Patents by Inventor Naoki Ogawa

Naoki Ogawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11981808
    Abstract: The purpose of the present invention is to provide a resin composition comprising a tungsten-based pigment, and which enables the achievement of high infrared absorption and good moldability, and a molded article and a fiber, each of which contains the resin composition. The present invention relates to an infrared absorbing resin composition comprising a tungsten-based infrared absorbing pigment and a polyethylene terephthalate, and wherein the polyethylene terephthalate is a crystalline copolymerized polyethylene terephthalate which has an intrinsic viscosity of 0.60 or more, and a molded article and a fiber, each of which contains this absorbing resin composition.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: May 14, 2024
    Assignee: KYODO PRINTING CO., LTD.
    Inventors: Naoki Ogawa, Fumihito Kobayashi, Wataru Yoshizumi, Kiyoshi Kitahara, Ryo Takigawa
  • Publication number: 20240043635
    Abstract: The present invention provides an LCP extruded film comprising a thermoplastic liquid crystal polymer and having a thickness of 15 ?m or more and 300 ?m or less, wherein coefficients of linear thermal expansion in a MD direction and a TD direction at 23 to 200° C. as measured by a TMA method according to JIS K7197 are each within a range of ?30 to 55 ppm/K, and the following conditions (A) and/or (B) are satisfied, and a method for manufacturing the same, an LCP extruded film for stretch treatment, an LCP stretched film, a heat-shrinkable LCP stretched film, an insulating material for a circuit substrate, and a metal foil-clad laminate: (A) a degree of orientation ?1(%) of a film surface S1 exposed and a degree of orientation ?2(%) of a film surface S2 located at a depth of 5 ?m from the film surface S1 satisfy a relationship of ?4.0?[(?2??1)/?1]×100?0.
    Type: Application
    Filed: December 7, 2021
    Publication date: February 8, 2024
    Applicant: Denka Company Limited
    Inventors: Yusuke MASUDA, Naoki OGAWA
  • Publication number: 20240025102
    Abstract: The present invention provides an LCP extruded film comprising a thermoplastic liquid crystal polymer and having a thickness of 15 ?m or more and 300 ?m or less, wherein coefficients of linear thermal expansion in a MD direction and a TD direction at 23 to 200° C. as measured by a TMA method according to JIS K7197 are each within a range of ?30 to 55 ppm/K, and the following conditions (A) and/or (B) are satisfied, and a method for manufacturing the same, an LCP extruded film for stretch treatment, an LCP stretched film, a heat-shrinkable LCP stretched film, an insulating material for a circuit substrate, and a metal foil-clad laminate: (A) a degree of orientation ?1 (%) of a film surface S1 exposed and a degree of orientation ?2 (%) of a film surface S2 located at a depth of 5 ?m from the film surface S1 satisfy a relationship of ?4.0?[(?2??1)/?1]×100?0.
    Type: Application
    Filed: October 2, 2023
    Publication date: January 25, 2024
    Applicant: Denka Company Limited
    Inventors: Yusuke MASUDA, Naoki OGAWA
  • Publication number: 20240032191
    Abstract: The present invention provides an LCP extruded film comprising a thermoplastic liquid crystal polymer and having a thickness of 15 ?m or more and 300 ?m or less, wherein coefficients of linear thermal expansion in a MD direction and a TD direction at 23 to 200° C. as measured by a TMA method according to JIS K7197 are each within a range of ?30 to 55 ppm/K, and the following conditions (A) and/or (B) are satisfied, and a method for manufacturing the same, an LCP extruded film for stretch treatment, an LCP stretched film, a heat-shrinkable LCP stretched film, an insulating material for a circuit substrate, and a metal foil-clad laminate: (A) a degree of orientation ?1(%) of a film surface S1 exposed and a degree of orientation ?2(%) of a film surface S2 located at a depth of 5 ?m from the film surface S1 satisfy a relationship of ?4.0?[(?2??1)/?1]×100?0.
