Patents by Inventor Naoko Imaizumi
Naoko Imaizumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11809078Abstract: A purpose of the present invention is to provide a photosensitive resin composition which retains satisfactory image resolution and gives cured objects reduced in wet-heat dissolution or contamination and having satisfactory wet-heat adhesiveness. The photosensitive resin composition of the present invention comprises: (A) a cationic photopolymerization initiator which comprises a salt of a cation with an anion represented by formula (1) (wherein R1 to R4 each independently represent a C1?18 alkyl or C6-14 aryl group, provided that at least one of R1 to R4 represents a C6-14 aryl group); and (B) an epoxy compound. R1 to R4 may be each independently either a phenyl group having one or more perfluoroalkyl groups as substituents or a phenyl group having one or more fluorine atoms as substituents. R1 to R4 may be each independently a pentafluorophenyl or bis(trifluoromethyl)phenyl group.Type: GrantFiled: November 29, 2018Date of Patent: November 7, 2023Assignee: Nippon Kayaku Kabushiki KaishaInventor: Naoko Imaizumi
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Publication number: 20200292938Abstract: A purpose of the present invention is to provide a photosensitive resin composition which retains satisfactory image resolution and gives cured objects reduced in wet-heat dissolution or contamination and having satisfactory wet-heat adhesiveness. The photosensitive resin composition of the present invention comprises: (A) a cationic photopolymerization initiator which comprises a salt of a cation with an anion represented by formula (1) (wherein R1 to R4 each independently represent a C1-18 alkyl or C6-14 aryl group, provided that at least one of R1 to R4 represents a C6-14 aryl group); and (B) an epoxy compound. R1 to R4 may be each independently either a phenyl group having one or more perfluoroalkyl groups as substituents or a phenyl group having one or more fluorine atoms as substituents. R1 to R4 may be each independently a pentafluorophenyl or bis(trifluoromethyl)phenyl group.Type: ApplicationFiled: November 29, 2018Publication date: September 17, 2020Inventor: Naoko Imaizumi
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Patent number: 10241408Abstract: The purpose of the present invention is to provide: a photosensitive epoxy resin composition and/or a resist laminate of said resin composition that makes it possible to use photolithography to form an image having a vertical sidewall shape and fine resolution, low stress, and heat/humidity resistance; and a cured product of said resin composition and said resist laminate. The present invention is a photosensitive resin composition comprising: (A) an epoxy resin; (B) a polyol compound having a specific structure; (C) a photocationic polymerization initiator; and (D) an epoxy group-containing silane compound. The epoxy resin (A) comprises: an epoxy resin (a) obtained by reacting a phenol derivative that is represented by formula (1) with an epihalohydrin; and an epoxy resin (b) that is represented by formula (2).Type: GrantFiled: October 25, 2013Date of Patent: March 26, 2019Assignee: Nippon Kayaku Kabushiki KaishaInventors: Naoko Imaizumi, Shinya Inagaki, Nao Honda
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Patent number: 10012901Abstract: The purpose of the present invention is to provide the following: a photosensitive epoxy resin composition that, via photolithography, can form a high-resolution, low-stress image that has vertical side walls and resists moisture and heat, and/or a resist laminate using said photosensitive epoxy resin composition; and an article or articles obtained by curing said photosensitive epoxy resin composition and/or resist laminate. The present invention is a photosensitive resin composition containing the following: an epoxy resin (A), a polyol compound (B) having a specific structure, a cationic-polymerization photoinitiator (C), a silane compound (D) containing an epoxy group, and a reactive epoxy monomer (E) having a specific structure. The epoxy resin (A) contains the phenol derivative represented by formula (1), an epoxy resin (a) obtained via a reaction with epihalohydrin, and an epoxy resin (b) that can be represented by formula (2).Type: GrantFiled: November 21, 2013Date of Patent: July 3, 2018Assignee: Nippon Kayaku Kabushiki KaishaInventors: Naoko Imaizumi, Shinya Inagaki, Nao Honda
