Abstract: An inorganic particle dispersion resin composition, containing: a resin; and inorganic particles, in which the inorganic particles include silica-covered aluminum nitride particles and alumina particles, and the silica-covered aluminum nitride particles include aluminum nitride particles and a silica film covering surfaces of the aluminum nitride particles. A total content of the inorganic particles is preferably in a range of greater than or equal to 60.0 volume % and less than or equal to 85.0 volume %.

Abstract: A silicon-containing oxide-coated aluminum nitride particle including an aluminum nitride particle and a silicon-containing oxide coating covering the surface of the aluminum nitride particle. The content of carbon atoms is less than 1000 ppm by mass, and an Si/Al atom ratio of the surface as measured by AES analysis is 0.29 or more and 5.0 or less. In another aspect, the coverage of the silicon-containing oxide coating covering the surface of the aluminum nitride particle as measured by LEIS analysis is 15% or more and 100% or less.

Abstract: A silicon-containing oxide-coated aluminum nitride particle including an aluminum nitride particle and a silicon-containing oxide coating covering the surface of the aluminum nitride particle. The content of carbon atoms is less than 1000 ppm by mass, and an Si/Al atom ratio of the surface as measured by AES analysis is 0.29 or more and 5.0 or less. In another aspect, the coverage of the silicon-containing oxide coating covering the surface of the aluminum nitride particle as measured by LEIS analysis is 15% or more and 100% or less.

Abstract: A method for producing a silicon-containing oxide-coated aluminum nitride particle that maintains the high thermal conductivity of aluminum nitride particles, have excellent moisture resistance, and do not easily aggregate. A method for producing a silicon-containing oxide-coated aluminum nitride particle including an aluminum nitride particle and a silicon-containing oxide film that covers a surface of the aluminum nitride particle. The method includes a vapor-depositing an organic silicone compound including a specific structure on the surface of the aluminum nitride particle to obtain the aluminum nitride particle covered with the organic silicone compound under a nitrogen atmosphere, and a partial pressure of the organic silicone compound in the nitrogen atmosphere is 2.6×102 to 3.9×103 Pa, and heating the aluminum nitride particle covered with the organic silicone compound at a temperature of 300° C. or higher and lower than 1000° C.

Abstract: Provided is a method for producing a surface-treated thermally conductive filler, the method including treating the surface of the thermally conductive filler with an alkoxysilane having a specific structure by the chemical vapor deposition method.

Abstract: A thermally conductive urethane resin composition comprising a castor oil-based polyol, a polyisocyanate compound, and a filler, wherein an equivalent ratio [NCO/OH] of isocyanato groups of the polyisocyanate compound to hydroxyl groups of the castor oil-based polyol is from 0.8 to 1.6, the filler comprises a filler (A) having an average particle diameter of 0.03 to 10 ?m, and the filler (A) has been surface-treated with a specific surface treatment agent.

Abstract: A thermally conductive composition comprising: a filler; and a polymer component, wherein the filler comprises at least one surface-treated filler selected from the group consisting of the following filler (A) and filler (B): Filler (A): A filler surface-treated by a chemical vapor deposition method using a siloxane having one SiH group Filler (B): A filler surface-treated by a chemical vapor deposition method using a siloxane having two or more SiH groups, wherein at least one group selected from the group consisting of an unsubstituted alkyl group having 6 to 20 carbon atoms, an alkyl group having 2 to 20 carbon atoms having a substituent, and a group having a specific structure is further bonded to a silicon atom on a surface of the filler and introduced.

Abstract: Provided is a thermally conductive composition containing a liquid resin, a thermally conductive powder, and a dispersant, in which the liquid resin has a viscosity of 10 mPa·s or more and 2,000 mPa·s or less at 25° C., the dispersant is an acrylic silicone, and at least one of the liquid resin and the thermally conductive powder contains an alkyl group having 4 or more carbon atoms.

Abstract: A silicon-containing oxide-coated aluminum nitride particle including an aluminum nitride particle and a silicon-containing oxide coating covering the surface of the aluminum nitride particle. The content of carbon atoms is less than 1000 ppm by mass, and an Si/Al atom ratio of the surface as measured by AES analysis is 0.29 or more and 5.0 or less. In another aspect, the coverage of the silicon-containing oxide coating covering the surface of the aluminum nitride particle as measured by LEIS analysis is 15% or more and 100% or less.

Abstract: A method of manufacturing a silicon-containing oxide-coated aluminum nitride particle; a method of manufacturing a heat dispersing resin composition containing the silicon-containing oxide-coated aluminum nitride particle; and the silicon-containing oxide-coated aluminum nitride particle. The method of manufacturing includes: a first step of covering the surface of the aluminum nitride particle with an organic silicone compound including a specific structure; and a second step of heating the aluminum nitride particle covered with the organic silicone compound at a temperature of 300° C. or more and less than 1000° C., wherein the content of carbon atoms in the silicon-containing oxide-coated aluminum nitride particle is less than 1000 ppm by mass.

