Patents by Inventor Naokuni Muramatsu
Naokuni Muramatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11608545Abstract: A conductive supporting member includes an outer portion that includes a Cu matrix phase and a second phase dispersed in the Cu matrix phase and containing a Cu—Zr compound and that has an alloy composition represented by Cu-xZr (x is atomic % of Zr and 0.5?x?16.7 is satisfied) and an inner portion that is present on an inner side of the outer portion, is formed of a metal containing Cu, and has higher conductivity than the outer portion.Type: GrantFiled: April 25, 2019Date of Patent: March 21, 2023Assignees: NGK Insulators, Ltd., Tohoku UniversityInventors: Takashi Goto, Hirokazu Katsui, Naokuni Muramatsu, Takanari Nakajima
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Patent number: 11529671Abstract: A forging tool used to forge a workpiece in a cuboidal forging space, wherein (a): the forging space is formed when the bottom surface of the first die and the bottom surface of the second die are brought into contact with the contact surface of the third die, or (b): the forging space is formed when a first die contact surface provided in the first die and a second die contact surface provided in the second die are brought into contact with each other.Type: GrantFiled: September 21, 2020Date of Patent: December 20, 2022Assignees: NGK Insulators, Ltd.Inventors: Hiromi Miura, Naokuni Muramatsu, Tadahiro Kawamoto
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Patent number: 11511368Abstract: An electrically conductive tip member includes: an inner periphery portion including a Cu matrix phase and a second phase that is dispersed in the Cu matrix phase and contains a Cu—Zr-based compound, the inner periphery portion having an alloy composition of Cu-xZr (where x is the atomic percentage of Zr and satisfies 0.5?x?16.7); and an outer periphery portion that is present on an outer circumferential side of the inner periphery portion, made of a metal containing Cu, and has higher electrical conductivity than the inner periphery portion.Type: GrantFiled: May 27, 2020Date of Patent: November 29, 2022Assignee: NGK Insulators, Ltd.Inventors: Naokuni Muramatsu, Takanari Nakajima, Takashi Goto
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Patent number: 11351600Abstract: A nozzle put into a molten metal in vertical upwards continuous casting for casting a cast product by pulling up the molten metal, the nozzle includes a nozzle body having an intake hole through which the molten metal is taken in and which is formed in a lateral surface of the nozzle body and a flange portion formed on lower side of the intake hole and projecting beyond the nozzle body.Type: GrantFiled: September 19, 2019Date of Patent: June 7, 2022Assignee: NGK Insulators, Ltd.Inventors: Ken Suzuki, Naokuni Muramatsu
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Patent number: 10954586Abstract: A copper alloy disclosed in the present description has a basic alloy composition represented by Cu100?(x+y)SnxAly (where 8?x?12 and 8?y?9 are satisfied), in which a main phase is a ?CuSn phase with Al dissolved therein, and the ?CuSn phase undergoes martensitic transformation when heat-treated or worked. A method for producing a copper alloy disclosed in the present description is a casting step of melting and casting a raw material containing Cu, Sn, and Al and having a basic alloy composition represented by Cu100?(x+y)SnxAly (where 8?x?12 and 8?y?9 are satisfied) so as to obtain a cast material, and a homogenization step of homogenizing the cast material in a temperature range of a ?CuSn phase so as to obtain a homogenized material, the method includes at least the casting step.Type: GrantFiled: February 22, 2018Date of Patent: March 23, 2021Assignees: NGK Insulators, Ltd., National University Corporation Yokohama National UniversityInventors: Mahoto Takeda, Koudai Sasaki, Naokuni Muramatsu, Takanari Nakajima
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Publication number: 20210001391Abstract: A forging tool is to forge a workpiece in a cuboidal forging space, and wherein (a): the forging space is formed when the bottom surface of the first die and the bottom surface of the second die are brought into contact with the contact surface of the third die, or (b): the forging space is formed when a first die contact surface provided in the first die and a second die contact surface provided in the second die are brought into contact with each other.Type: ApplicationFiled: September 21, 2020Publication date: January 7, 2021Applicants: NGK INSULATORS, LTD.Inventors: Hiromi MIURA, Naokuni MURAMATSU, Tadahiro KAWAMOTO
