Patents by Inventor Naoki Ohara
Naoki Ohara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10437211Abstract: A simulation system includes a control device for controlling a control object; and an information processing device configured to exchange data with the control device. The control device includes a computation unit configured to execute sequence control and motion control of the control object; and an output unit configured to output a fixed interval of data related to the sequence control and the motion control of the object.Type: GrantFiled: May 26, 2015Date of Patent: October 8, 2019Assignee: OMRON CorporationInventors: Katsuhisa Furuta, Katsuji Takeshita, Naoki Ohara
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Publication number: 20150338834Abstract: A simulation system includes a control device for controlling a control object; and an information processing device configured to exchange data with the control device. The control device includes a computation unit configured to execute sequence control and motion control of the control object; and an output unit configured to output a fixed interval of data related to the sequence control and the motion control of the object.Type: ApplicationFiled: May 26, 2015Publication date: November 26, 2015Inventors: Katsuhisa FURUTA, Katsuji TAKESHITA, Naoki OHARA
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Patent number: 8354121Abstract: It is intended to provide a preparation for percutaneous administration of 2-(4-ethyl-1-piperazinyl)-4-(4-fluoro-phenyl)-5,6,7,8,9,10-hexahydrocycloocta[b]pyridine (Compound A), which inhibits the generation of a metabolite and is capable of continuously maintaining a blood drug level. Specifically, a tape preparation comprising an adhesive layer formed on one surface of a support, characterized in that the adhesive layer contains (1) Compound A or a physiologically acceptable acid addition salt thereof, and (2) an acrylic adhesive, or (1) Compound A or a physiologically acceptable acid addition salt thereof, (2) an acrylic adhesive, and (3) a permeation enhancer is provided.Type: GrantFiled: June 7, 2007Date of Patent: January 15, 2013Assignee: Dainippon Sumitomo Pharma Co., Ltd.Inventors: Hiroo Maeda, Naoki Ohara
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Patent number: 8211683Abstract: There is provided a process for industrial production of simple 3-carboxy-cis,cis-muconic acid and/or 3-carboxymuconolactone from low molecular mixtures derived from plant components such as vanillin, vanillic acid and protocatechuic acid, via a multistage enzyme reaction. A recombinant plasmid containing a vanillate demethylase gene (vanAB genes), benzaldehyde dehydrogenase gene (ligV gene) and protocatechuate 3,4-dioxygenase gene (pcaHG genes); transformants incorporating the plasmid; and a process for production of 3-carboxy-cis,cis-muconic acid and/or 3-carboxymuconolactone characterized by culturing the transformants in the presence of vanillin, vanillic acid, protocatechuic acid or a mixture of two or more thereof.Type: GrantFiled: August 10, 2007Date of Patent: July 3, 2012Assignees: Kabushiki Kaisha Toyota Jidoshokki, National University Corporation, Tokyo University of Agriculture and Technology, Nagoya University of Technology, Forestry and Forest Products Research InstituteInventors: Kohei Mase, Toshihisa Shimo, Naoki Ohara, Yoshihiro Katayama, Kiyotaka Shigehara, Eiji Masai, Masao Fukuda, Seiji Ohara, Masaya Nakamura, Yuichiro Otsuka
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Patent number: 8105935Abstract: A method of manufacturing a semiconductor device includes forming a first insulating film over a semiconductor substrate, forming a trench in the first insulating film, forming a metal interconnect in the trench, exposing the surface of the metal interconnect to a silicon-containing gas, performing a plasma treatment of the surface of the metal interconnect after exposing to the silicon-containing gas, and forming a second insulating film over the metal interconnect.Type: GrantFiled: March 19, 2008Date of Patent: January 31, 2012Assignee: Fujitsu Semiconductor LimitedInventors: Naoki Ohara, Hirofumi Watatani, Tamotsu Owada, Kenichi Yanai
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Publication number: 20110319640Abstract: To provide an industrial purification method of PDC obtained by fermentative production. A method of purifying 2-pyrone-4,6-dicarboxylic acid which comprises including a salt of monovalent to tetravalent cations in a fermentation liquid containing microbially-produced 2-pyrone-4,6-dicarboxylic acid; and a method of purifying 2-pyrone-4,6-dicarboxylic acid which method comprises extracting 2-pyrone-4,6-dicarboxylic acid from a fermentation liquid containing microbially-produced 2-pyrone-4,6-dicarboxylic acid without forming 2-pyrone-4,6-dicarboxylate.Type: ApplicationFiled: January 30, 2008Publication date: December 29, 2011Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKIInventors: Kohei Mase, Toshihisa Shimo, Naoki Ohara, Yoshihiro Katayama, Kiyotaka Shigehara, Yusuke Yamamoto, Hitotoshi Murase
