Patents by Inventor Naoko Hirai
Naoko Hirai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10350712Abstract: A solder paste whereby metal does not flow out of a joint during a second or subsequent reflow heating stage. The solder paste exhibits high joint strength at room temperature and at high temperatures, excels in terms of temporal stability, exhibits minimal void formation, and can form highly cohesive joints. The solder paste comprises a powdered metal component and a flux component, the powdered metal component comprising: a powdered intermetallic compound that comprises copper and tin and has metal barrier layers covering the surfaces thereof and a solder powder including tin as a main component. Neither the powdered intermetallic compound nor the solder powder contains a copper-only phase, inhibiting the elution of copper ions into the flux.Type: GrantFiled: March 28, 2014Date of Patent: July 16, 2019Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Motoki Koroki, Shunsaku Yoshikawa, Sakie Okada, Taro Itoyama, Hideyuki Komuro, Naoko Hirai, Keitaro Shimizu
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Patent number: 9987710Abstract: A solder paste whereby metal does not flow out of a joint during a second or subsequent reflow heating stage. The solder paste excels in terms of temporal stability and exhibits high joint strength at room temperature and at high temperatures. The solder paste comprises a powdered metal component and a flux component, the powdered metal component comprising: 10-70 mass % of a powdered intermetallic compound comprising copper and tin and 30-90 mass % of a solder powder including tin as a main component. Neither the powdered intermetallic compound nor the solder powder contains a copper-only phase, inhibiting the elution of copper ions into the flux.Type: GrantFiled: March 28, 2014Date of Patent: June 5, 2018Assignee: Senju Metal Industry Co., Ltd.Inventors: Motoki Koroki, Shunsaku Yoshikawa, Sakie Okada, Taro Itoyama, Hideyuki Komuro, Naoko Hirai, Keitaro Shimizu
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Patent number: 9837757Abstract: With the increasing density of in-vehicle electronic circuits, not only conventional cracks at bonding interfaces such as between the substrate and the solder attachment site or a component and the solder attachment site but also novel cracking problems of cracks occurring in the Sn matrix in the interior of the bonded solder have appeared. To solve the above problem, a lead-free solder alloy with 1-4 mass % Ag, 0.6-0.8 mass % Cu, 1-5 mass % Sb, 0.01-0.2 mass % Ni and the remainder being Sn is used. A solder alloy, which not only can withstand harsh temperature cycling characteristics from low temperatures of ?40° C. to high temperatures of 125° C. but can also withstand external forces that occur when riding up on a curb or colliding with a vehicle in front for long periods, and an in-vehicle electronic circuit device using the solder alloy can thereby be obtained.Type: GrantFiled: April 3, 2014Date of Patent: December 5, 2017Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Shunsaku Yoshikawa, Naoko Hirai, Ken Tachibana, Yoshie Tachibana
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Patent number: 9597753Abstract: A solder paste whereby metal does not flow out of a joint during a second or subsequent reflow heating stage. The solder paste excels in terms of temporal stability and exhibits high joint strength at room temperature and at high temperatures. The solder paste comprises a powdered metal component and a flux component, the powdered metal component comprising: 10-70 mass % of a powdered intermetallic compound comprising copper and tin and 30-90 mass % of a solder powder including tin as a main component. Neither the powdered intermetallic compound nor the solder powder contains a copper-only phase, inhibiting the elution of copper ions into the flux.Type: GrantFiled: March 28, 2014Date of Patent: March 21, 2017Assignee: Senju Metal Industry Co., Ltd.Inventors: Motoki Koroki, Shunsaku Yoshikawa, Sakie Okada, Taro Itoyama, Hideyuki Komuro, Naoko Hirai, Keitaro Shimizu