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Publication number: 20200316708Abstract: An electrically conductive tip member includes: an inner periphery portion including a Cu matrix phase and a second phase that is dispersed in the Cu matrix phase and contains a Cu—Zr-based compound, the inner periphery portion having an alloy composition of Cu-xZr (where x is the atomic percentage of Zr and satisfies 0.5?x?16.7); and an outer periphery portion that is present on an outer circumferential side of the inner periphery portion, made of a metal containing Cu, and has higher electrical conductivity than the inner periphery portion.Type: ApplicationFiled: May 27, 2020Publication date: October 8, 2020Applicants: NGK INSULATORS, LTD., TOHOKU UNIVERSITYInventors: Naokuni MURAMATSU, Takanari NAKAJIMA, Takashi GOTO
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Patent number: 10774401Abstract: A copper alloy disclosed in the present description has a basic alloy composition represented by Cu100-(x+y)SnxMny (where 8?x?16 and 2?y?10 are satisfied), in which a main phase is a ?CuSn phase with Mn dissolved therein, and the ?CuSn phase undergoes martensitic transformation when heat-treated or worked.Type: GrantFiled: September 20, 2018Date of Patent: September 15, 2020Assignees: NGK Insulators, Ltd., National University Corporation Yokohama Natinal UniversityInventors: Mahoto Takeda, Koudai Sasaki, Daisuke Kaneko, Naokuni Muramatsu, Takanari Nakajima
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Patent number: 10557184Abstract: A method for manufacturing a copper alloy according to the present invention comprises (a) weighing a copper powder and one of a Cu—Zr master alloy and a ZrH2 powder such that an alloy composition of Cu-xZr (x is the atomic % of Zr, and 0.5?x?8.6 is satisfied) is obtained and pulverizing and mixing the copper powder and the one of the Cu—Zr master alloy and the ZrH2 powder in an inert atmosphere until an average particle diameter D50 falls within the range of from 1 ?m to 500 ?m to thereby obtain a powder mixture; and (b) subjecting the powder mixture to spark plasma sintering by holding the powder mixture at a prescribed temperature lower than eutectic temperature while the powder mixture is pressurized at a pressure within a prescribed range.Type: GrantFiled: November 21, 2016Date of Patent: February 11, 2020Assignees: NGK Insulators, Ltd., Tohoku UniversityInventors: Takashi Goto, Hirokazu Katsui, Naokuni Muramatsu, Masaaki Akaiwa
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Publication number: 20200009649Abstract: A nozzle put into a molten metal in vertical upwards continuous casting for casting a cast product by pulling up the molten metal, the nozzle includes a nozzle body having an intake hole through which the molten metal is taken in and which is formed in a lateral surface of the nozzle body and a flange portion formed on lower side of the intake hole and projecting beyond the nozzle body.Type: ApplicationFiled: September 19, 2019Publication date: January 9, 2020Applicant: NGK INSULATORS, LTD.Inventors: Ken SUZUKI, Naokuni MURAMATSU
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Publication number: 20190247950Abstract: A conductive supporting member includes an outer portion that includes a Cu matrix phase and a second phase dispersed in the Cu matrix phase and containing a Cu—Zr compound and that has an alloy composition represented by Cu-xZr (x is atomic % of Zr and 0.5?x?16.7 is satisfied) and an inner portion that is present on an inner side of the outer portion, is formed of a metal containing Cu, and has higher conductivity than the outer portion.Type: ApplicationFiled: April 25, 2019Publication date: August 15, 2019Applicants: NGK INSULATORS, LTD., TOHOKU UNIVERSITYInventors: Takashi GOTO, Hirokazu Katsui, Naokuni Muramatsu, Takanari Nakajima