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Patent number: 9857685Abstract: The purpose of the present invention is to provide: a resin composition, a cured product of which has extremely low residual stress and exhibits excellent adhesion to a metal substrate such as a Pt, LT or Ta substrate after a wet heat test in the fields of semiconductors and MEMS/micromachine applications; a laminate of this resin composition; and a cured product of this resin composition or the laminate. The present invention is a photosensitive resin composition which contains an epoxy resin (A), a compound having a phenolic hydroxyl group (B) and a cationic photopolymerization initiator (C), and wherein: the epoxy resin (A) has a weighted average epoxy equivalent weight of 300 g/eq. or more; 20% by mass or more of the epoxy resin (A) is an epoxy resin represented by formula (1) and having an epoxy equivalent weight of 500-4,500 g/eq.; and the compound having a phenolic hydroxyl group (B) contains a phenolic compound having a specific structure.Type: GrantFiled: June 9, 2015Date of Patent: January 2, 2018Assignee: Nippon Kayaku Kabushiki KaishaInventors: Naoko Imaizumi, Yoshiyuki Ono, Takanori Koizumi, Maki Kumagai, Shinya Inagaki
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Patent number: 9684239Abstract: The purpose of the present invention is to provide: a photosensitive epoxy resin composition and/or a resist laminate of said resin composition that makes it possible to use photolithography to form an image having a vertical sidewall shape and fine resolution, low stress, and heat/humidity resistance; and a cured product of said resin composition and said resist laminate. The present invention is a photosensitive resin composition comprising: (A) an epoxy resin; (B) a polyphenol compound having a specific structure; (C) a photocationic polymerization initiator; and (D) an epoxy group-containing silane compound. The epoxy resin (A) comprises: an epoxy resin (a) obtained by reacting a phenol derivative that is represented by formula (1) with an epihalohydrin; and an epoxy resin (b) that is represented by formula (2).Type: GrantFiled: October 25, 2013Date of Patent: June 20, 2017Assignee: Nippon Kayaku Kabushiki KaishaInventors: Naoko Imaizumi, Shinya Inagaki, Nao Honda
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Publication number: 20170102614Abstract: The purpose of the present invention is to provide: a resin composition, a cured product of which has extremely low residual stress and exhibits excellent adhesion to a metal substrate such as a Pt, LT or Ta substrate after a wet heat test in the fields of semiconductors and MEMS/micromachine applications; a laminate of this resin composition; and a cured product of this resin composition or the laminate. The present invention is a photosensitive resin composition which contains an epoxy resin (A), a compound having a phenolic hydroxyl group (B) and a cationic photopolymerization initiator (C), and wherein: the epoxy resin (A) has a weighted average epoxy equivalent weight of 300 g/eq. or more; 20% by mass or more of the epoxy resin (A) is an epoxy resin represented by formula (1) and having an epoxy equivalent weight of 500-4,500 g/eq.; and the compound having a phenolic hydroxyl group (B) contains a phenolic compound having a specific structure.Type: ApplicationFiled: June 9, 2015Publication date: April 13, 2017Inventors: Naoko Imaizumi, Yoshiyuki Ono, Takanori Koizumi, Maki Kumagai, Shinya Inagaki
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Patent number: 9448479Abstract: The purpose of the present invention is to provide the following: a photosensitive epoxy resin composition that, via photolithography, can form a high-resolution, low-stress image that has vertical side walls and resists moisture and heat, and/or a resist laminate using said photosensitive epoxy resin composition; and an article or articles obtained by curing said photosensitive epoxy resin composition and/or resist laminate. The present invention is a photosensitive resin composition containing the following: an epoxy resin (A), a polyhydric phenol compound (B) having a specific structure, a cationic-polymerization photoinitiator (C), a silane compound (D) containing an epoxy group, and a reactive epoxy monomer (E) having a specific structure. The epoxy resin (A) contains the phenol derivative represented by formula (1), an epoxy resin (a) obtained via a reaction with epihalohydrin, and an epoxy resin (b) that can be represented by formula (2). The reactive epoxy monomer (E) is a bisphenol epoxy resin.Type: GrantFiled: November 21, 2013Date of Patent: September 20, 2016Assignee: Nippon Kayaku Kabushiki KaishaInventors: Naoko Imaizumi, Shinya Inagaki, Nao Honda
