation
    Inventors: Kenji Itoh, Naoki Kurosu, Yohtaroh Ichimura, Tatsushi Yoshida
  • Publication number: 20030010806
    Abstract: The present invention enhances the reliability of wire-bonding strength by reducing a variation in the entire transformation amount of a wire. At point P1, a bonding wedge 21 abuts the wire 71, whereby a load is exerted on the wire 71. The wire 71 transforms by an amount of transformation A, and the transformation stops at point P2. The transformation amount A varies greatly. At point P3 (T1), ultrasonic wave vibration is exerted and the transformation of the wire 71 is restarted. At this stage, a variation in the transformation amount A is absorbed by an amount of transformation B and therefore a variation in the transformation amount A+B becomes small. At point P4 (T1+T2), the transformation amount A+B is maintained substantially constant. At this point P4, the transformation amount of the wire 71 is set to 0 and the measurement of the transformation amount of the wire 71 is started.
    Type: Application
    Filed: July 17, 2002
    Publication date: January 16, 2003
    Inventors: Kenji Itoh, Naoki Kurosu, Yohtaroh Ichimura, Tatsushi Yoshida
  • Patent number: 6382499
    Abstract: An integrated suspension for a slider in a magnetic record system has a simplified structure relatively easy to manufacture. This new integrated suspension is assembled from separate pieces including a load beam a flexure and a mount plate. The flexure includes a flexible member and a conductive lead integrally formed thereon. Since the flexible member is of super-thin type, the flexion of the flexure is minimized by the support using a platform support in an ultrasonic bonding of its conductive lead with a bonding pad of the slider. Besides, to minimize the deflection, an ultrasonic bonding is executed in close order of distance to support portion. Furthermore, a tab extending from the tip of the load beam is used so as not to affect the flexure regarded as a fine piece.
    Type: Grant
    Filed: August 26, 1998
    Date of Patent: May 7, 2002
    Assignee: International Business Machines Corporation
    Inventors: Takuya Satoh, Tatsushi Yoshida, Tatsumi Tsuchiya, Naoki Kurosu
  • Patent number: 6355122
    Abstract: A set of bonding pads are ultrasonically connected to a set of leads. The bonding pads are formed on a predetermined plane of a slider held by a slider holder accessible to the recording plane of a disk in a disk drive. The leads are held by the slider holder and have joints that are formed so as to respectively face each of the bonding pads. A front end plane of a wedge working on the joints is tilted in a direction in which the first sides of the joints correspond to external connection sides. The ultrasonic connection is completed by pressing the joints of the leads against the faced boding pads.
    Type: Grant
    Filed: June 22, 2000
    Date of Patent: March 12, 2002
    Assignee: International Business Machines Corporation
    Inventors: Kenji Itoh, Naoki Kurosu, Yohtaroh Ichimura, Tatsushi Yoshida