    Type: Application
    Filed: October 2, 2023
    Publication date: January 25, 2024
    Applicant: Denka Company Limited
    Inventors: Yusuke MASUDA, Naoki OGAWA
  • Patent number: 11618958
    Abstract: A hydrogen-oxygen generation system includes an electrolytic cell configured to generate hydrogen and oxygen by electrolyzing water, and discharge the hydrogen and the oxygen as separate generated gasses. An accumulator includes a water storage chamber configured to store the water, and a gas chamber configured to receive a pressurized gas, and the water storage chamber and the gas chamber are separated from each other by an elastic body membrane. The accumulator is configured to transfer the water stored in the water storage chamber toward the electrolytic cell at a transfer pressure in accordance with a pressure of the pressurized gas in the gas chamber. A water supply unit is configured to supply the water to the water storage chamber, and a gas supply unit is configured to supply the pressurized gas to the gas chamber.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: April 4, 2023
    Assignees: MITSUBISHI HEAVY INDUSTRIES, LTD., JAPAN AEROSPACE EXPLORATION AGENCY, KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION
    Inventors: Atsuko Homma, Kenichi Nagamoto, Naoki Ogawa, Yuta Nakatsuchi, Hidehiko Tajima, Yusaku Nasu, Yoshitsugu Sone, Hiroshige Matsumoto
  • Patent number: 11599292
    Abstract: Scale-out of a controller and application migration consider the application status, laws and rules of a scale-out destination, and a resource usage status. If an operation status exceeds a threshold value, an administrative server for a computer system of a storage system calculates a first index for each execution target, including an application, a virtual machine, or a container operating in the computer system, based on information about cost, credibility, or performance when the execution target is migrated to, and caused to operate in, another computer system, and indexing information indicating laws or rules applied to the computer system using indexes. A second index indicating, as a dimensionless quantity, the selection degree of another computer system as a migration destination of the execution target is acquired. A migration destination of the execution target is decided from among other computer systems based on the first index and/or the second index.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: March 7, 2023
    Assignee: Hitachi, Ltd.
    Inventors: Naoki Ogawa, Nobuyoshi Sakai, Hibiki Saito
  • Patent number: 11594563
    Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: February 28, 2023
    Assignee: SONY CORPORATION
    Inventors: Atsushi Yamamoto, Shinji Miyazawa, Yutaka Ooka, Kensaku Maeda, Yusuke Moriya, Naoki Ogawa, Nobutoshi Fujii, Shunsuke Furuse, Masaya Nagata, Yuichi Yamamoto
  • Publication number: 20230052492
    Abstract: A display apparatus includes: a light-emitting device layer provided to extend over a plurality of pixels arranged two-dimensionally; a phosphor layer separated by a partition wall for each of the pixels; and a bonding structure sandwiched between the light-emitting device layer and the phosphor layer, and in which a first oxidation film, a bonding oxidation film, and a second oxidation film are stacked in order from the light-emitting device layer side.
    Type: Application
    Filed: January 26, 2021
    Publication date: February 16, 2023
    Inventor: NAOKI OGAWA
  • Publication number: 20220409655
    Abstract: The present invention relates to a platelet aggregating agent containing amorphous polyphosphate as an active ingredient, wherein the polyphosphate is a Ca salt of polyphosphate. The platelet aggregating agent acts on damaged gastrointestinal mucosa in inflammatory bowel disease and exerts a platelet aggregating action, thereby allowing remission/improvement of the inflammatory bowel disease.
    Type: Application
    Filed: January 7, 2021
    Publication date: December 29, 2022
    Inventors: Mikihiro FUJIYA, Hiroaki KONISHI, Hiroki TANAKA, Shotaro ISOZAKI, Yoshihiro OMACHI, Naoki OGAWA
  • Publication number: 20220418111
    Abstract: Provided is a method for manufacturing an LCP film for a circuit substrate capable of achieving an LCP film for a circuit substrate having a low coefficient of linear thermal expansion and excellent dimensional stability, without excessively impairing excellent basic performance possessed by the liquid crystal polyester, such as mechanical characteristics, electrical characteristics, and heat resistance.