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Publication number: 20100075388Abstract: There is provided a process for industrial production of simple 3-carboxy-cis,cis-muconic acid and/or 3-carboxymuconolactone from low molecular mixtures derived from plant components such as vanillin, vanillic acid and protocatechuic acid, via a multistage enzyme reaction. A recombinant plasmid containing a vanillate demethylase gene (vanAB genes), benzaldehyde dehydrogenase gene (ligV gene) and protocatechuate 3,4-dioxygenase gene (pcaHG genes); transformants incorporating the plasmid; and a process for production of 3-carboxy-cis,cis-muconic acid and/or 3-carboxymuconolactone characterized by culturing the transformants in the presence of vanillin, vanillic acid, protocatechuic acid or a mixture of two or more thereof.Type: ApplicationFiled: August 10, 2007Publication date: March 25, 2010Inventors: Kohei Mase, Toshihisa Shimo, Naoki Ohara, Yoshihiro Katayama, Kiyotaka Shigehara, Eiji Masai, Masao Fukuda, Seiji Ohara, Masaya Nakamura, Yuichiro Otsuka
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Publication number: 20100048859Abstract: A polyester containing a biomass-derived material in a repeating unit structure and having all of sufficient mechanical strength, easy mold processability into a molded product such as fiber or film, and biodegradability, is provided. A PDC-L-lactic acid copolyester represented by the following formula: —[R1—PDC]x—[OCH(CH3)CO]1-x—??(I) [wherein PDC is a dicarboxylic acid residue represented by the following formula (II): R1 is selected from —O(CH2)nO—, —O(CH2CH2O)m— and —O[CH(CH3)CH2O]m—, where n represents an integer of 3 to 6 and m represents an integer of 1 to 4; and is 0.005?x?0.2 when n?4 or m?2, and is 0.005?x?0.4 in other cases]; and a molded product containing the PDC-L-lactic acid copolyester.Type: ApplicationFiled: April 17, 2007Publication date: February 25, 2010Inventors: Kohei Mase, Toshihisa Shimo, Naoki Ohara, Kiyotaka Shigehara, Yoshihiro Katayama
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Patent number: 7655577Abstract: A method for forming a silicon-containing insulation film on a substrate by plasma polymerization includes: introducing a reaction gas comprising (i) a source gas comprising a silicon-containing hydrocarbon cyclic compound containing at least one vinyl group (Si-vinyl compound), and (ii) an additive gas, into a reaction chamber where a substrate is placed; and applying radio-frequency power to the gas to cause plasma polymerization, thereby depositing an insulation film on the substrate.Type: GrantFiled: October 19, 2006Date of Patent: February 2, 2010Assignee: ASM Japan K.K.Inventors: Yasuyoshi Hyodo, Nobuo Matsuki, Masashi Yamaguchi, Atsuki Fukazawa, Naoki Ohara, Yijun Liu
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Publication number: 20090169605Abstract: It is intended to provide a preparation for percutaneous administration of 2-(4-ethyl-1-piperazinyl)-4-(4-fluoro-phenyl)-5,6,7,8,9,10-hexahydrocycloocta[b]pyridine (Compound A), which inhibits the generation of a metabolite and is capable of continuously maintaining a blood drug level. Specifically, a tape preparation comprising an adhesive layer formed on one surface of a support, characterized in that the adhesive layer contains (1) Compound A or a physiologically acceptable acid addition salt thereof, and (2) an acrylic adhesive, or (1) Compound A or a physiologically acceptable acid addition salt thereof, (2) an acrylic adhesive, and (3) a permeation enhancer is provided.Type: ApplicationFiled: June 7, 2007Publication date: July 2, 2009Inventors: Hiroo Maeda, Naoki Ohara
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Publication number: 20080233734Abstract: A method of manufacturing a semiconductor device includes forming a first insulating film over a semiconductor substrate, forming a trench in the first insulating film, forming a metal interconnect in the trench, exposing the surface of the metal interconnect to a silicon-containing gas, performing a plasma treatment of the surface of the metal interconnect after exposing to the silicon-containing gas, and forming a second insulating film over the metal interconnect.Type: ApplicationFiled: March 19, 2008Publication date: September 25, 2008Applicant: FUJITSU LIMITEDInventors: Naoki OHARA, Hirofumi WATATANI, Tamotsu OWADA, Kenichi YANAI
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Patent number: 7354852Abstract: A multilayer interconnection structure is formed by a method comprising the steps of: Forming a low dielectric constant film on a substrate, curing the low dielectric constant film by irradiating it with UV light, laminating a UV blocking film, laminating a next low dielectric constant film, and curing the next low dielectric constant film by irradiating it with UV light.Type: GrantFiled: December 2, 2005Date of Patent: April 8, 2008Assignee: ASM Japan K.K.Inventors: Kiyohiro Matsushita, Naoki Ohara, Nathan R. C. Kemeling
