Patents by Inventor Naoki Seto

Naoki Seto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260305436
    Abstract: According to an embodiment, a mounting head includes a collet having at least one suction hole at a contact surface configured to be in contact with a semiconductor electronic component so that the semiconductor electronic component is curved, and a supporting unit supporting the collet so that the contact surface of the collet is exposed. The supporting unit is configured to supply a gas toward a substrate from outside the contact surface of the collet. The supporting unit may have at least one gas-supplying hole for supplying the gas.
    Type: Application
    Filed: March 10, 2026
    Publication date: October 1, 2026
    Applicant: SHIBAURA MECHATRONICS CORPORATION
    Inventors: Takuya OHE, Toshifumi OKAWARA, Naoki SETO, Kyota KUROIWA
  • Publication number: 20260299423
    Abstract: According to an embodiment, a UV light irradiation apparatus for irradiating UV light onto a resin film having multiple electronic components adhered to a first surface of the resin film includes a support stage for supporting the resin film; a light source portion irradiating UV light onto a second surface of the resin film opposite the first surface; and a mask portion disposed between the resin film and the light source portion and shielding a part of the UV light.
    Type: Application
    Filed: March 25, 2026
    Publication date: October 1, 2026
    Applicant: SHIBAURA MECHATRONICS CORPORATION
    Inventors: Naoki SETO, Kyota KUROIWA, Takuya OHE
  • Publication number: 20260279756
    Abstract: According to an embodiment, a UV light irradiation apparatus is an apparatus for irradiating UV light onto a resin film with multiple electronic components adhered to a first surface of the resin film. The UV light irradiation apparatus includes a support stage for supporting the resin film; a gas supply portion for supplying inert gas from a gas discharge portion facing the support stage to the first surface of the resin film; and a light source portion irradiating UV light onto a second surface of the resin film opposite the first surface.
    Type: Application
    Filed: February 24, 2026
    Publication date: September 17, 2026
    Applicant: SHIBAURA MECHATRONICS CORPORATION
    Inventors: Naoki SETO, Takuya OHE, Kyota KUROIWA
  • Patent number: 12698922
    Abstract: A heat source unit includes: a bottom plate having a wave-like shape including a series of alternating ridge and groove portions; and a pair of support legs located at opposite end portions of the bottom plate, between which the ridge and groove portions extend, the pair of support legs being configured to support the opposite end portions. Each of the support legs has a support portion on which an end portion of the bottom plate is placed, and a wall portion extending upward from the support portion. On an upper surface of the support portion, a recessed portion is formed at a connection part of the wall portion and the support portion. The bottom plate is installed so that an end portion of the bottom plate, to which the ridge and groove portions extend, passes over the recessed portion and abuts against a wall surface of the wall portion.
    Type: Grant
    Filed: April 25, 2022
    Date of Patent: August 4, 2026
    Assignee: Mitsubishi Electric Corporation
    Inventors: Naoki Seto, Yu Tamaki
  • Publication number: 20260026290
    Abstract: A buffer apparatus, a preprocessing apparatus, a mounting apparatus, a preprocessing method and a mounting method that can reduce bonding failure due to time elapsed from preprocessing of an electronic component and a mounting board to a bonding process. The buffer apparatus of the present embodiment includes a storage 161 that stores a component supply body TW that is a workpiece which is a wafer W diced into an electronic component E attached on a tape T attached to a ring R, and a mounting board BW that is a workpiece on which the electronic component E released from the component supply body TW is mounted after surface processing and/or a cleaning process; a chamber 162 that houses the storage 161; and a storage adjustment unit 163 that adjusts temperature, humidity, and pressure of gas inside the storage 161 independently from the chamber 162.
    Type: Application
    Filed: September 30, 2025
    Publication date: January 22, 2026
    Inventors: Toshifumi OKAWARA, Naoki SETO
  • Patent number: 12522159
    Abstract: A wire harness for routing in a vehicle in which an exhaust pipe through which exhaust gas flows is attached under a floor, the wire harness including: a first wire to be routed alongside the exhaust pipe; and a second wire to be routed on an opposite side of the first wire to the exhaust pipe, wherein the first wire has: a conductor and an insulation coating covering an outer periphery of the conductor, and a metal tube housing the conductor and the insulation coating.
    Type: Grant
    Filed: July 26, 2024
    Date of Patent: January 13, 2026
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Yuji Tanaka, Naoki Seto
  • Publication number: 20250155157
    Abstract: A heat source unit includes: a bottom plate having a wave-like shape including a series of alternating ridge and groove portions; and a pair of support legs located at opposite end portions of the bottom plate, between which the ridge and groove portions extend, the pair of support legs being configured to support the opposite end portions. Each of the support legs has a support portion on which an end portion of the bottom plate is placed, and a wall portion extending upward from the support portion. On an upper surface of the support portion, a recessed portion is formed at a connection part of the wall portion and the support portion. The bottom plate is installed so that an end portion of the bottom plate, to which the ridge and groove portions extend, passes over the recessed portion and abuts against a wall surface of the wall portion.