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Patent number: 10329654Abstract: A method for manufacturing a copper alloy of the present invention is a method for manufacturing a Cu—Ni—Sn-based copper alloy and includes: a first aging treatment step of performing an aging treatment in a temperature range of 300° C. to 500° C. using a solution treated material; an inter-aging processing step of performing cold working after the first aging treatment step; and a second aging treatment step of performing an aging treatment in a temperature range of 300° C. to 500° C. after the inter-aging processing step. In the first aging treatment step, a peak aging treatment is preferably performed. In addition, in the second aging treatment step, the aging treatment is preferably performed for a short period as compared to that of the aging treatment in the first aging treatment step. In the inter-aging processing step, cold working is preferably performed at a processing rate of more than 60% to 99%.Type: GrantFiled: December 1, 2015Date of Patent: June 25, 2019Assignees: NGK Insulators, Ltd., National University Corporation Kanazawa UniversityInventors: Ryoichi Monzen, Naokuni Muramatsu
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Publication number: 20190017148Abstract: A copper alloy disclosed in the present description has a basic alloy composition represented by Cu100-(x+y)SnxMny (where 8?x?16 and 2?y?10 are satisfied), in which a main phase is a ?CuSn phase with Mn dissolved therein, and the ?CuSn phase undergoes martensitic transformation when heat-treated or worked.Type: ApplicationFiled: September 20, 2018Publication date: January 17, 2019Applicants: NGK INSULATORS, LTD., National University Corporation YOKOHAMA National UniversityInventors: Mahoto TAKEDA, Koudai SASAKI, Daisuke KANEKO, Naokuni MURAMATSU, Takanari NAKAJIMA
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Patent number: 10094002Abstract: A Cu—Be alloy according to the present invention is a Co-containing Cu—Be alloy, in which the Co content is 0.005% to 0.12% by mass, and the number of Cu—Co-based compound particles having a particle size of 0.1 ?m or more that can be confirmed on a TEM image at a magnification of 20,000 is five or less in a field of view of 10 ?m×10 ?m. Furthermore, a method for producing a Cu—Be alloy according to the present invention includes a solution annealing treatment step of subjecting a Cu—Be alloy raw material containing 0.005% to 0.12% by mass of Co and 1.60% to 1.95% by mass of Be to solution annealing treatment to obtain a solution-annealed material.Type: GrantFiled: April 22, 2015Date of Patent: October 9, 2018Assignees: NGK Insulators, Ltd., The University of Electro-CommunicationsInventors: Hiromi Miura, Naokuni Muramatsu
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Publication number: 20180209025Abstract: A copper alloy disclosed in the present description has a basic alloy composition represented by Cu100?(x+y)SnxAly (where 8?x?12 and 8?y?9 are satisfied), in which a main phase is a ?CuSn phase with Al dissolved therein, and the ?CuSn phase undergoes martensitic transformation when heat-treated or worked. A method for producing a copper alloy disclosed in the present description is a casting step of melting and casting a raw material containing Cu, Sn, and Al and having a basic alloy composition represented by Cu100?(x+y)SnxAly (where 8?x?12 and 8?y?9 are satisfied) so as to obtain a cast material, and a homogenization step of homogenizing the cast material in a temperature range of a ?CuSn phase so as to obtain a homogenized material, the method includes at least the casting step.Type: ApplicationFiled: February 22, 2018Publication date: July 26, 2018Applicants: NGK INSULATORS, LTD., National University Corporation YOKOHAMA National UniversityInventors: Mahoto TAKEDA, Koudai Sasaki, Naokuni Muramatsu, Takanari Nakajima
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Patent number: 10017840Abstract: A copper alloy of the present invention contains 5.00 to 8.00 atomic percent of Zr and includes Cu and a Cu—Zr compound, and two phases of the Cu and the Cu—Zr compound form a mosaic-like structure which includes no eutectic phase and in which when viewed in cross section, crystals having a size of 10 ?m or less are dispersed. This copper alloy is formed by a manufacturing method including a sintering step of performing spark plasma sintering on a Cu—Zr binary system alloy powder at a temperature of 0.9 Tm ° C. or less (Tm(° C.): melting point of the alloy powder) by supply of direct-currant pulse electricity, the Cu—Zr binary system alloy powder having an average grain diameter of 30 ?m or less and a hypoeutectic composition which contains 5.00 to 8.00 atomic percent of Zr. The Cu—Zr compound may include at least one of Cu5Zr, Cu9Zr2, and Cu8Zr3.Type: GrantFiled: April 23, 2015Date of Patent: July 10, 2018Assignees: NGK Insulators, Ltd., Tohoku UniversityInventors: Takashi Goto, Hisamichi Kimura, Akihisa Inoue, Naokuni Muramatsu
