Patents by Inventor Naoki TOYOMURA
Naoki TOYOMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230405762Abstract: An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.Type: ApplicationFiled: July 5, 2023Publication date: December 21, 2023Inventors: Kuniaki YAMAGUCHI, Itsuki KOBATA, Toshio MIZUNO, Mitsuru MIYAZAKI, Naoki TOYOMURA, Takuya INOUE
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Patent number: 11846536Abstract: A sensor target cover capable of preventing an optical liquid level detection sensor from erroneously detecting a rise in a liquid level is provided. A sensor target cover is used in combination with an optical liquid level detection sensor. The sensor target cover includes a reflecting plate, an inner wall structure surrounding the reflecting plate, and an outer wall structure surrounding the inner wall structure. A gap is formed between the inner wall structure and the outer wall structure.Type: GrantFiled: August 6, 2019Date of Patent: December 19, 2023Assignee: EBARA CORPORATIONInventors: Naoki Toyomura, Mitsuru Miyazaki
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Publication number: 20230352326Abstract: A polishing apparatus is provided. The polishing apparatus includes: a polishing unit configured to polish a substrate by bringing a polishing tool into contact with the substrate and moving the substrate relatively to the polishing tool; a cleaning unit; and a first transfer robot configured to transfer the substrate before polishing to the polishing unit and/or configured to transfer the substrate after polishing from the polishing unit to the cleaning unit. The cleaning unit includes: at least one cleaning module, a buff processing module configured to perform a buff process to the substrate, and a second transfer robot configured to transfer the substrate between the cleaning module and the buff processing module, the second transfer robot being different from the first robot.Type: ApplicationFiled: July 10, 2023Publication date: November 2, 2023Inventors: Kuniaki YAMAGUCHI, Toshio MIZUNO, Itsuki KOBATA, Mitsuru MIYAZAKI, Naoki TOYOMURA, Takuya INOUE
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Patent number: 11731240Abstract: An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.Type: GrantFiled: December 20, 2018Date of Patent: August 22, 2023Assignee: EBARA CORPORATIONInventors: Kuniaki Yamaguchi, Itsuki Kobata, Toshio Mizuno, Mitsuru Miyazaki, Naoki Toyomura, Takuya Inoue
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Patent number: 11195736Abstract: An object of the present invention is to detach a substrate from a table without damaging the substrate by lift pins. One embodiment of the present invention provides a substrate processing apparatus having a vacuum suction table adapted to have a substrate placed thereon, and a plurality of lift pins disposed along the outer periphery of the vacuum suction table. The lift pins each have a distal end portion including a substrate guide surface capable of guiding the outer peripheral end surface of the substrate, and a proximal end portion including a substrate holding surface extending from the substrate guide surface outwardly in a radial direction of the lift pin.Type: GrantFiled: December 7, 2016Date of Patent: December 7, 2021Assignee: EBARA CORPORATIONInventors: Naoki Toyomura, Mitsuru Miyazaki, Takuya Inoue
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Patent number: 11103972Abstract: In-plane uniformity of buff processing is improved. According to a first form, a buff processing device for executing buff processing of a substrate is provided. Such buff processing device has a rotatable shaft, a buff head body, a torque transmission mechanism for transmitting rotation of the shaft to the buff head body, and an elastic member for elastically supporting the buff head body in a longitudinal direction of the shaft.Type: GrantFiled: October 11, 2016Date of Patent: August 31, 2021Assignee: EBARA CORPORATIONInventors: Hideo Aizawa, Junji Kunisawa, Mitsuru Miyazaki, Naoki Toyomura
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Patent number: 10898987Abstract: Provided is a wet substrate processing apparatus for processing a substrate. The apparatus comprises a table for holding a substrate, and a process liquid feeding mechanism for feeding process liquid to the substrate held on the table. The table includes a support face for supporting the substrate, a first opening formed in the support face, a second opening formed in the support face and arranged at least partially around the first opening, a first fluid path configured to extend to the first opening of the support face via the table and be connectable to a vacuum source, and a second fluid path configured to extend to the second opening of the support face via the table and discharge the process liquid.Type: GrantFiled: May 27, 2016Date of Patent: January 26, 2021Assignee: EBARA CORPORATIONInventors: Naoki Toyomura, Mitsuru Miyazaki, Junji Kunisawa
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Publication number: 20210013071Abstract: A polishing apparatus is provided. The polishing apparatus includes: a polishing unit configured to polish a substrate by bringing a polishing tool into contact with the substrate and moving the substrate relatively to the polishing tool; a cleaning unit; and a first transfer robot configured to transfer the substrate before polishing to the polishing unit and/or configured to transfer the substrate after polishing from the polishing unit to the cleaning unit. The cleaning unit includes: at least one cleaning module, a buff processing module configured to perform a buff process to the substrate, and a second transfer robot configured to transfer the substrate between the cleaning module and the buff processing module, the second transfer robot being different from the first robot.Type: ApplicationFiled: September 29, 2020Publication date: January 14, 2021Inventors: Kuniaki Yamaguchi, Toshio Mizuno, Itsuki Kobata, Mitsuru Miyazaki, Naoki Toyomura, Takuya Inoue
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Patent number: 10847407Abstract: A substrate holding apparatus that can minimize a deflection amount of a substrate due to its own weight and can suppress vibration of the substrate at the time of rotation of the substrate even if a diameter of the substrate becomes large is disclosed. The substrate holding apparatus holds a periphery of a substrate and rotates the substrate. The substrate holding apparatus includes a plurality of support posts supported by a base and vertically movable relative to the base, a plurality of chucks respectively provided on the plurality of support posts and configured to hold the periphery of the substrate, and at least one support pin configured to support a lower surface of the substrate held by the plurality of chucks.Type: GrantFiled: November 14, 2016Date of Patent: November 24, 2020Assignee: EBARA CORPORATIONInventors: Naoki Toyomura, Mitsuru Miyazaki
