Patents by Inventor Naoki Minorikawa

Naoki Minorikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240059901
    Abstract: Provided is a method for producing a surface-treated thermally conductive filler, the method including treating the surface of the thermally conductive filler with an alkoxysilane having a specific structure by the chemical vapor deposition method.
    Type: Application
    Filed: October 4, 2021
    Publication date: February 22, 2024
    Applicant: RESONAC CORPORATION
    Inventors: Naoki MINORIKAWA, Hikaru SATOH, Hajime FUNAHASHI, Ikue KOBAYASHI, Hajime YUKUTAKE, Takeshi IEMURA
  • Publication number: 20240052223
    Abstract: A thermally conductive urethane resin composition comprising a castor oil-based polyol, a polyisocyanate compound, and a filler, wherein an equivalent ratio [NCO/OH] of isocyanato groups of the polyisocyanate compound to hydroxyl groups of the castor oil-based polyol is from 0.8 to 1.6, the filler comprises a filler (A) having an average particle diameter of 0.03 to 10 ?m, and the filler (A) has been surface-treated with a specific surface treatment agent.
    Type: Application
    Filed: January 28, 2022
    Publication date: February 15, 2024
    Applicant: SHOWA DENKO K.K.
    Inventors: Hajime FUNAHASHI, Naoki MINORIKAWA, Hikaru SATOH, Ikue KOBAYASHI, Hajime YUKUTAKE, Takeshi IEMURA
  • Publication number: 20240052224
    Abstract: A thermally conductive composition comprising: a filler; and a polymer component, wherein the filler comprises at least one surface-treated filler selected from the group consisting of the following filler (A) and filler (B): Filler (A): A filler surface-treated by a chemical vapor deposition method using a siloxane having one SiH group Filler (B): A filler surface-treated by a chemical vapor deposition method using a siloxane having two or more SiH groups, wherein at least one group selected from the group consisting of an unsubstituted alkyl group having 6 to 20 carbon atoms, an alkyl group having 2 to 20 carbon atoms having a substituent, and a group having a specific structure is further bonded to a silicon atom on a surface of the filler and introduced.
    Type: Application
    Filed: May 24, 2022
    Publication date: February 15, 2024
    Applicant: Resonac Corporation
    Inventors: Naoki MINORIKAWA, Hajime FUNAHASHI, Hikaru SATOH, Hajime YUKUTAKE
  • Publication number: 20230227707
    Abstract: Provided is a thermally conductive composition containing a liquid resin, a thermally conductive powder, and a dispersant, in which the liquid resin has a viscosity of 10 mPa·s or more and 2,000 mPa·s or less at 25° C., the dispersant is an acrylic silicone, and at least one of the liquid resin and the thermally conductive powder contains an alkyl group having 4 or more carbon atoms.
    Type: Application
    Filed: May 11, 2021
    Publication date: July 20, 2023
    Applicant: SHOWA DENKO K.K.
    Inventors: Hajime YUKUTAKE, Naoki MINORIKAWA, Hajime FUNAHASHI
  • Publication number: 20220363912
    Abstract: A silicon-containing oxide-coated aluminum nitride particle including an aluminum nitride particle and a silicon-containing oxide coating covering the surface of the aluminum nitride particle. The content of carbon atoms is less than 1000 ppm by mass, and an Si/Al atom ratio of the surface as measured by AES analysis is 0.29 or more and 5.0 or less. In another aspect, the coverage of the silicon-containing oxide coating covering the surface of the aluminum nitride particle as measured by LEIS analysis is 15% or more and 100% or less.
    Type: Application
    Filed: June 30, 2022
    Publication date: November 17, 2022
    Applicant: SHOWA DENKO K.K.