Abstract: A method of manufacturing a silica-coated boron nitride particle including a first step of covering the surface of the boron nitride particle with an organic silicone compound having a specific structure and a second step of heating the boron nitride particle covered with the organic silicone compound at a temperature of 500° C. or more and 1000° C. or less, wherein the content of carbon atoms in the silica-coated boron nitride particle is 1000 ppm by mass or less. Also disclosed is a method of manufacturing a heat dissipating resin composition containing the silica-coated boron nitride particle; and silica-coated boron nitride particles.

Abstract: A method for producing silicon-containing oxide-coated aluminum nitride particles including aluminum nitride particles and a silicon-containing oxide coating covering a surface of each of the aluminum nitride particles. The method includes a first step including mixing aluminum nitride particles and an organic silicone compound solution in which an organic silicone compound containing a specific structure is dissolved in a solvent to form a mixture and then heating the mixture to remove the solvent and to obtain aluminum nitride particles coated with the organic silicone compound; and a second step including heating the aluminum nitride particles coated with the organic silicone compound at a temperature of 300° C. or more and 1,000° C. or less.

Abstract: An inorganic particle dispersion resin composition, containing: a resin; and inorganic particles, in which the inorganic particles include silica-covered aluminum nitride particles and alumina particles, and the silica-covered aluminum nitride particles include aluminum nitride particles and a silica film covering surfaces of the aluminum nitride particles. A total content of the inorganic particles is preferably in a range of greater than or equal to 60.0 volume % and less than or equal to 85.0 volume %.

Abstract: A method of manufacturing a silicon-containing oxide-coated aluminum nitride particle; a method of manufacturing a heat dispersing resin composition containing the silicon-containing oxide-coated aluminum nitride particle; and the silicon-containing oxide-coated aluminum nitride particle. The method of manufacturing includes: a first step of covering the surface of the aluminum nitride particle with an organic silicone compound including a specific structure; and a second step of heating the aluminum nitride particle covered with the organic silicone compound at a temperature of 300° C. or more and less than 1000° C., wherein the content of carbon atoms in the silicon-containing oxide-coated aluminum nitride particle is less than 1000 ppm by mass.

Abstract: The present invention provides: 1) a silicone resin composition, containing: a thermosetting silicone resin; an inorganic substance; and a dispersant, in which: the dispersant includes a copolymer of a (meth)acrylic acid ester having at least one polydimethylsiloxane structure and a (meth)acrylic acid alkyl ester; and the inorganic substance is boron nitride or a mixture of the boron nitride and an inorganic substance except the boron nitride; 2) a dispersant for a boron nitride-containing silicone resin composition, comprising the above-mentioned copolymer; and 3) an inorganic filler, comprising boron nitride or a mixture of the boron nitride and an inorganic substance except the boron nitride. The silicone resin composition of the present invention has a low viscosity and has stability against a mechanochemical treatment.

Abstract: Disclosed is a chloroprene polymer latex composition for water-based one-liquid type adhesives having well-balanced initial adhesive force, contact properties, storage stability and spray coating properties, characterized by comprising 60-95 mass % (in terms of solid content) of the chloroprene polymer latex (A), 5-40 mass % (in terms of solid content) of an acrylic resin latex (B) containing an acrylic polymer having a glass transition temperature of ?50 to 0° C., and 0.02-5 parts by mass (in terms of solid content), per 100 parts by mass (containing water) of the sum of said chloroprene polymer latex (A) and said acrylic resin latex (B), of a surfactant (C) represented by general formula (1): RO—(CH2CH2O)n—SO3M(1) wherein R represents an aliphatic alkyl group having 5 to 20 carbon atoms on average; M represents sodium or ammonium; and n (average) is from 2 to 60.

Abstract: An object of the present invention is to provide an adhesive resin composition which displays excellent adhesive strength on bonding to a barrier material, during initial adhesion, durable adhesion, and even after soak in fuel oil, and which also has excellent moldability. Furthermore, another object of the present is to provide an adhesive resin composition which when recycled, displays good compatible in a regrind layer with polyethylene resins and barrier materials such as saponified products of ethylene-vinyl acetate copolymers or polyamide based resins, and which is consequently capable of suppressing deterioration in the low temperature impact resistance of a multi-layer vessel containing a regrind layer.

Abstract: An object of the present invention is to provide an adhesive resin composition which displays excellent adhesive strength on bonding to a barrier material, during initial adhesion, durable adhesion, and even after soak in fuel oil, and which also has excellent moldability. Furthermore, another object of the present is to provide an adhesive resin composition which when recycled, displays good compatible in a regrind layer with polyethylene resins and barrier materials such as saponified products of ethylene-vinyl acetate copolymers or polyamide based resins, and which is consequently capable of suppressing deterioration in the low temperature impact resistance of a multi-layer vessel containing a regrind layer.

Abstract: An adhesive resin composition comprising: (A) At least one component selected from the group consisting of (i) polyolefins having a melt flow rate of 0.1 to 30 g/10 min and (ii) olefinic polymers having at least one functional group capable of reacting with an epoxy group; and (B) an epoxy compound having at least two epoxy groups in the molecule and having a number average molecular weight of 3000 or less, wherein the ratio of the component (B) to the total weight of the components (A) and (B) is 0.01 to 5% by weight, and a laminate of (a) a layer composed of the above-mentioned adhesive resin composition and a substrate contacted therewith.

Abstract: An adhesive resin composition comprising: