Abstract: An in-liquid-substance detection sensor that achieves size reduction and detection accuracy improvement includes a piezoelectric substrate, at least two SAW devices provided on one major surface of the piezoelectric substrate and each having at least one IDT electrode defining a sensing portion, outer electrodes provided on the other major surface of the piezoelectric substrate and electrically connected to the SAW devices through vias extending through the piezoelectric substrate, a channel-defining member provided on the one major surface of the piezoelectric substrate so as to surround the SAW devices and a region connecting the SAW devices to each other, thereby defining sidewalls of a channel, and a protective member bonded to the one major surface of the piezoelectric substrate with the channel-defining member interposed therebetween, thereby sealing the channel, the protective member having at least two through holes communicating with the channel.

Abstract: A piezoelectric electronic component for use in a cellular phone or the like and capable of achieving reductions in size and profile is provided. A piezoelectric element oscillating in response to application of an input signal and outputting an output signal corresponding to the oscillations is provided on a substrate. The piezoelectric element includes a pad, the pad inputting and outputting the input and output signals. A shell member serving as a sealing member and having an insulation film covering the piezoelectric element is provided on the substrate, the shell member being remote from the piezoelectric element. The shell member includes a through hole above the pad, and the through hole is occluded with an electrode.

Abstract: An ignition element mounting capacitor having an ignition element mounted on a capacitor, includes therein a first capacitor section and a second capacitor section, and first external terminal electrodes electrically connected to the first capacitor section and second external terminal electrodes electrically connected to the second capacitor section. The first capacitor section has a capacity for igniting ignition powder, and the second capacitor section has a function for removing noise which affects external circuits. Further, provided on the surface of the capacitor are third external terminal electrodes electrically connected to the ignition element.

Abstract: An ignition element mounting capacitor having an ignition element mounted on a capacitor, includes therein a first capacitor section and a second capacitor section, and first external terminal electrodes electrically connected to the first capacitor section and second external terminal electrodes electrically connected to the second capacitor section. The first capacitor section has a capacity for igniting ignition powder, and the second capacitor section has a function for removing noise which affects external circuits. Further, provided on the surface of the capacitor are third external terminal electrodes electrically connected to the ignition element.

Abstract: An infrared sensor includes a first substrate made of a thermoelectric conversion material and a second substrate. The first substrate is supported by posts made of an electrode material while being spaced apart from the second substrate. A sensing electrode and lead portions connected thereto are provided on the first substrate. The sensing electrode and the lead portions are covered with an infrared-absorbing film. The posts are connected to the lead portions, and external terminal connection electrodes are connected to the posts.

Abstract: An in-liquid-substance detection sensor that achieves size reduction and detection accuracy improvement includes a piezoelectric substrate, at least two SAW devices provided on one major surface of the piezoelectric substrate and each having at least one IDT electrode defining a sensing portion, outer electrodes provided on the other major surface of the piezoelectric substrate and electrically connected to the SAW devices through vias extending through the piezoelectric substrate, a channel-defining member provided on the one major surface of the piezoelectric substrate so as to surround the SAW devices and a region connecting the SAW devices to each other, thereby defining sidewalls of a channel, and a protective member bonded to the one major surface of the piezoelectric substrate with the channel-defining member interposed therebetween, thereby sealing the channel, the protective member having at least two through holes communicating with the channel.

Abstract: An infrared sensor includes a first substrate made of a thermoelectric conversion material and a second substrate. The first substrate is supported by posts made of an electrode material while being spaced apart from the second substrate. A sensing electrode and lead portions connected thereto are provided on the first substrate. The sensing electrode and the lead portions are covered with an infrared-absorbing film. The posts are connected to the lead portions, and external terminal connection electrodes are connected to the posts.

Abstract: There are provided an electronic component in which two substrates are bonded to each other with a large bonding force and a method for manufacturing electronic components in which two substrates can be bonded to each other with a large bonding force and in which the substrates are not likely to be bent and broken. In an embodiment, a plurality of first connection portions 30 is formed on a first substrate 22, and in addition, a plurality of IDT electrodes 26 and a plurality of second connection portions 32 are formed on a second substrate 24. The first connection portions 30 are engaged in concave parts of the second connection portions 32, so that temporary bonding is performed. Between adjacent first connection portions 30, only the first substrate is cut. By heat application, laser irradiation, pressure application, ultrasonic application, or the like, the first connection portions 30 and the second connection portions 32 are finally bonded to each other.

Abstract: A piezoelectric electronic component for use in a cellular phone or the like and capable of achieving reductions in size and profile is provided. A piezoelectric element oscillating in response to application of an input signal and outputting an output signal corresponding to the oscillations is provided on a substrate. The piezoelectric element includes a pad, the pad inputting and outputting the input and output signals. A shell member serving as a sealing member and having an insulation film covering the piezoelectric element is provided on the substrate, the shell member being remote from the piezoelectric element. The shell member includes a through hole above the pad, and the through hole is occluded with an electrode.

Abstract: A piezoelectric electronic component for use in a cellular phone or the like and capable of achieving reductions in size and profile is provided. A piezoelectric element oscillating in response to application of an input signal and outputting an output signal corresponding to the oscillations is provided on a substrate. The piezoelectric element includes a pad, the pad inputting and outputting the input and output signals. A shell member serving as a sealing member and having an insulation film covering the piezoelectric element is provided on the substrate, the shell member being remote from the piezoelectric element. The shell member includes a through hole above the pad, and the through hole is occluded with an electrode.

Abstract: A method for manufacturing an electronic device includes the steps of forming a first resist pattern on a primary surface of a SAW element, the first resist pattern having openings at positions corresponding to those at which bumps and a sealing frame are to be formed, sequentially forming metals over the first resist pattern, the metals being formed into adhesion layers, barrier metal layers, and solder layers, removing the first resist pattern on the SAW element such that the bumps and the sealing frame are simultaneously formed. When the bumps and the sealing frame of the SAW element are bonded to bond electrodes of the bond substrate, the solder layers are melted and alloyed by heating.

Abstract: A piezoelectric electronic component for use in a cellular phone or the like and capable of achieving reductions in size and profile is provided. A piezoelectric element oscillating in response to application of an input signal and outputting an output signal corresponding to the oscillations is provided on a substrate. The piezoelectric element includes a pad, the pad inputting and outputting the input and output signals. A shell member serving as a sealing member and having an insulation film covering the piezoelectric element is provided on the substrate, the shell member being remote from the piezoelectric element. The shell member includes a through hole above the pad, and the through hole is occluded with an electrode.

Abstract: A method for manufacturing an electronic device includes the steps of forming a first resist pattern on a primary surface of a SAW element, the first resist pattern having openings at positions corresponding to those at which bumps and a sealing frame are to be formed, sequentially forming metals over the first resist pattern, the metals being formed into adhesion layers, barrier metal layers, and solder layers, removing the first resist pattern on the SAW element such that the bumps and the sealing frame are simultaneously formed. When the bumps and the sealing frame of the SAW element are bonded to bond electrodes of the bond substrate, the solder layers are melted and alloyed by heating.