    Inventors: Yuki Otsuka, Hidetoshi Okamoto, Naoki Minorikawa
  • Patent number: 11396602
    Abstract: A method of manufacturing a silicon-containing oxide-coated aluminum nitride particle; a method of manufacturing a heat dispersing resin composition containing the silicon-containing oxide-coated aluminum nitride particle; and the silicon-containing oxide-coated aluminum nitride particle. The method of manufacturing includes: a first step of covering the surface of the aluminum nitride particle with an organic silicone compound including a specific structure; and a second step of heating the aluminum nitride particle covered with the organic silicone compound at a temperature of 300° C. or more and less than 1000° C., wherein the content of carbon atoms in the silicon-containing oxide-coated aluminum nitride particle is less than 1000 ppm by mass.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: July 26, 2022
    Assignee: SHOWA DENKO K.K.
    Inventors: Yuki Otsuka, Hidetoshi Okamoto, Naoki Minorikawa
  • Publication number: 20220195141
    Abstract: A method of manufacturing a silica-coated boron nitride particle including a first step of covering the surface of the boron nitride particle with an organic silicone compound having a specific structure and a second step of heating the boron nitride particle covered with the organic silicone compound at a temperature of 500° C. or more and 1000° C. or less, wherein the content of carbon atoms in the silica-coated boron nitride particle is 1000 ppm by mass or less. Also disclosed is a method of manufacturing a heat dissipating resin composition containing the silica-coated boron nitride particle; and silica-coated boron nitride particles.
    Type: Application
    Filed: July 9, 2020
    Publication date: June 23, 2022
    Applicant: SHOWA DENKO K.K.
    Inventors: Naoki MINORIKAWA, Ikue KOBAYASHI, Yuki OTSUKA
  • Publication number: 20220135805
    Abstract: A method for producing silicon-containing oxide-coated aluminum nitride particles including aluminum nitride particles and a silicon-containing oxide coating covering a surface of each of the aluminum nitride particles. The method includes a first step including mixing aluminum nitride particles and an organic silicone compound solution in which an organic silicone compound containing a specific structure is dissolved in a solvent to form a mixture and then heating the mixture to remove the solvent and to obtain aluminum nitride particles coated with the organic silicone compound; and a second step including heating the aluminum nitride particles coated with the organic silicone compound at a temperature of 300° C. or more and 1,000° C. or less.
    Type: Application
    Filed: November 11, 2020
    Publication date: May 5, 2022
    Applicant: SHOWA DENKO K. K.
    Inventors: Yuki OTSUKA, Naoki MINORIKAWA, Ikue KOBAYASHI
  • Publication number: 20220119619
    Abstract: An inorganic particle dispersion resin composition, containing: a resin; and inorganic particles, in which the inorganic particles include silica-covered aluminum nitride particles and alumina particles, and the silica-covered aluminum nitride particles include aluminum nitride particles and a silica film covering surfaces of the aluminum nitride particles. A total content of the inorganic particles is preferably in a range of greater than or equal to 60.0 volume % and less than or equal to 85.0 volume %.
    Type: Application
    Filed: July 30, 2020
    Publication date: April 21, 2022
    Applicant: SHOWA DENKO K.K.
    Inventors: Hajime YUKUTAKE, Yuki OTSUKA, Naoki MINORIKAWA, Hidetoshi OKAMOTO, Toshihiro ARAI
  • Publication number: 20210309861
    Abstract: A method of manufacturing a silicon-containing oxide-coated aluminum nitride particle; a method of manufacturing a heat dispersing resin composition containing the silicon-containing oxide-coated aluminum nitride particle; and the silicon-containing oxide-coated aluminum nitride particle. The method of manufacturing includes: a first step of covering the surface of the aluminum nitride particle with an organic silicone compound including a specific structure; and a second step of heating the aluminum nitride particle covered with the organic silicone compound at a temperature of 300° C. or more and less than 1000° C., wherein the content of carbon atoms in the silicon-containing oxide-coated aluminum nitride particle is less than 1000 ppm by mass.
    Type: Application
    Filed: August 23, 2019
    Publication date: October 7, 2021
    Applicant: SHOWA DENKO K.K.
