Abstract: The present invention is directed to provide novel laminates for wiring boards. Novel laminates for wiring boards according to the present invention includes an insulating substrate layer and copper wiring, the laminate having a circuit linearity of 1.0 or more and 1.7 or less.

Abstract: The present invention is directed to provide novel methods for manufacturing laminates. The method includes the steps of: bonding the insulating substrate layer and a copper component having protrusions on a surface thereof; transferring the protrusions to a surface of the insulating substrate layer by peeling off the copper component to form a seed layer; forming a resist on a predetermined area of a surface of the seed layer; plating, with copper, the surface of the seed layer in an area where the resist has not been layered to laminate the copper; removing the resist; and removing the seed layer that has been exposed by the removal of the resist.

Abstract: A method for manufacturing a forged article, capable of improving the durability of a die for forging is provided. The method, includes forging a steel material, by using a die, by spraying or applying a water-soluble polymer lubricant containing 0.01 to 0.98 mass % of a water-soluble sulfate onto a working surface of the die, the die being made of a raw material having a constituent composition of by mass %, of 0.4 to 0.7% of C, 1.0% or less of Si, 1.0% or less of Mn, 4.0 to 6.0% of Cr, 2.0 to 4.0% of (Mo+½W), 0.5 to 2.5% of (V+Nb), 0 to 1.0% of Ni, 0 to 5.0% of Co, 0.02% or less of N, and a remnant composed of Fe and impurities, and having hardness of 55 to 60 HRC, and the die including a nitrided layer or a nitrosulfidized layer on the working surface thereof.

Abstract: A program generating device comprising circuitry configured to: display a schedule screen, in which, for each of a plurality of processes executed in a system including a plurality of industrial devices, at least a name of a process is associated with a variable that is at least either referenced or changed in a process program representing an operation of one or more of the plurality of industrial devices and executed in the process, a plurality of names of the plurality of processes obtained from a process database that is stored as process information are included, and an execution order of the plurality of processes can be specified; receive a specification of the execution order on the schedule screen; and generate a system program based on the execution order and the variable of each process included in the execution order.

Abstract: [Problem] An object is to provide novel composite copper foils. [Means to solve the problem] A composite copper foil comprises a copper foil and a layer of metal other than copper, the metal layer being formed on at least a part of a surface of the copper foil, wherein at least a part of the composite copper foil has protrusions on a surface thereof, and each protrusion has a height of 10 nm or more but 1000 nm or less in a cross-section of the composite copper foil.

Abstract: The present invention is directed to provide novel composite copper components. For example, provided is a composite copper component including a copper oxide-containing layer formed on at least a portion of the surface of a copper component, in which when the surface of the composite copper component is bonded to a resin substrate by thermocompression, and the copper component is peeled off from the resin substrate after the thermocompression bonding, metal contained in the copper oxide-containing layer is transferred to the resin substrate.

Abstract: [Problem] An object is to provide novel composite copper foils. [Means to solve the problem] A composite copper foil comprises a copper foil and a layer of metal other than copper, the metal layer being formed on at least a part of a surface of the copper foil, wherein at least a part of the composite copper foil has protrusions on a surface thereof, and each protrusion has a height of 10 nm or more but 1000 nm or less in a cross-section of the composite copper foil.