Abstract: A semiconductor laser module comprises a semiconductor laser device, an optical fiber, and a lens for coupling light emitted from the semiconductor laser device to the optical fiber. There is provided a metal base having a flat portion and a pipe portion in a metal case. The semiconductor laser device is mounted on a chip carrier which is mounted on the flat portion of the metal base. The lens is fixed in the inside of the pipe portion of the metal base. The optical fiber is protected at one end by a ferrule which is fixed to the pipe portion of the metal base. A device such as a monitor photodiode and a thermistor may be mounted on the flat portion of the metal base. The flat portion of the metal base may be formed with a concave portion of an area smaller than an area of the bottom of the chip carrier.

Abstract: A dual-inline-package semiconductor laser package incorporating a temperature controlling Peltier element and housed in a box shape metal case having a window glass includes: the metal case having a window glass which is hermetically sealed in a side wall portion thereof; a substrate fixed on the Peltier element which is fixed in the metal case; a semiconductor laser fixed on the substrate through a chip carrier; a first lens, a light-detecting element, and a thermister fixed on the substrate; a second lens supported by a holder; an optical fiber, a portion near the distal end of which is protected by a metal sleeve; and a slide ring having an inner diameter slightly larger than an outer diameter of the metal sleeve. A side wall around the window glass of the case is bonded to the holder, the holder is bonded to the slide ring, and the slide ring is bonded to the metal sleeve.