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Patent number: 9411229Abstract: A negative photosensitive resin composition which contains (A) an epoxy resin that has two or more epoxy groups in each molecule, (B) an alkali-soluble resin and (C) a cationic photopolymerization initiator. The epoxy resin (A) is an epoxy resin that is obtained by a reaction between a phenol derivative represented by formula (1) and an epihalohydrin.Type: GrantFiled: June 19, 2012Date of Patent: August 9, 2016Assignee: Nippon Kayaku Kabushiki KaishaInventors: Shinya Inagaki, Nao Honda, Naoko Imaizumi, Misato Oonishi
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Patent number: 9223212Abstract: An alkali-developing-type photosensitive resin composition comprising: a polycarboxylic acid resin (A) obtained by reacting a polybasic anhydride (c) with a reactant (ab) between a difunctional bisphenol epoxy resin (a) having an epoxy group at both terminals and an epoxy equivalent of 600-1300 g/eq., and a monocarboxylic acid compound (b) having an alcoholic hydroxyl group; an epoxy resin (B) having two or more epoxy groups in a molecule; and a photoacid generator (C), wherein the addition ratio the monocarboxylic acid compound (b) with respect to 1 equivalent of the epoxy group of the epoxy resin (a) is 80 equivalent % or more, and the addition ratio the polybasic anhydride with respect to one equivalent of the primary hydroxyl group of the reactant (ab) is 80 equivalent % or more.Type: GrantFiled: July 26, 2012Date of Patent: December 29, 2015Assignee: Nippon Kayaku Kabushiki KaishaInventors: Misato Oonishi, Shinya Inagaki, Naoko Imaizumi, Nao Honda
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Publication number: 20150309409Abstract: The purpose of the present invention is to provide the following: a photosensitive epoxy resin composition that, via photolithography, can form a high-resolution, low-stress image that has vertical side walls and resists moisture and heat, and/or a resist laminate using said photosensitive epoxy resin composition; and an article or articles obtained by curing said photosensitive epoxy resin composition and/or resist laminate. The present invention is a photosensitive resin composition containing the following: an epoxy resin (A), a polyhydric phenol compound (B) having a specific structure, a cationic-polymerization photoinitiator (C), a silane compound (D) containing an epoxy group, and a reactive epoxy monomer (E) having a specific structure. The epoxy resin (A) contains the phenol derivative represented by formula (1), an epoxy resin (a) obtained via a reaction with epihalohydrin, and an epoxy resin (b) that can be represented by formula (2). The reactive epoxy monomer (E) is a bisphenol epoxy resin.Type: ApplicationFiled: November 21, 2013Publication date: October 29, 2015Inventors: Naoko Imaizumi, Shinya Inagaki, Nao Honda
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Publication number: 20150301450Abstract: The purpose of the present invention is to provide: a photosensitive epoxy resin composition and/or a resist laminate of said resin composition that makes it possible to use photolithography to form an image having a vertical sidewall shape and fine resolution, low stress, and heat/humidity resistance; and a cured product of said resin composition and said resist laminate. The present invention is a photosensitive resin composition comprising: (A) an epoxy resin; (B) a polyphenol compound having a specific structure; (C) a photocationic polymerization initiator; and (D) an epoxy group-containing silane compound. The epoxy resin (A) comprises: an epoxy resin (a) obtained by reacting a phenol derivative that is represented by formula (1) with an epihalohydrin; and an epoxy resin (b) that is represented by formula (2).Type: ApplicationFiled: October 25, 2013Publication date: October 22, 2015Applicant: NIPPON KAYAKU KABUSHIKI KAISHAInventors: Naoko Imaizumi, Shinya Inagaki, Nao Honda