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Publication number: 20160158896Abstract: A solder paste whereby metal does not flow out of a joint during a second or subsequent reflow heating stage. The solder paste excels in terms of temporal stability and exhibits high joint strength at room temperature and at high temperatures. The solder paste comprises a powdered metal component and a flux component, the powdered metal component comprising the following: 10-70 mass % of a powdered intermetallic compound comprising copper and tin and 30-90 mass % of a solder powder including tin as a main component. Neither the powdered intermetallic compound nor the solder powder contains a copper-only phase, inhibiting the elution of copper ions into the flux.Type: ApplicationFiled: March 28, 2014Publication date: June 9, 2016Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Motoki Koroki, Shunsaku Yoshikawa, Sakie Okada, Taro Itoyama, Hideyuki Komuro, Naoko Hirai, Keitaro Shimizu
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Publication number: 20160158897Abstract: A solder paste whereby metal does not flow out of a joint during a second or subsequent reflow heating stage. The solder paste exhibits high joint strength at room temperature and at high temperatures, excels in terms of temporal stability, exhibits minimal void formation, and can form highly cohesive joints. The solder paste comprises a powdered metal component and a flux component, the powdered metal component comprising: a powdered intermetallic compound that comprises copper and tin and has metal barrier layers covering the surfaces thereof and a solder powder including tin as a main component. Neither the powdered intermetallic compound nor the solder powder contains a copper-only phase, inhibiting the elution of copper ions into the flux.Type: ApplicationFiled: March 28, 2014Publication date: June 9, 2016Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Motoki Koroki, Shunsaku Yoshikawa, Sakie Okada, Taro Itoyama, Hideyuki Komuro, Naoko Hirai, Keitaro Shimizu
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Publication number: 20160056570Abstract: With the increasing density of in-vehicle electronic circuits, not only conventional cracks at bonding interfaces such as between the substrate and the solder attachment site or a component and the solder attachment site but also novel cracking problems of cracks occurring in the Sn matrix in the interior of the bonded solder have appeared. To solve the above problem, a lead-free solder alloy with 1-4 mass % Ag, 0.6-0.8 mass % Cu, 1-5 mass % Sb, 0.01-0.2 mass % Ni and the remainder being Sn is used. A solder alloy, which not only can withstand harsh temperature cycling characteristics from low temperatures of ?40° C. to high temperatures of 125° C. but can also withstand external forces that occur when riding up on a curb or colliding with a vehicle in front for long periods, and an in-vehicle electronic circuit device using the solder alloy can thereby be obtained.Type: ApplicationFiled: April 3, 2014Publication date: February 25, 2016Inventors: Shunsaku YOSHIKAWA, Naoko HIRAI, Ken TACHIBANA, Yoshie TACHIBANA
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Publication number: 20150328722Abstract: Provided is a lead-free solder alloy that has excellent tensile strength and ductility, does not deform after heat cycles, and does not crack. The In and Bi content are optimized and the Sb and Ni content are adjusted. As a result, this solder alloy has an alloy composition including, by mass, 1.0 to 7.0% of In, 1.5 to 5.5% of Bi, 1.0 to 4.0% of Ag, 0.01 to 0.2% of Ni, and 0.01 to 0.15% of Sb, with the remainder made up by Sn.Type: ApplicationFiled: December 18, 2012Publication date: November 19, 2015Inventors: Masayuki SUZUKI, Naoko HIRAI, Shunsaku YOSHIKAWA, Ken TACHIBANA, Rei FUJIMAKI, Hikaru NOMURA
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Publication number: 20080207617Abstract: An objective of the present invention is to provide compounds and pharmaceuticals useful for the treatment of disease where the inhibition of autophosphorylation of FMS-like tyrosine kinase 3(Flt3) is therapeutically effective. The present invention relates to a pharmaceutical composition for use in the treatment or prevention of diseases where the inhibition of autophosphorylation of Flt3 therapeutically or prophylactically effective, which comprises a compound represented by formula (I) or a pharmaceutically acceptable salt or solvate thereof: wherein X represents CH or N; Z represents O or S; R1, R2, and R3 represent H, OH, or optionally substituted alkoxy; R4 represents H; R5, R6, R7, and R8 represent H, Hal, alkyl or the like; and R9 represents, e.g., alkyl substituted by t-butyl or the like.Type: ApplicationFiled: October 29, 2003Publication date: August 28, 2008Applicant: KIRIN BEER KABUSHIKI KAISHAInventors: Atsushi Miwa, Tetsuya Yoshino, Mineo Kurokawa, Hisamaru Hirai, Naoko Hirai