Patents by Inventor Naoko Araki

Naoko Araki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8981040
    Abstract: Provided is a cationically polymerizable resin which is rapidly cured upon irradiation with light and forms a cured product excellent in flexibility and thermal stability. The cationically polymerizable resin is obtained through radical polymerization of an oxetane-ring-containing (meth)acryloyl compound represented by following Formula (1) alone or in combination with another radically polymerizable compound. In the formula, R1 represents hydrogen atom or methyl group; R2 represents hydrogen atom or an alkyl group; and “A” represents a linear or branched chain alkylene group having 2 to 20 carbon atoms.
    Type: Grant
    Filed: January 24, 2011
    Date of Patent: March 17, 2015
    Assignee: Daicel Corporation
    Inventors: Naoko Araki, Yoshinori Funaki, Kiyoharu Tsutsumi, Tomoaki Mahiko
  • Patent number: 8975349
    Abstract: Disclosed is a cationically polymerizable resin composition which includes an oxetane-ring-containing vinyl ether compound (A) and/or an alicyclic-epoxy-containing vinyl ether compound (B); and an oligomer or polymer (C) having a molecular weight of 500 or more, being liquid at 0° C., and containing at least one of structures represented by following Formulae (1a) to (1f), wherein Rx represents hydrogen atom or methyl group; R1 to R3 each independently represent a hydrocarbon group having 1 to 5 carbon atoms; “a” is an integer of from 0 to 5; and “b” is 1 or 2. This cationically polymerizable resin composition has a low viscosity, is easy to work, cures extremely rapidly upon irradiation with light, and can give a cured object excellent in flexibility, thermal stability, and bendability after heat treatment.
    Type: Grant
    Filed: May 20, 2010
    Date of Patent: March 10, 2015
    Assignee: Daicel Corporation
    Inventors: Yoshinori Funaki, Kiyoharu Tsutsumi, Tomoaki Mahiko, Naoko Araki
  • Patent number: 8735462
    Abstract: Provided is a radical-polymerizable resin capable of giving a cured material which is satisfactorily flexible, can relax stress upon usage as an adhesive, and does not cause disadvantages such as separation at the adhesive interface or breakage of an adherend, which stress occurs between the adhesive and the adherend upon heating or cooling and is caused by difference in coefficient of thermal expansion between them. The radical-polymerizable resin is obtained through cationic polymerization of a compound represented by any of following Formulae (1a) and (1b) and a compound represented by any of following Formulae (2a), (2b), (2c), (2d), (2e), and (2f). The radical-polymerizable resin is liquid at 0 ° C. and has a weight-average molecular weight of 500 or more. Symbols in the formulae are as defined in the description.
    Type: Grant
    Filed: March 28, 2011
    Date of Patent: May 27, 2014
    Assignee: Daicel Corporation
    Inventors: Tomoaki Mahiko, Yoshinori Funaki, Kiyoharu Tsutsumi, Naoko Araki
  • Publication number: 20130035465
    Abstract: Provided is a radically polymerizable resin which has a low viscosity, has excellent workability, and is rapidly cured upon application of heat and/or light to form a cured product having excellent flexibility and thermal stability. The radically polymerizable resin composition is obtained by cationic polymerization of an oxetane-ring-containing (meth)acrylic ester compound represented by following Formula (1) alone or in combination with another cationically polymerizable compound. In Formula (1), R1 represents hydrogen atom or methyl group; R2 represents hydrogen atom or an alkyl group; and “A” represents a linear or branched chain alkylene group having 4 to 20 carbon atoms.
    Type: Application
    Filed: April 8, 2011
    Publication date: February 7, 2013
    Applicant: DAICEL CORPORATION
    Inventors: Naoko Araki, Yoshinori Funaki, Kiyoharu Tsutsumi, Tomoaki Mahiko
  • Publication number: 20130030078
    Abstract: Provided is a radical-polymerizable resin capable of giving a cured material which is satisfactorily flexible, can relax stress upon usage as an adhesive, and does not cause disadvantages such as separation at the adhesive interface or breakage of an adherend, which stress occurs between the adhesive and the adherend upon heating or cooling and is caused by difference in coefficient of thermal expansion between them. The radical-polymerizable resin is obtained through cationic polymerization of a compound represented by any of following Formulae (1a) and (1b) and a compound represented by any of following Formulae (2a), (2b), (2c), (2d), (2e), and (2f). The radical-polymerizable resin is liquid at 0° C. and has a weight-average molecular weight of 500 or more. Symbols in the formulae are as defined in the description.
    Type: Application
    Filed: March 28, 2011
    Publication date: January 31, 2013
    Applicant: DAICEL CORPORATION
    Inventors: Tomoaki Mahiko, Yoshinori Funaki, Kiyoharu Tsutsumi, Naoko Araki
  • Publication number: 20120309930
    Abstract: Provided is a cationically polymerizable resin which is rapidly cured upon irradiation with light and forms a cured product excellent in flexibility and thermal stability. The cationically polymerizable resin is obtained through radical polymerization of an oxetane-ring-containing (meth)acryloyl compound represented by following Formula (1) alone or in combination with another radically polymerizable compound. In the formula, R1 represents hydrogen atom or methyl group; R2 represents hydrogen atom or an alkyl group; and “A” represents a linear or branched chain alkylene group having 2 to 20 carbon atoms.
    Type: Application
    Filed: January 24, 2011
    Publication date: December 6, 2012
    Inventors: Naoko Araki, Yoshinori Funaki, Kiyoharu Tsutsumi, Tomoaki Mahiko
  • Publication number: 20120077946
    Abstract: Disclosed is a cationically polymerizable resin composition which includes an oxetane-ring-containing vinyl ether compound (A) and/or an alicyclic-epoxy-containing vinyl ether compound (B); and an oligomer or polymer (C) having a molecular weight of 500 or more, being liquid at 0° C., and containing at least one of structures represented by following Formulae (1a) to (1f), wherein Rx represents hydrogen atom or methyl group; R1 to R3 each independently represent a hydrocarbon group having 1 to 5 carbon atoms; “a” is an integer of from 0 to 5; and “b” is 1 or 2. This cationically polymerizable resin composition has a low viscosity, is easy to work, cures extremely rapidly upon irradiation with light, and can give a cured object excellent in flexibility, thermal stability, and bendability after heat treatment.
    Type: Application
    Filed: May 20, 2010
    Publication date: March 29, 2012
    Inventors: Yoshinori Funaki, Kiyoharu Tsutsumi, Tomoaki Mahiko, Naoko Araki