Patents by Inventor Naomi Murray

Naomi Murray has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for manufacturing porous orthopaedic implants
    Patent number: 8727203
    Abstract: A method of manufacturing an orthopaedic implant device having a porous outer surface is described. In one embodiment, the implant device includes a porous layer, an intermediate layer, and a solid substrate. The porous layer is preferably bonded to the intermediate layer by cold isostatic pressing. The intermediate layer is preferably bonded by vacuum welding to the solid substrate such that the porous layer forms at least a portion of the outer surface of the orthopaedic implant device. Preferably, a diffusion bond is created between the bonded intermediate layer and the solid substrate by hot isostatic pressing. In another embodiment, a porous layer is created on an outer surface of a solid layer by selective melting. Preferably, the solid layer is bonded to the solid substrate such that the porous layer forms at least a portion of the outer surface of the orthopaedic implant device.
    Type: Grant
    Filed: September 16, 2010
    Date of Patent: May 20, 2014
    Assignee: Howmedica Osteonics Corp.
    Inventors: Aiguo Wang, Daniel E. Lawrynowicz, Haitong Zeng, Naomi Murray, Balaji Prabhu
  • METHODS FOR MANUFACTURING POROUS ORTHOPAEDIC IMPLANTS
    Publication number: 20120067853
    Abstract: A method of manufacturing an orthopaedic implant device having a porous outer surface is described. In one embodiment, the implant device includes a porous layer, an intermediate layer, and a solid substrate. The porous layer is preferably bonded to the intermediate layer by cold isostatic pressing. The intermediate layer is preferably bonded by vacuum welding to the solid substrate such that the porous layer forms at least a portion of the outer surface of the orthopaedic implant device. Preferably, a diffusion bond is created between the bonded intermediate layer and the solid substrate by hot isostatic pressing. In another embodiment, a porous layer is created on an outer surface of a solid layer by selective melting. Preferably, the solid layer is bonded to the solid substrate such that the porous layer forms at least a portion of the outer surface of the orthopaedic implant device.
    Type: Application
    Filed: September 16, 2010
    Publication date: March 22, 2012
    Applicant: HOWMEDICA OSTEONICS CORP.
    Inventors: Aiguo Wang, Daniel E. Lawrynowicz, Haitong Zeng, Naomi Murray, Balaji Prabhu