Abstract: In an embodiment of an optical coupling type semiconductor device according to the present invention, in an optical coupling type semiconductor device that is provided with lead frames on which a light emitting element and a light receiving element have been respectively separately mounted and a resin sealing member that seals the light emitting element and the light receiving element, a plurality of protrusion portions are formed on the lead frames.

Abstract: A photocoupler device includes a light-emitting chip, a light-receiving chip, a light-emitting side lead frame for individually holding the light emitting chip and a light-receiving side lead frame for individually holding the light-receiving chip. The light-emitting and light-receiving chips are opposed to each other so as to be optically coupled and covered with a light-transmissive resin as a first molding layer, in the whole part except in the outside connecting terminal portions of the two lead frames. The first molding layer is further covered with an opaque resin as a second molding layer. In such a photocoupler device, the light-transmissive resin is made to contain fillers in an amount of 80% by weight or more and directly cover the light-emitting chip, without needing silicone-resin coating for protecting the light-emitting chip.

Abstract: A resin for sealing a compound semiconductor is here disclosed which contains, as a matrix, a siloxane compound for producing a silicone resin by addition reaction and which has a group comprising the bond of an organic group and an oxy group. The group comprising the bond of the organic group and the oxy group bonds to a terminal of the molecule of the siloxane compound, and as this group comprising the bond, 0.1 to 10% by weight, preferably 0.1 to 1.5% by weight of an alkoxy group (--OR') is used. A compound semiconductor chip is covered with the resin for sealing the compound semiconductor and then reacted under predetermined conditions to produce a silicone resin and simultaneously to chemically bond a siloxane group (--Si--O--) in the silicone resin to an element in a portion of the compound semiconductor chip which comes in contact with the silicone resin.