    Type: Application
    Filed: November 20, 2020
    Publication date: December 29, 2022
    Applicant: Denka Company Limited
    Inventors: Naoki OGAWA, Yusuke MASUDA
  • Publication number: 20220317911
    Abstract: Scale-out of a controller and application migration consider the application status, laws and rules of a scale-out destination, and a resource usage status. If an operation status exceeds a threshold value, an administrative server for a computer system of a storage system calculates a first index for each execution target, including an application, a virtual machine, or a container operating in the computer system, based on information about cost, credibility, or performance when the execution target is migrated to, and caused to operate in, another computer system, and indexing information indicating laws or rules applied to the computer system using indexes. A second index indicating, as a dimensionless quantity, the selection degree of another computer system as a migration destination of the execution target is acquired. A migration destination of the execution taget is decided from among other computer systems based on the first index and/or the second index.
    Type: Application
    Filed: September 13, 2021
    Publication date: October 6, 2022
    Inventors: Naoki OGAWA, Nobuyoshi SAKAI, Hibiki SAITO
  • Patent number: 11437350
    Abstract: A semiconductor device includes a plurality of memory chips laminated to each other, each of the memory chips include a first transmission/reception coil for communication by means of inductive coupling; first lead-out lines led out from both ends of the first transmission/reception coil; and a first transmission/reception circuit, which is connected to the first lead-out lines, and which inputs/outputs signals to/from the first transmission/reception coil.
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: September 6, 2022
    Assignee: ULTRAMEMORY INC.
    Inventors: Naoki Ogawa, Toshitugu Ueda, Kazuo Yamaguchi
  • Publication number: 20220250371
    Abstract: Provided is an LCP extruded film that can increase process tolerance in manufacture of a flexible laminate, without excessively impairing the basic performance of the liquid crystal polymer. Provided are an LCP extruded film and the like that allow a flexible laminate having high peel strength to a metal foil to be easily obtained under mild manufacturing conditions as compared with the prior art. An LCP extruded film 11 comprising: an aromatic polyester-based liquid crystal polymer at least having at least one selected from the group consisting of para-hydroxybenzoic acid, terephthalic acid, isophthalic acid, 6-naphthalenedicarboxylic acid, 4,4?-biphenol, bisphenol A, hydroquinone, 4,4-dihydroxybiphenol, ethylene terephthalate and derivatives thereof, and 6-hydroxy-2-naphthoic acid and derivatives thereof, as monomer components, the LCP extruded film having a dissolution rate in pentafluorophenol at 60° C. of 25% or more.
    Type: Application
    Filed: June 19, 2020
    Publication date: August 11, 2022
    Applicant: Denka Company Limited
    Inventors: Naoki OGAWA, Yusuke MASUDA
  • Publication number: 20220204376
    Abstract: The object is to provide a wastewater treatment method and a wastewater treatment system that reduce the total selenium concentration of treated water while reducing cost compared to conventional methods of removing selenium by oxidation. In the wastewater treatment method according to the present disclosure, an iron agent is added to waste water containing selenium and cyanogen to form a first coagulated substance, the first coagulated substance is removed by solid-liquid separation to obtain first treated water, a second iron agent is added to the first treated water, an acid is added to the first treated water to obtain acidic water, an oxidizing agent is added to the acidic water to oxidize the selenium, a coagulant is then added to form a second coagulated substance, and the second coagulated substance is removed by solid-liquid separation to obtain second treated water.
    Type: Application
    Filed: March 11, 2020
    Publication date: June 30, 2022
    Applicant: MITSUBISHI POWER ENVIRONMENTAL SOLUTIONS, LTD.
    Inventors: Takashi Tai, Masaaki Anzai, Naoki Ogawa, Ryosuke Uehara
  • Publication number: 20220157873
    Abstract: A semiconductor device includes a first semiconductor substrate in which a pixel region where pixel portions performing photoelectric conversion are two-dimensionally arranged is formed and a second semiconductor substrate in which a logic circuit processing a pixel signal output from the pixel portion is formed, the first and second semiconductor substrates being laminated. A protective substrate protecting an on-chip lens is disposed on the on-chip lens in the pixel region of the first semiconductor substrate with a sealing resin interposed therebetween.
