Abstract: A die 6 includes a central member 6a, an injection hole formed from a surface of the central member 6a to an inside, a plurality of nozzles formed from an opposite surface of the central member 6a to the inside and connected to the injection hole, a heat source provided inside the central member 6a, and a plurality of heat insulating portions 31a provided inside the central member 6a. The plurality of heat insulating portions 31a extend from an outer peripheral side of the central member 6a toward an inner side of the central member 6a in plan view.

Abstract: A lead frame including rails, section bars, and lead frame cells. The rails are respectively arranged at edges of the lead frame extending in a first direction. The section bars extend between the rails in a second direction and are orthogonal to the rails. The lead frame cells are aligned along the section bars. At least one of the section bars includes a rib extending in the second direction and formed through a half blanking process.

Abstract: A lead frame including rails, section bars, and lead frame cells. The rails are respectively arranged at edges of the lead frame extending in a first direction. The section bars extend between the rails in a second direction and are orthogonal to the rails. The lead frame cells are aligned along the section bars. At least one of the section bars includes a rib extending in the second direction and formed through a half blanking process.

Abstract: In order to improve adhesion between a plated film which functions as an external connection terminal of a semiconductor device and a surface of a resin protuberance and to improve reliability, a carrier substrate includes a metal substrate which is shaped into a sheet form, to which a semiconductor chip is fixed, and which is removed before the semiconductor device is completed, a recess formed at a position of the metal substrate corresponding to the resin protuberance and having a rugged bottom surface and/or a rugged side surface, and a plated film formed on the inner surface of the recess.

Abstract: In order to improve adhesion between a plated film which functions as an external connection terminal of a semiconductor device and a surface of a resin protuberance and to improve reliability, a carrier substrate includes a metal substrate 12 which is shaped into a sheet form, to which a semiconductor chip is fixed, and which is removed before the semiconductor device is completed, a recess 16 formed at a position of the metal substrate 12 corresponding to the resin protuberance and having a rugged bottom surface 16a and/or a rugged side surface, and a plated film 14 formed on the inner surface of the recess 16.

Abstract: In order to improve adhesion between a plated film which functions as an external connection terminal of a semiconductor device and a surface of a resin protuberance and to improve reliability, a carrier substrate includes a metal substrate which is shaped into a sheet form, to which a semiconductor chip is fixed, and which is removed before the semiconductor device is completed, a recess formed at a position of the metal substrate corresponding to the resin protuberance and having a rugged bottom surface and/or a rugged side surface, and a plated film formed on the inner surface of the recess.