Abstract: A magnetron sputtering cathode apparatus has a single magnetron cathode including a magnet assembly in which first and second types of rectangular magnet units whose N and S poles are opposite are alternately disposed adjacent to each other. Two types of loop loci in which drift electron motions are directed in opposite directions are alternately formed adjacent to each other by the first and second magnet units on the surface of the target. The two types of magnet units are disposed so that a substantially common ion current generation region is formed by the first and second magnet units, thereby hybridizing drift electron orbits adjacent to each other.

Abstract: At least one magnetron cathode provided in a sputtering apparatus comprises a magnet assembly in which first and second types of magnet units whose N and S poles are oppositely disposed are alternately disposed adjacent to each other. Two types of loop loci in which drift electron motions are directed in the opposite directions are alternately formed adjacent to each other by said first and second magnet units on a surface of the target. Consequently, a hybrid orbit is formed, and an ion current generation region is enlarged. Furthermore, a moving mechanism for reciprocating the magnet assembly is provided in the magnetron cathode. The above configuration solves the problem involving generation of non-uniform ion bombardment of the target, and achieves a magnetron sputtering electrode capable of depositing a thin film on a relatively large rectangular substrate in a stationary state without moving the substrate.

Abstract: In a target assembly for use in a magnetron-type sputtering device, a target member of a predetermined material comprises first and second targets which has a planar and a sloping surface, respectively. The planar surface has a circular periphery and is parallel to at least one object held by a holder. The sloping surface has an inner periphery concentrically of the circular periphery and an outer periphery which is nearer to the holder than the inner periphery. The first and the second targets may mechanically be united together or separated from each other and are magnetically individually driven by the use of a magnet member, such as an electromagnet and a permanent magnet, to produce a first and a second partial magnetic field in the vicinity of the first and the second targets, respectively. An electric source member is connected to the first and the second targets to produce an electric field intersecting the first and the second partial magnetic fields.

Abstract: On sputter-etching a substrate, fluorochloro- or fluorobromohydrocarbon gas is used as an etching gas in a chamber evacuated to a pressure of at least as low as 10.sup..sup.-5 Torr. The etching gas is introduced at a pressure between 5 .times. 10.sup..sup.-3 and 5 .times. 10.sup..sup.-2 Torr. Use is also made of a planar electrode for supporting the substrate and responsive to an r.f. power supplied thereto for producing a glow discharge.