    Type: Application
    Filed: February 2, 2022
    Publication date: May 19, 2022
    Applicant: SONY GROUP CORPORATION
    Inventors: Naoki KOMAI, Naoto SASAKI, Naoki OGAWA, Takashi OINOUE, Hayato IWAMOTO, Yutaka OOKA, Masaya NAGATA
  • Publication number: 20210355590
    Abstract: A hydrogen-oxygen generation system includes an electrolytic cell configured to generate hydrogen and oxygen by electrolyzing supplied water, and to discharge the generated hydrogen and oxygen as separate generated gasses. An accumulator includes a water storage chamber in which water is stored, and a gas chamber to which pressurized gas is supplied, and the water storage chamber and the gas chamber are separated from each other by an elastic body membrane. The accumulator is configured to transfer water stored in the water storage chamber toward the electrolytic cell at a transfer pressure in accordance with the pressure of the pressurized gas in the gas chamber. A water supply unit is configured to supply water to the water storage chamber, and a gas supply unit is configured to supply the pressurized gas to the gas chamber.
    Type: Application
    Filed: October 24, 2019
    Publication date: November 18, 2021
    Inventors: Atsuko HOMMA, Kenichi NAGAMOTO, Naoki OGAWA, Yuta NAKATSUCHI, Hidehiko TAJIMA, Yusaku NASU, Yoshitsugu SONE, Hiroshige MATSUMOTO
  • Publication number: 20210305300
    Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.
    Type: Application
    Filed: January 8, 2021
    Publication date: September 30, 2021
    Applicant: SONY CORPORATION
    Inventors: Atsushi YAMAMOTO, Shinji MIYAZAWA, Yutaka OOKA, Kensaku MAEDA, Yusuke MORIYA, Naoki OGAWA, Nobutoshi FUJII, Shunsuke FURUSE, Masaya NAGATA, Yuichi YAMAMOTO
  • Patent number: 11117450
    Abstract: A vehicle windshield includes a window plate and an anti-fogging film provided on an interior side surface of the window plate, with a first region and a second region within a see-through region. The anti-fogging film is not on the first region but on the second region. The first region includes a belt-like region in an upper portion of the see-through region. The second region is a region that includes at least a test area B and that includes a continuous projection portion provided on an upper side. The anti-fogging film in the second region has a minimum film thickness of no less than 5 ?m. At least a boundary between the first region and the second region excluding the projection portion has no perspective distortion and is formed by a boundary line having a linewidth of 10-200 ?m that is visually recognized by scattering of incoming light.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: September 14, 2021
    Assignee: AGC INC.
    Inventors: Tetsuji Irie, Nana Sato, Kazuhiko Kawasaki, Hideyuki Saito, Naoki Ogawa
  • Patent number: 11090723
    Abstract: This support member for additive manufacturing is a support to be disposed below a manufactured portion of a particular overhanging portion of the three-dimensional object which needs the support in the process of additively manufacturing the three-dimensional object. The support member is provided with: the support main body; and a polishing channel which is formed in the support main body so as not to be exposed to an interface with the three-dimensional object, and through which a polisher for polishing and removing the support main body is allowed to pass.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: August 17, 2021
    Assignee: MITSUISHI HEAVY INDUSTRIES, LTD.
    Inventors: Keisuke Kamitani, Naoki Ogawa, Kazunori Kuga, Hiroaki Kyuno
  • Patent number: 11024658
    Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: June 1, 2021
    Assignee: SONY CORPORATION
    Inventors: Atsushi Yamamoto, Shinji Miyazawa, Yutaka Ooka, Kensaku Maeda, Yusuke Moriya, Naoki Ogawa, Nobutoshi Fujii, Shunsuke Furuse, Masaya Nagata, Yuichi Yamamoto