Patents by Inventor Naoki Takojima

Naoki Takojima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11735703
    Abstract: A light emitting device, according to the present embodiment, has a light emitting panel, a flexible wiring substrate, a mold resin and a protective tape. The light emitting panel has a first substrate, which is transparent to light, a plurality of conductor patterns, which are formed on a surface of the first substrate, a plurality of light emitting elements, which are connected to any of the conductor patterns, and a resin layer, which holds the light emitting elements on the first substrate. The flexible wiring substrate has a circuit pattern that is electrically connected with an exposed part of the conductor patterns. The mold resin covers the exposed part of the conductor patterns and an exposed part of the circuit pattern. The protective tape covers the mold resin, and is wound around a joint part of the light emitting panel and the flexible wiring substrate.
    Type: Grant
    Filed: October 27, 2021
    Date of Patent: August 22, 2023
    Assignee: NICHIA CORPORATION
    Inventors: Naoki Takojima, Kairi Makita, Fumio Ueno
  • Publication number: 20220045251
    Abstract: A light emitting device, according to the present embodiment, has a light emitting panel, a flexible wiring substrate, a mold resin and a protective tape. The light emitting panel has a first substrate, which is transparent to light, a plurality of conductor patterns, which are formed on a surface of the first substrate, a plurality of light emitting elements, which are connected to any of the conductor patterns, and a resin layer, which holds the light emitting elements on the first substrate. The flexible wiring substrate has a circuit pattern that is electrically connected with an exposed part of the conductor patterns. The mold resin covers the exposed part of the conductor patterns and an exposed part of the circuit pattern. The protective tape covers the mold resin, and is wound around a joint part of the light emitting panel and the flexible wiring substrate.
    Type: Application
    Filed: October 27, 2021
    Publication date: February 10, 2022
    Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventors: Naoki TAKOJIMA, Kairi MAKITA, Fumio UENO
  • Patent number: 11189768
    Abstract: A light emitting device, according to the present embodiment, has a light emitting panel, a flexible wiring substrate, a mold resin and a protective tape. The light emitting panel has a first substrate, which is transparent to light, a plurality of conductor patterns, which are formed on a surface of the first substrate, a plurality of light emitting elements, which are connected to any of the conductor patterns, and a resin layer, which holds the light emitting elements on the first substrate. The flexible wiring substrate has a circuit pattern that is electrically connected with an exposed part of the conductor patterns. The mold resin covers the exposed part of the conductor patterns and an exposed part of the circuit pattern. The protective tape covers the mold resin, and is wound around a joint part of the light emitting panel and the flexible wiring substrate.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: November 30, 2021
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventors: Naoki Takojima, Kairi Makita, Fumio Ueno
  • Patent number: 11094859
    Abstract: Disclosed is a light emitting apparatus including: a first substrate having light transmissive property and flexibility with a conductive layer; a second substrate having light transmissive property and flexibility and arranged to face the first substrate; a plurality of light emitting elements including an electrode connected to the conductive layer and arranged between the first and second substrates; and a resin layer having light transmissive property and flexibility and arranged between the first and second substrates to hold the plurality of light emitting elements. A temperature for a maximum mechanical loss tangent tan ? in dynamic viscoelasticity of the resin layer is 117° C. or higher.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: August 17, 2021
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventors: Naoki Takojima, Yojiro Yarimizu, Tsuyoshi Abe
  • Patent number: 10879442
    Abstract: A light-emitting device according to embodiments of the invention includes a film having light transmissive property to visible light; a conductor layer formed on one surface of the film; and a light-emitting element having electrodes connected to the conductor layer via bumps protruding toward the film. The curvature of the film curved on the outer edge of a contact area of the conductor layer contacting the bumps is defined by a radius of a circle contacting the conductor layer at at least three points on the outer edge of the contact area, and the radius of this circle is 13 ?m or larger.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: December 29, 2020
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventors: Naoki Takojima, Yojiro Yarimizu, Tsuyoshi Abe, Kouji Tanaka
  • Publication number: 20200279983
    Abstract: A light emitting device, according to the present embodiment, has a first insulator, which is transparent to light, a first conductor layer, which is provided on a surface of the first insulator, a second insulator, which is transparent to light and arranged to oppose the first conductor layer, a light emitting element, which is arranged between the first insulator and the second insulator, and connected to the first conductor layer, and a third insulator, which is transparent to light and arranged between the first insulator and the second insulator, and the tensile storage elastic modulus of the third insulator is 1.0×109 Pa or greater, up to 1.0×1010 Pa, at 0° C., and 1.0×106 Pa or greater, up to 6.0×108 Pa, at 130° C.
    Type: Application
    Filed: February 27, 2020
    Publication date: September 3, 2020
    Applicant: Toshiba Hokuto Electronics Corporation
    Inventors: Naoki Takojima, Fumio Ueno
  • Publication number: 20200194645
    Abstract: A light emitting device, according to the present embodiment, has a light emitting panel, a flexible wiring substrate, a mold resin and a protective tape. The light emitting panel has a first substrate, which is transparent to light, a plurality of conductor patterns, which are formed on a surface of the first substrate, a plurality of light emitting elements, which are connected to any of the conductor patterns, and a resin layer, which holds the light emitting elements on the first substrate. The flexible wiring substrate has a circuit pattern that is electrically connected with an exposed part of the conductor patterns. The mold resin covers the exposed part of the conductor patterns and an exposed part of the circuit pattern. The protective tape covers the mold resin, and is wound around a joint part of the light emitting panel and the flexible wiring substrate.
    Type: Application
    Filed: December 13, 2019
    Publication date: June 18, 2020
    Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventors: Naoki TAKOJIMA, Kairi Makita, Fumio Ueno
  • Publication number: 20200075824
    Abstract: A light-emitting device according to embodiments of the invention includes a film having light transmissive property to visible light; a conductor layer formed on one surface of the film; and a light-emitting element having electrodes connected to the conductor layer via bumps protruding toward the film. The curvature of the film curved on the outer edge of a contact area of the conductor layer contacting the bumps is defined by a radius of a circle contacting the conductor layer at at least three points on the outer edge of the contact area, and the radius of this circle is 13 ?m or larger.
    Type: Application
    Filed: February 21, 2019
    Publication date: March 5, 2020
    Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventors: Naoki Takojima, Yojiro Yarimizu, Tsuyoshi Abe, Kouji Tanaka
  • Publication number: 20200075874
    Abstract: Disclosed is a light emitting apparatus including: a first substrate having light transmissive property and flexibility with a conductive layer; a second substrate having light transmissive property and flexibility and arranged to face the first substrate; a plurality of light emitting elements including an electrode connected to the conductive layer and arranged between the first and second substrates; and a resin layer having light transmissive property and flexibility and arranged between the first and second substrates to hold the plurality of light emitting elements. A temperature for a maximum mechanical loss tangent tan ? in dynamic viscoelasticity of the resin layer is 117° C. or higher.
    Type: Application
    Filed: August 21, 2019
    Publication date: March 5, 2020
    Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventors: Naoki Takojima, Yojiro Yarimizu, Tsuyoshi Abe