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Publication number: 20150293444Abstract: The purpose of the present invention is to provide the following: a photosensitive epoxy resin composition that, via photolithography, can form a high-resolution, low-stress image that has vertical side walls and resists moisture and heat, and/or a resist laminate using said photosensitive epoxy resin composition; and an article or articles obtained by curing said photosensitive epoxy resin composition and/or resist laminate. The present invention is a photosensitive resin composition containing the following: an epoxy resin (A), a polyol compound (B) having a specific structure, a cationic-polymerization photoinitiator (C), a silane compound (D) containing an epoxy group, and a reactive epoxy monomer (E) having a specific structure. The epoxy resin (A) contains the phenol derivative represented by formula (1), an epoxy resin (a) obtained via a reaction with epihalohydrin, and an epoxy resin (b) that can be represented by formula (2).Type: ApplicationFiled: November 21, 2013Publication date: October 15, 2015Inventors: Naoko Imaizumi, Shinya Inagaki, Nao Honda
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Publication number: 20150293448Abstract: The purpose of the present invention is to provide: a photosensitive epoxy resin composition and/or a resist laminate of said resin composition that makes it possible to use photolithography to form an image having a vertical sidewall shape and fine resolution, low stress, and heat/humidity resistance; and a cured product of said resin composition and said resist laminate. The present invention is a photosensitive resin composition comprising: (A) an epoxy resin; (B) a polyol compound having a specific structure; (C) a photocationic polymerization initiator; and (D) an epoxy group-containing silane compound. The epoxy resin (A) comprises: an epoxy resin (a) obtained by reacting a phenol derivative that is represented by formula (1) with an epihalohydrin; and an epoxy resin (b) that is represented by formula (2).Type: ApplicationFiled: October 25, 2013Publication date: October 15, 2015Inventors: Naoko Imaizumi, Shinya Inagaki, Nao Honda
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Patent number: 8865392Abstract: Disclosed is a photosensitive resin composition containing a cationic photopolymerization initiator (A) and an epoxy resin (B) having two or more epoxy groups in each molecule, which is characterized in that the cationic photopolymerization initiator (A) is a cationic photopolymerization initiator (A-1) that is represented by formula (1).Type: GrantFiled: July 13, 2011Date of Patent: October 21, 2014Assignee: Nippon Kayaku Kabushiki KaishaInventors: Misato Oonishi, Naoko Imaizumi, Ryo Sakai, Nao Honda, Tadayuki Kiyoyanagi
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Publication number: 20140186765Abstract: An alkali-developing-type photosensitive resin composition comprising: a polycarboxylic acid resin (A) obtained by reacting a polybasic anhydride (c) with a reactant (ab) between a difunctional bisphenol epoxy resin (a) having an epoxy group at both terminals and an epoxy equivalent of 600-1300 g/eq., and a monocarboxylic acid compound (b) having an alcoholic hydroxyl group; an epoxy resin (B) having two or more epoxy groups in a molecule; and a photoacid generator (C), wherein the addition ratio the monocarboxylic acid compound (b) with respect to 1 equivalent of the epoxy group of the epoxy resin (a) is 80 equivalent % or more, and the addition ratio the polybasic anhydride with respect to one equivalent of the primary hydroxyl group of the reactant (ab) is 80 equivalent % or more.Type: ApplicationFiled: July 26, 2012Publication date: July 3, 2014Applicant: NIPPON KAYAKU KABUSHIKI KAISHAInventors: Misato Oonishi, Shinya Inagaki, Naoko Imaizumi, Nao Honda
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Publication number: 20140099581Abstract: A negative photosensitive resin composition which contains (A) an epoxy resin that has two or more epoxy groups in each molecule, (B) an alkali-soluble resin and (C) a cationic photopolymerization initiator. The epoxy resin (A) is an epoxy resin that is obtained by a reaction between a phenol derivative represented by formula (1) and an epihalohydrin.Type: ApplicationFiled: June 19, 2012Publication date: April 10, 2014Applicant: NIPPON KAYAKU KABUSHIKI KAISHAInventors: Shinya Inagaki, Nao Honda, Naoko Imaizumi, Misato Oonishi
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Publication number: 20130108961Abstract: Disclosed is a photosensitive resin composition containing a cationic photopolymerization initiator (A) and an epoxy resin (B) having two or more epoxy groups in each molecule, which is characterized in that the cationic photopolymerization initiator (A) is a cationic photopolymerization initiator (A-1) that is represented by formula (1).Type: ApplicationFiled: July 13, 2011Publication date: May 2, 2013Applicant: NIPPON KAYAKU KABUSHIKI KAISHAInventors: Misato Oonishi, Naoko Imaizumi, Ryo Sakai, Nao Honda, Tadayuki Kiyoyanagi