    Inventors: Yuki OTSUKA, Hidetoshi OKAMOTO, Naoki MINORIKAWA
  • Publication number: 20180179383
    Abstract: The present invention provides: 1) a silicone resin composition, containing: a thermosetting silicone resin; an inorganic substance; and a dispersant, in which: the dispersant includes a copolymer of a (meth)acrylic acid ester having at least one polydimethylsiloxane structure and a (meth)acrylic acid alkyl ester; and the inorganic substance is boron nitride or a mixture of the boron nitride and an inorganic substance except the boron nitride; 2) a dispersant for a boron nitride-containing silicone resin composition, comprising the above-mentioned copolymer; and 3) an inorganic filler, comprising boron nitride or a mixture of the boron nitride and an inorganic substance except the boron nitride. The silicone resin composition of the present invention has a low viscosity and has stability against a mechanochemical treatment.
    Type: Application
    Filed: May 18, 2016
    Publication date: June 28, 2018
    Applicant: SHOWA DENKO K. K.
    Inventors: Naoki MINORIKAWA, Mizuki HIRANO, Tomiharu YAMADA
  • Publication number: 20120238678
    Abstract: Disclosed is a chloroprene polymer latex composition for water-based one-liquid type adhesives having well-balanced initial adhesive force, contact properties, storage stability and spray coating properties, characterized by comprising 60-95 mass % (in terms of solid content) of the chloroprene polymer latex (A), 5-40 mass % (in terms of solid content) of an acrylic resin latex (B) containing an acrylic polymer having a glass transition temperature of ?50 to 0° C., and 0.02-5 parts by mass (in terms of solid content), per 100 parts by mass (containing water) of the sum of said chloroprene polymer latex (A) and said acrylic resin latex (B), of a surfactant (C) represented by general formula (1): RO—(CH2CH2O)n—SO3M(1) wherein R represents an aliphatic alkyl group having 5 to 20 carbon atoms on average; M represents sodium or ammonium; and n (average) is from 2 to 60.
    Type: Application
    Filed: November 29, 2010
    Publication date: September 20, 2012
    Applicant: SHOWA DENKO K.K.
    Inventors: Naoki Minorikawa, Youichiro Takenoshita, Erika Suzuki
  • Patent number: 7354655
    Abstract: An object of the present invention is to provide an adhesive resin composition which displays excellent adhesive strength on bonding to a barrier material, during initial adhesion, durable adhesion, and even after soak in fuel oil, and which also has excellent moldability. Furthermore, another object of the present is to provide an adhesive resin composition which when recycled, displays good compatible in a regrind layer with polyethylene resins and barrier materials such as saponified products of ethylene-vinyl acetate copolymers or polyamide based resins, and which is consequently capable of suppressing deterioration in the low temperature impact resistance of a multi-layer vessel containing a regrind layer.
    Type: Grant
    Filed: November 26, 2002
    Date of Patent: April 8, 2008
    Assignee: Japan Polyolefins Co., Ltd.
    Inventors: Tatsuo Yamaguchi, Shinji Miwa, Fumio Asada, Kenichi Hiraki, Naoki Minorikawa
  • Publication number: 20030175538
    Abstract: An object of the present invention is to provide an adhesive resin composition which displays excellent adhesive strength on bonding to a barrier material, during initial adhesion, durable adhesion, and even after soak in fuel oil, and which also has excellent moldability. Furthermore, another object of the present is to provide an adhesive resin composition which when recycled, displays good compatible in a regrind layer with polyethylene resins and barrier materials such as saponified products of ethylene-vinyl acetate copolymers or polyamide based resins, and which is consequently capable of suppressing deterioration in the low temperature impact resistance of a multi-layer vessel containing a regrind layer.
    Type: Application
    Filed: November 26, 2002
    Publication date: September 18, 2003
    Applicant: JAPAN POLYOLEFINS CO., LTD.
    Inventors: Tatsuo Yamaguchi, Shinji Miwa, Fumio Asada, Kenichi Hiraki, Naoki Minorikawa
  • Patent number: 6482530
    Abstract: An adhesive resin composition comprising: (A) At least one component selected from the group consisting of (i) polyolefins having a melt flow rate of 0.1 to 30 g/10 min and (ii) olefinic polymers having at least one functional group capable of reacting with an epoxy group; and (B) an epoxy compound having at least two epoxy groups in the molecule and having a number average molecular weight of 3000 or less, wherein the ratio of the component (B) to the total weight of the components (A) and (B) is 0.01 to 5% by weight, and a laminate of (a) a layer composed of the above-mentioned adhesive resin composition and a substrate contacted therewith.
