Abstract: The semiconductor light emitting element is a semiconductor light emitting element comprising a semiconductor layer including a light emitting layer, wherein a surface of the semiconductor light emitting element includes a light extraction surface. At least one of the light extraction surface and an interface between two layers having different refractive indexes in the semiconductor light emitting element is provided with a periodic recessed and projecting structure having a period that exceeds 0.5 times as great as a wavelength of light emitted from the light emitting layer, and a minute recessed and projecting structure located on a surface of the periodic recessed and projecting structure and having an average diameter that is not more than 0.5 times as great as the wavelength of the light.

Abstract: An ultraviolet light-emitting element includes a support substrate, a group III-V nitride semiconductor layer structure mounted on a mounting surface of the support substrate and including an n-type semiconductor layer, a light-emitting layer, a p-type cladding layer and a p-type contact layer stacked in this order on the support substrate, and an n-type electrode and a p-type electrode mounted on the n-type semiconductor and p-type contact layer, respectively. The support substrate has an indented portion formed on at least a part of a light emitting surface of the support substrate opposite to a mounting surface of the n-type semiconductor layer. An area of the n-type semiconductor layer surface exposed to the outside is at least 20% and at most 90% in largeness. Areas of the p-type contact layer surface and p-type electrode surface exposed to the outside are at least 5% and at most 50% in largeness.

Abstract: An ultraviolet light-emitting element includes a support substrate, a group III-V nitride semiconductor layer structure mounted on a mounting surface of the support substrate and including an n-type semiconductor layer, a light-emitting layer, a p-type cladding layer and a p-type contact layer stacked in this order on the support substrate, and an n-type electrode and a p-type electrode mounted on the n-type semiconductor and p-type contact layer, respectively. The support substrate has an indented portion formed on at least a part of a light emitting surface of the support substrate opposite to a mounting surface of the n-type semiconductor layer. An area of the n-type semiconductor layer surface exposed to the outside is at least 20% and at most 90% in largeness. Areas of the p-type contact layer surface and p-type electrode surface exposed to the outside are at least 5% and at most 50% in largeness.

Abstract: The semiconductor light emitting element is a semiconductor light emitting element comprising a semiconductor layer including a light emitting layer, wherein a surface of the semiconductor light emitting element includes a light extraction surface. At least one of the light extraction surface and an interface between two layers having different refractive indexes in the semiconductor light emitting element is provided with a periodic recessed and projecting structure having a period that exceeds 0.5 times as great as a wavelength of light emitted from the light emitting layer, and a minute recessed and projecting structure located on a surface of the periodic recessed and projecting structure and having an average diameter that is not more than 0.5 times as great as the wavelength of the light.

Abstract: The semiconductor light emitting element is a semiconductor light emitting element comprising a semiconductor layer including a light emitting layer, wherein a surface of the semiconductor light emitting element includes a light extraction surface. At least one of the light extraction surface and an interface between two layers having different refractive indexes in the semiconductor light emitting element is provided with a periodic recessed and projecting structure having a period that exceeds 0.5 times as great as a wavelength of light emitted from the light emitting layer, and a minute recessed and projecting structure located on a surface of the periodic recessed and projecting structure and having an average diameter that is not more than 0.5 times as great as the wavelength of the light.

Abstract: The semiconductor light emitting element is a semiconductor light emitting element comprising a semiconductor layer including a light emitting layer, wherein a surface of the semiconductor light emitting element includes a light extraction surface. At least one of the light extraction surface and an interface between two layers having different refractive indexes in the semiconductor light emitting element is provided with a periodic recessed and projecting structure having a period that exceeds 0.5 times as great as a wavelength of light emitted from the light emitting layer, and a minute recessed and projecting structure located on a surface of the periodic recessed and projecting structure and having an average diameter that is not more than 0.5 times as great as the wavelength of the light.

Abstract: A method for forming an n-type contact electrode, which includes an n-type nitride semiconductor such as AlxInyGazN (with x, y, and z being rational numbers that sum to 1.0 and fulfill the relations 0<x?1.0, 0?y?0.1, and 0?z<1.0), includes: a step in which a first electrode metal layer including at least one metal selected from titanium, vanadium, and tantalum is formed on a layer of the aforementioned n-type semiconductor and then heat-treated at a temperature between 800° C. and 1200° C.; and a step in which a second electrode metal layer is formed on top of the first electrode metal layer and then heat-treated at a temperature between 700° C. and 1000° C. The second electrode metal layer contains a layer comprising a metal, such as aluminum, that has a work function between 4.0 and 4.8 eV and a resistivity between 1.5×10?6 ?·cm and 4.0×10?6 ?·cm.

Abstract: A method for forming an n-type contact electrode comprising an n-type nitride semiconductor such as AlxInyGazN (with x, y, and z being rational numbers that sum to 1.0 and fulfill the relations 0<x?1.0, 0?y?0.1, and 0?z<1.0) includes: a step in which a first electrode metal layer including at least one metal selected from titanium, vanadium, and tantalum is formed on a layer of the aforementioned n-type semiconductor and then heat-treated at a temperature between 800° C. and 1200° C.; and a step in which a second electrode metal layer is formed on top of the first electrode metal layer and then heat-treated at a temperature between 700° C. and 1000° C. The second electrode metal layer contains a layer comprising a metal, such as aluminum, that has a work function between 4.0 and 4.8 eV and a resistivity between 1.5×10?6 ?·cm and 4.0×10?6 ?·cm.