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Patent number: 9777348Abstract: A method of manufacturing a copper alloy is provided, including melting and casting a copper alloy having a composition expressed, in atomic percent, by a formula of Cu100?(a+b)ZraBb, wherein 1.0?a?8.0, 0?b?4.0, and a+b?8.0, by a nonrefractory melting method. A cold working with a reduction of about 50% or more for the copper alloy without a solution treatment is performed to provide the copper alloy a dual phase structure having a layered structure including a Cu matrix phase having a plurality of grain particles having an average diameter of about 10 ?m or less, and an eutectic phase around the Cu matrix phase. At least part of each grain particle contacts another grain particle within the eutectic phase, and the eutectic phase includes at least one of a Cu—Zr compound and a Cu—Zr—B compound.Type: GrantFiled: March 1, 2010Date of Patent: October 3, 2017Inventors: Hisamichi Kimura, Naokuni Muramatsu, Ken Suzuki
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Patent number: 9754703Abstract: A copper alloy wire rod includes a copper parent phase and short fiber-shaped composite phases which are dispersed in the copper parent phase and which contain Cu8Zr3 and Cu, wherein the content of Zr is within the range of 0.2 atomic percent or more and 1.0 atomic percent or less. This copper alloy wire rod can be obtained by including the steps of melting a raw material in such a way that a copper alloy having a Zr content within the above-described range of is produced so as to obtain a molten metal in a melting step, casting the molten metal so as to obtain an ingot in a casting step, and subjecting the ingot to cold wire drawing in a wire drawing step, wherein the wire drawing step and a treatment after the wire drawing step are performed at lower than 500° C.Type: GrantFiled: March 19, 2014Date of Patent: September 5, 2017Assignees: NGK Insulators, Ltd., Tohoku UniversityInventors: Akihisa Inoue, Hisamichi Kimura, Naokuni Muramatsu
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Patent number: 9676060Abstract: A method for treating a Cu thin sheet is provided. The method comprises the steps of: supplying a slurry in which a diffusion bonding aid (DBA), such as Ni powder, and a reinforcing material (RM), such as a carbide base metal compound, are dispersed in a solvent to a predetermined portion on a Cu or Cu base alloy thin sheet, drying the supplied slurry, and applying a laser to induce melting, solidification, and fixation, so as to form a buildup layer. In the method, the weight ratio of DBA to RM is specified to be 80:20 to 50:50, and the median diameters D50 of both DBA and RM employed fall within 0.1 to 100 ?m, the median diameter D50 of DBA is larger than the median diameter D50 of RM, and both the distribution ratio D90/D10 of DBA and the distribution ratio D90/D10 of RM are 4.0 or less.Type: GrantFiled: September 20, 2013Date of Patent: June 13, 2017Assignee: NGK Insulators, Ltd.Inventors: Naokuni Muramatsu, Shoju Aoshima
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Publication number: 20170130299Abstract: A method for manufacturing a copper alloy according to the present invention comprises (a) weighing a copper powder and one of a Cu—Zr master alloy and a ZrH2 powder such that an alloy composition of Cu-xZr (x is the atomic % of Zr, and 0.5?x?8.6 is satisfied) is obtained and pulverizing and mixing the copper powder and the one of the Cu—Zr master alloy and the ZrH2 powder in an inert atmosphere until an average particle diameter D50 falls within the range of from 1 ?m to 500 ?m to thereby obtain a powder mixture; and (b) subjecting the powder mixture to spark plasma sintering by holding the powder mixture at a prescribed temperature lower than eutectic temperature while the powder mixture is pressurized at a pressure within a prescribed range.Type: ApplicationFiled: November 21, 2016Publication date: May 11, 2017Applicants: NGK INSULATORS, LTD., TOHOKU UNIVERSITYInventors: Takashi GOTO, Hirokazu KATSUI, Naokuni MURAMATSU, Masaaki AKAIWA