Abstract: A biological information measurement device includes a sensor unit that detects predetermined biological information related to an organ of a living body, an A/D conversion unit that converts a measurement signal output from the sensor unit into a digital signal, a storage unit that stores information including a digital signal related to the measurement signal output from the A/D conversion unit, an analysis processing unit that determines presence or absence of a suspicion of an abnormality in the organ by analyzing the digital signal, and a measurement control unit that changes a sampling frequency related to A/D conversion of the measurement signal under a predetermined condition when the analysis processing unit has determined that a suspicion of an abnormality is present in the organ.

Abstract: An electronic device inserted into and removed from a slot that has a connection port, the electronic device includes a coupled part coupled to the connection port, and a corrugated metal pipe that has one end coupled to the coupled part and the other end fixed to a body of the electronic device, wherein the pipe has a first straight line part that extends along a direction of the insertion and removal and a second straight line part that extends along a direction orthogonal to a longitudinal direction of the first straight line part.

Abstract: A fitting assembly including: a movable connector block including a connector coupler to which a connector is to be coupled, the movable connector block configured to be supported by a base; a floating support configured to support the movable connector block swingably together with the base; and a protrusion provided to one of the movable connector block and the base, the protrusion including a tip end that, when the connector is coupled to the connector coupler, comes into contact, in a connecting direction to the connector, with the other one of the movable connector block and the base, and swingably supports the movable connector block pivotally about the tip end.

Abstract: An information processing apparatus includes a substrate that includes a first connector and a second connector, a backplane that includes a third connector coupled to the first connector and a fourth connector coupled to the second connector, and a metal plate attached to the backplane, wherein the metal plate has an opening to which the fourth connector is attached, wherein the first connector is arranged near a central part of the substrate on an end side inserted into the backplane and the second connector is arranged on each side of the first connector, and wherein a clearance between the opening of the metal plate and the fourth connector increases as a distance from the third connector to the fourth connector increases.

Abstract: An information processing apparatus includes a substrate that includes a first connector and a second connector, a backplane that includes a third connector coupled to the first connector and a fourth connector coupled to the second connector, and a metal plate attached to the backplane, wherein the metal plate has an opening to which the fourth connector is attached, wherein the first connector is arranged near a central part of the substrate on an end side inserted into the backplane and the second connector is arranged on each side of the first connector, and wherein a clearance between the opening of the metal plate and the fourth connector increases as a distance from the third connector to the fourth connector increases.

Abstract: An electronic device inserted into and removed from a slot that has a connection port, the electronic device includes a coupled part coupled to the connection port, and a corrugated metal pipe that has one end coupled to the coupled part and the other end fixed to a body of the electronic device, wherein the pipe has a first straight line part that extends along a direction of the insertion and removal and a second straight line part that extends along a direction orthogonal to a longitudinal direction of the first straight line part.

Abstract: A fitting assembly including: a movable connector block including a connector coupler to which a connector is to be coupled, the movable connector block configured to be supported by a base; a floating support configured to support the movable connector block swingably together with the base; and a protrusion provided to one of the movable connector block and the base, the protrusion including a tip end that, when the connector is coupled to the connector coupler, comes into contact, in a connecting direction to the connector, with the other one of the movable connector block and the base, and swingably supports the movable connector block pivotally about the tip end.

Abstract: A reinforcement method includes: pressing a punch against a plate material from an opposite side to a die body to form a reinforcing portion on the plate material, wherein the punch includes a wedge projection which is provided in flank of a reinforcing portion forming portion extending along a relative movement direction of the die body and in parallel with the reinforcing portion forming portion, and is longer than a length of the relative movement direction of the die body.

Abstract: A shield structure for an electronic element, includes a ground pattern provided in a board; and a first member having electrical conductivity, covering the electronic element, and connected with the ground pattern.

Abstract: A shield structure for an electronic element, includes a grand pattern provided in a board; and a first member having electrical conductivity, covering the electronic element, and connected with the grand pattern.

Abstract: A multilayer thin-film wiring board including a base material provided with a plurality of wiring layers and an insulating layer laminated on the base material, and including a via formed by laminating the wiring layers so as to be provide through the insulating layer. A plurality of branching vias are provided by forming a plurality of branches in one of the wiring layers forming the via, the plurality of branching vias being placed along a direction of extension of the base material. The plurality of branching vias are joined to the one of the plurality of wiring layers which is placed at a position closest to the base material.

Abstract: A multilayer thin-film wiring board includes a base material provided with a plurality of wiring layers and an insulating layer laminated on the base material, and includes a via formed by laminating the wiring layers so as to be provided through the insulating layer. A plurality of branching vias are provided by forming a plurality of branches in at least one of the wiring layers forming the via, the plurality of branching vias being placed along a direction of extension of the base material. The plurality of branching vias are joined to one of the plurality of wiring layers which is placed at a position closest to the base material.

Abstract: The thin-film multi-layer substrate includes an insulating substrate base plate, and a thin-film structure including a plurality of conducting layers and a plurality of insulating layers formed on the substrate base plate. A via structure is formed in the thin-film structure and connected to one of the conducting layers of the thin-layer structure. Pins are connected to the via structure, such that the bottom of the via structure is directly laminated on the substrate base plate, and the pins are secured onto the via structure.