Patents by Inventor Naoki Nara

Naoki Nara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heterocyclic compound
    Patent number: 11986480
    Abstract: Provided is a novel compound or salt thereof that induces degradation by autophagy of an intracellular molecule. In this compound, a ligand having activity to bind to an intracellular molecule and a structure having activity to induce autophagy of an intracellular molecule are linked via a linker without loss of the activity of the ligand and the structure.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: May 21, 2024
    Assignee: TOHOKU UNIVERSITY
    Inventors: Hirokazu Arimoto, Kaori Itto, Daiki Takahashi, Nobuo Cho, Hiroshi Nara, Kenichiro Shimokawa, Taiichi Ohra, Shigekazu Sasaki, Naoki Ishii
  • Epoxy resin molding material for sealing use and semiconductor device
    Patent number: 7397139
    Abstract: An encapsulating epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the inorganic filler (C) has an average particle size of 12 ?m or less and a specific surface area of 3.0 m2/g or more.
    Type: Grant
    Filed: April 7, 2004
    Date of Patent: July 8, 2008
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Ryoichi Ikezawa, Naoki Nara, Hideyuki Chaki, Yoshihiro Mizukami, Yoshinori Endou, Takaki Kashihara, Fumio Furusawa, Masaki Yoshii, Shinsuke Hagiwara, Mitsuo Katayose
  • Epoxy resin molding material for sealing use and semiconductor device
    Publication number: 20060214153
    Abstract: 1. An encapsulating epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the inorganic filler (C) has an average particle size of 12 ?m or less and a specific surface area of 3.0 m2/g or more.
    Type: Application
    Filed: April 7, 2004
    Publication date: September 28, 2006
    Inventors: Ryoichi Ikezawa, Naoki Nara, Hideyuki Chaki, Yoshihiro Mizukami, Yoshinori Endou, Takaki Kashihara, Fumio Furusawa, Masaki Yoshii, Shinsuke Hagiwara, Mitsuo Katayose
  • Encapsulating material and LOC structure semiconductor device using the same
    Patent number: 6211277
    Abstract: An LOC structure semiconductor device having a good solder heat resistance without electrical characteristic failures due to damages to the passivation film and the diffusion layer thereunder attributing to the filler can be obtained by encapsulating an LOC structure semiconductor chip with an encapsulating material comprising an epoxy resin, a curing agent, a curing promoter, and an inorganic filler, the filler having a smaller particle size than the distance between a inner lead and a semiconductor chip and being in an amount of 80 to 95% by weight based on the total weight of the encapsulating material.
    Type: Grant
    Filed: October 2, 1998
    Date of Patent: April 3, 2001
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Tatsuo Kawata, Hiroki Sashima, Takaki Kashihara, Masanobu Fujii, Naoki Nara, Terumi Tsukahara, Hiroyuki Sakai
  • Epoxy resin composition for semiconductor sealing and resin molded type semiconductor device sealed with the epoxy resin composition
    Patent number: 6005030
    Abstract: An epoxy resin composition for semiconductor sealing, which comprises an epoxy resin, a curing agent and an inorganic filler, and has a J-value of 10 to 50, which is a maximum jetting flow value determined according to a method of evaluating jetting flow of epoxy resin composition.
    Type: Grant
    Filed: January 16, 1998
    Date of Patent: December 21, 1999
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Mitsuo Togawa, Kazuhiko Miyabayashi, Takahiro Horie, Naoki Nara