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Publication number: 20200049546Abstract: A sensor target cover capable of preventing an optical liquid level detection sensor from erroneously detecting a rise in a liquid level is provided. A sensor target cover is used in combination with an optical liquid level detection sensor. The sensor target cover includes a reflecting plate, an inner wall structure surrounding the reflecting plate, and an outer wall structure surrounding the inner wall structure. A gap is formed between the inner wall structure and the outer wall structure.Type: ApplicationFiled: August 6, 2019Publication date: February 13, 2020Applicant: EBARA CORPORATIONInventors: Naoki TOYOMURA, Mitsuru MIYAZAKI
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Patent number: 10438820Abstract: A substrate processing apparatus including: a first valve provided between a gas supply source and an air-water separation tank, the first valve opening and closing a flow path of a gas supplied from the gas supply source; a second valve that opens and closes a flow path of liquid discharged from a discharge port of the air-water separation tank; and a control unit that controls the first valve and the second valve. The discharge port of the air-water separation tank communicates with a discharge port of a cleaning chamber that cleans the substrate, and the control unit controls to close the first valve after preset gas supply time elapses from when the first valve is opened and gas can no longer be discharged from the air-water separation tank and controls to close the second valve after the first valve is closed.Type: GrantFiled: October 23, 2017Date of Patent: October 8, 2019Assignee: EBARA CORPORATIONInventors: Naoki Toyomura, Akira Imamura
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Publication number: 20190118338Abstract: An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.Type: ApplicationFiled: December 20, 2018Publication date: April 25, 2019Inventors: Kuniaki YAMAGUCHI, Itsuki KOBATA, Toshio MIZUNO, Mitsuru MIYAZAKI, Naoki TOYOMURA, Takuya INOUE
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Publication number: 20190115230Abstract: A substrate processing apparatus including: a first valve provided between a gas supply source and an air-water separation tank, the first valve opening and closing a flow path of a gas supplied from the gas supply source; a second valve that opens and closes a flow path of liquid discharged from a discharge port of the air-water separation tank; and a control unit that controls the first valve and the second valve, wherein the discharge port of the air-water separation tank communicates with a discharge port of a cleaning chamber that cleans the substrate, and the control unit controls to close the first valve after preset gas supply time elapses from when the first valve is opened and gas can no longer be discharged from the air-water separation tank and controls to close the second valve after the first valve is closed.Type: ApplicationFiled: October 23, 2017Publication date: April 18, 2019Inventors: Naoki TOYOMURA, Akira IMAMURA
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Patent number: 10201888Abstract: An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.Type: GrantFiled: May 24, 2017Date of Patent: February 12, 2019Assignee: EBARA CORPORATIONInventors: Kuniaki Yamaguchi, Itsuki Kobata, Toshio Mizuno, Mitsuru Miyazaki, Naoki Toyomura, Takuya Inoue
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Publication number: 20180345452Abstract: In-plane uniformity of buff processing is improved. According to a first form, a buff processing device for executing buff processing of a substrate is provided. Such buff processing device has a rotatable shaft, a buff head body, a torque transmission mechanism for transmitting rotation of the shaft to the buff head body, and an elastic member for elastically supporting the buff head body in a longitudinal direction of the shaft.Type: ApplicationFiled: October 11, 2016Publication date: December 6, 2018Inventors: Hideo AIZAWA, Junji KUNISAWA, Mitsuru MIYAZAKI, Naoki TOYOMURA
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Patent number: 10121692Abstract: There is disclosed an improved substrate holding apparatus which can minimize deformation of a spring, which is provided to bias a support post for supporting a substrate, even when a large centrifugal force acts on the spring. The substrate holding apparatus includes: a support post movable in an axial direction thereof; a chuck provided on the support post and configured to hold a periphery of a substrate; a spring biasing the support post in the axial direction; a first structure configured to restrict a movement of an upper portion of the spring in a direction perpendicular to the axial direction of the support post; and a second structure configured to restrict a movement of a lower portion of the spring in a direction perpendicular to the axial direction of the support post.Type: GrantFiled: November 9, 2015Date of Patent: November 6, 2018Assignee: Ebara CorporationInventors: Naoki Toyomura, Mitsuru Miyazaki, Takuya Inoue
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Publication number: 20170252895Abstract: An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.Type: ApplicationFiled: May 24, 2017Publication date: September 7, 2017Inventors: Kuniaki YAMAGUCHI, Itsuki KOBATA, Toshio MIZUNO, Mitsuru MIYAZAKI, Naoki TOYOMURA, Takuya INOUE
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Patent number: 9700988Abstract: An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.Type: GrantFiled: August 21, 2015Date of Patent: July 11, 2017Assignee: Ebara CorporationInventors: Kuniaki Yamaguchi, Itsuki Kobata, Toshio Mizuno, Mitsuru Miyazaki, Naoki Toyomura, Takuya Inoue
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Patent number: D790489Type: GrantFiled: January 7, 2016Date of Patent: June 27, 2017Assignee: EBARA CORPORATIONInventors: Naoki Toyomura, Mitsuru Miyazaki
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Patent number: D795315Type: GrantFiled: June 1, 2015Date of Patent: August 22, 2017Assignee: EBARA CORPORATIONInventors: Mitsuru Miyazaki, Kuniaki Yamaguchi, Naoki Toyomura, Takuya Inoue