Patents by Inventor Naomi Ando

Naomi Ando has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrolytic plating method
    Publication number: 20080023218
    Abstract: A novel electrolytic plating method suitable for filling non-through holes with metal is disclosed. The electrolytic plating method uses a plating solution containing additives such as a surfactant, a brightening agent and a smoothing agent and includes pulse plating for controlling adsorption and desorption of tie additives on the surface and in the non-through holes of substrate and subsequent DC plating for filling up the non-through holes with metal.
    Type: Application
    Filed: March 23, 2007
    Publication date: January 31, 2008
    Inventors: Keisuke Nishu, Morio Iijima, Naomi Ando