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Publication number: 20080057717Abstract: A semiconductor device manufacturing method that includes depositing a first insulating film on a semiconductor substrate, etching a part of the first insulating film, and performing UV irradiation to the first insulating film.Type: ApplicationFiled: August 23, 2007Publication date: March 6, 2008Applicant: FUJITSU LIMITEDInventors: Tamotsu OWADA, Hirofumi WATATANI, Shirou OZAKI, Hisaya SAKAI, Kenichi YANAI, Naoki OHARA, Tadahiro IMADA, Yoshihiro NAKATA
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Publication number: 20070254887Abstract: A pharmaceutical composition for transdermal administration comprising perospirone of the formula (1): or a pharmaceutically acceptable acid addition salt thereof, which can inhibit the generation of metabolites and continuously maintain the blood level of perospirone.Type: ApplicationFiled: September 2, 2005Publication date: November 1, 2007Inventors: Hiroo Maeda, Naoki Ohara, Yuki Ikeda
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Publication number: 20070111540Abstract: A method for forming a silicon-containing insulation film on a substrate by plasma polymerization includes: introducing a reaction gas comprising (i) a source gas comprising a silicon-containing hydrocarbon cyclic compound containing at least one vinyl group (Si-vinyl compound), and (ii) an additive gas, into a reaction chamber where a substrate is placed; and applying radio-frequency power to the gas to cause plasma polymerization, thereby depositing an insulation film on the substrate.Type: ApplicationFiled: October 19, 2006Publication date: May 17, 2007Applicant: ASM JAPAN K.K.Inventors: Yasuyoshi HYODO, Nobuo MATSUKI, Masashi YAMAGUCHI, Atsuki FUKAZAWA, Naoki OHARA, Yijun LIU
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Publication number: 20070066086Abstract: A method for forming a silicon-containing insulation film on a substrate by plasma polymerization includes: introducing a reaction gas comprising (i) a source gas consisting of a silicon-containing hydrocarbon linear compound containing at least one vinyl group (Si-vinyl compound), and (ii) an additive gas, into a reaction chamber where a substrate is placed; and applying radio-frequency power to the gas to cause plasma polymerization, thereby depositing an insulation film on the substrate.Type: ApplicationFiled: October 19, 2006Publication date: March 22, 2007Applicant: ASM JAPAN K.K.Inventors: Yasuyoshi HYODO, Nobuo MATSUKI, Masashi YAMAGUCHI, Atsuki FUKAZAWA, Naoki OHARA, Yijun LIU
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Publication number: 20060286306Abstract: A method of treating a low-dielectric constant film includes: depositing a low-dielectric constant film on a substrate, which is structured by Si—C bond and has a first leakage current; and emitting ultraviolet (UV) light to the film until the film has a second leakage current which is ½ or less of the first leakage current.Type: ApplicationFiled: June 17, 2005Publication date: December 21, 2006Applicant: ASM JAPAN K.K.Inventors: Naoki Ohara, Atsuki Fukazawa
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Patent number: 7148154Abstract: A silicon-containing insulation film is formed on a substrate by plasma polymerization by introducing a reaction gas comprising (i) a source gas comprising a silicon-containing hydrocarbon compound containing at least one vinyl group (Si-vinyl compound), and (ii) an additive gas, into a reaction chamber where a substrate is placed; and applying radio-frequency power to the gas to cause plasma polymerization, thereby depositing an insulation film on the substrate.Type: GrantFiled: August 20, 2003Date of Patent: December 12, 2006Assignee: ASM Japan K.K.Inventors: Yasuyoshi Hyodo, Nobuo Matsuki, Masashi Yamaguchi, Atsuki Fukazawa, Naoki Ohara, Yijun Liu
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Publication number: 20060165904Abstract: An apparatus for treating a semiconductor substrate includes a chamber an internal pressure of which can be controlled from a vacuum to the vicinity of an atmospheric pressure, multiple ultraviolet light emitters provided inside the chamber, a heater provided facing and parallel to the emitters inside the chamber, and a filter being disposed between the emitters and the heater and used for uniformizing the intensity of illumination of ultraviolet light; and further includes a configuration for uniformly distributing the intensity of illumination of ultraviolet light emitted from the emitters onto a surface of the heater.Type: ApplicationFiled: January 21, 2005Publication date: July 27, 2006Applicant: ASM JAPAN K.K.Inventor: Naoki Ohara
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Publication number: 20060160352Abstract: A multilayer interconnection structure is formed by a method comprising the steps of: Forming a low dielectric constant film on a substrate, curing the low dielectric constant film by irradiating it with UV light, laminating a UV blocking film, laminating a next low dielectric constant film, and curing the next low dielectric constant film by irradiating it with UV light.Type: ApplicationFiled: December 2, 2005Publication date: July 20, 2006Applicant: ASM JAPAN K.K.Inventors: Kiyohiro Matsushita, Naoki Ohara, Nathan Kemeling