    Type: Grant
    Filed: January 11, 2001
    Date of Patent: November 19, 2002
    Assignee: Showa Denko K.K.
    Inventors: Koichi Ito, Hiroshi Kasahara, Satoshi Maruyama, Masahiro Ueno, Naoki Minorikawa
  • Publication number: 20020102408
    Abstract: An adhesive resin composition comprising:
    Type: Application
    Filed: February 4, 2002
    Publication date: August 1, 2002
    Applicant: SHOWA DENKO K.K.
    Inventors: Koichi Ito, Hiroshi Kasahara, Satoshi Maruyama, Masahiro Ueno, Naoki Minorikawa
  • Publication number: 20010003767
    Abstract: An adhesive resin composition comprising:
    Type: Application
    Filed: January 11, 2001
    Publication date: June 14, 2001
    Inventors: Koichi Ito, Hiroshi Kasahara, Satoshi Maruyama, Masahiro Ueno, Naoki Minorikawa
  • Patent number: 6201066
    Abstract: An adhesive resin composition for extrusion lamination comprising: (A) At least one component selected from the group consisting of (i) polyolefins having a melt flow rate of 0.1 to 30 g/10 min and (ii) olefinic polymers having at least one functional group capable of reacting with an epoxy group; and (B) an epoxy compound having at least two epoxy groups in the molecule and having a number average molecular weight of 3000 or less, wherein the ratio of the component (B) to the total weight of the components (A) and (B) is 0.01 to 5% by weight, and a laminate of (a) a layer composed of the above-mentioned adhesive resin composition and a substrate contacted therewith.
    Type: Grant
    Filed: April 17, 1997
    Date of Patent: March 13, 2001
    Assignee: Showa Denko K.K.
    Inventors: Koichi Ito, Hiroshi Kasahara, Satoshi Maruyama, Masahiro Ueno, Naoki Minorikawa
  • Patent number: 6099685
    Abstract: An adhesive resin composition comprising:(A) At least one component selected from the group consisting of (i) polyolefins having a melt flow rate of 0.1 to 30 g/10 min and (ii) olefinic polymers having at least one functional group capable of reacting with an epoxy group; and(B) an epoxy compound having at least two epoxy groups in the molecule and having a number average molecular weight of 3000 or less, wherein the ratio of the component (B) to the total weight of the components (A) and (B) is 0.01 to 5% by weight, and a laminate of (a) a layer composed of the above-mentioned adhesive resin composition and a substrate contacted therewith.
    Type: Grant
    Filed: March 27, 1997
    Date of Patent: August 8, 2000
    Assignee: Showa Denko K.K.
    Inventors: Koichi Ito, Hiroshi Kasahara, Satoshi Maruyama, Masahiro Ueno, Naoki Minorikawa
  • Patent number: 5270439
    Abstract: A method of producing a curable composition containing a prepolymer having a polythioether skeleton, characterized by comprising addition reacting (A) 4,4'-bis(methacryloylthio)-diphenylsulfide having the formula (I): ##STR1## wherein R is a polyvalent organic group composed of an aliphatic or aromatic hydrocarbon and n represents an integer of 2 or more, with the functional group equivalent ratio of the mercapto groups of the component (B) (ii) to the methacryloyl groups of the component (A) being from 0.02 to 1.01, in another vinyl monomer copolymerizable with 4,4'-bis(methacryloylthio)diphenylsulfide having the above formula (I) in the presence of a base catalyst.
    Type: Grant
    Filed: September 28, 1992
    Date of Patent: December 14, 1993
    Assignee: Sumitomo Seika Chemicals Co., Ltd.
    Inventors: Satoshi Maruyama, Naoki Minorikawa, Tsutomu Arakawa, Haruo Yoshida, Hirotaka Tagoshi, Kazuto Abe