    Type: Application
    Filed: April 25, 2022
    Publication date: May 15, 2025
    Inventors: Naoki SETO, Yu TAMAKI
  • Publication number: 20240383414
    Abstract: A wire harness for routing in a vehicle in which an exhaust pipe through which exhaust gas flows is attached under a floor, the wire harness including: a first wire to be routed alongside the exhaust pipe; and a second wire to be routed on an opposite side of the first wire to the exhaust pipe, wherein the first wire has: a conductor and an insulation coating covering an outer periphery of the conductor, and a metal tube housing the conductor and the insulation coating.
    Type: Application
    Filed: July 26, 2024
    Publication date: November 21, 2024
    Applicant: Sumitomo Wiring Systems, Ltd.
    Inventors: Yuji TANAKA, Naoki SETO
  • Patent number: 12106871
    Abstract: A wire harness for routing in a vehicle in which a pipe through which a liquid flows is attached under a floor, the wire harness including: a first wire to be routed alongside the pipe; and a second wire to be routed in between the first wire and the pipe, and fixed to both the first wire and the pipe, wherein the second wire has: a first section extending along the first wire; and a second section extending along the pipe at a position spaced further from the first wire than is the first section in a direction in which the pipe and the first wire are arranged alongside each other.
    Type: Grant
    Filed: January 19, 2021
    Date of Patent: October 1, 2024
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Yuji Tanaka, Naoki Seto
  • Patent number: 12077108
    Abstract: A wire harness for routing in a vehicle in which an exhaust pipe through which exhaust gas flows is attached under a floor, the wire harness including: a first wire to be routed alongside the exhaust pipe; and a second wire to be routed on an opposite side of the first wire to the exhaust pipe, wherein the first wire has: a conductor and an insulation coating covering an outer periphery of the conductor; and a metal tube housing the conductor and the insulation coating.
    Type: Grant
    Filed: January 19, 2021
    Date of Patent: September 3, 2024
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Yuji Tanaka, Naoki Seto
  • Publication number: 20230084894
    Abstract: A wire harness for routing in a vehicle in which a pipe through which a liquid flows is attached under a floor, the wire harness including: a first wire to be routed alongside the pipe; and a second wire to be routed in between the first wire and the pipe, and fixed to both the first wire and the pipe, wherein the second wire has: a first section extending along the first wire; and a second section extending along the pipe at a position spaced further from the first wire than is the first section in a direction in which the pipe and the first wire are arranged alongside each other.
    Type: Application
    Filed: January 19, 2021
    Publication date: March 16, 2023
    Applicant: SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Yuji TANAKA, Naoki SETO
  • Publication number: 20230083731
    Abstract: A wire harness for routing in a vehicle in which an exhaust pipe through which exhaust gas flows is attached under a floor, the wire harness including: a first wire to be routed alongside the exhaust pipe; and a second wire to be routed on an opposite side of the first wire to the exhaust pipe, wherein the first wire has: a conductor and an insulation coating covering an outer periphery of the conductor; and a metal tube housing the conductor and the insulation coating.
    Type: Application
    Filed: January 19, 2021
    Publication date: March 16, 2023
    Applicant: SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Yuji TANAKA, Naoki SETO
  • Publication number: 20230055039
    Abstract: A wire harness for routing in a vehicle in which a pipe through which a liquid flows is attached under a floor, the wire harness including: a first wire to be routed alongside the pipe; and a second wire to be routed in between the first wire and the pipe, wherein: the second wire has: a conductor having a rigidity capable of holding a shape thereof; an insulation coating covering an outer periphery of the conductor; a first section extending along the first wire; a second section extending along the pipe at a position spaced further from the first wire than is the first section in a direction in which the pipe and the first wire are arranged alongside each other; and a third section extending between the first section and the second section, and the conductor extends to include the third section.
    Type: Application
    Filed: January 19, 2021
    Publication date: February 23, 2023
    Applicant: SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Yuji TANAKA, Naoki SETO
  • Publication number: 20230059037
    Abstract: A wire harness for routing in a vehicle in which a pipe through which a liquid flows is attached under a floor, the wire harness including: a first wire to be routed alongside the pipe; and a second wire to be routed in between the first wire and the pipe, wherein the second wire has: a conductor formed by a plurality of conductive wire strands twisted together; a metal tube housing the conductor; a first section extending along the first wire; a second section extending along the pipe at a position spaced further from the first wire than is the first section in a direction in which the pipe and the first wire are arranged alongside each other; and a third section extending between the first section and the second section, and the tube extends to include the third section.
    Type: Application
    Filed: January 19, 2021
    Publication date: February 23, 2023
    Applicant: SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Yuji TANAKA, Naoki SETO
  • Patent number: D647525
    Type: Grant
    Filed: November 16, 2010
    Date of Patent: October 25, 2011
    Assignee: Kabushiki Kaisha Buffalo
    Inventor: Naoki Seto
  • Patent number: D678258
    Type: Grant
    Filed: November 16, 2010
    Date of Patent: March 19, 2013
    Assignee: Kabushiki Kaisha Buffalo
    Inventor: Naoki Seto