Abstract: In a ceramic package main body having a circuit wiring provided to a ceramic substrate and including first and second independent circuit wires, first and second conductive layers are formed on the ceramic substrate. A first connection wire is provided to connect between the first circuit wire and the first conductive layer. A second connection wire is provided to connect between the second circuit wire and the second conductive layer. The first and second conductive layers are electrically insulated from each other for enabling to examine an electrical connection between the first and second conductive layers and determine, from the result of the examination, whether a short circuit is developed between the first and second circuit wires.

Abstract: In a ceramic package main body having a circuit wiring provided to a ceramic substrate and including first and second independent circuit wires, first and second conductive layers are formed on the ceramic substrate. A first connection wire is provided to connect between the first circuit wire and the first conductive layer. A second connection wire is provided to connect between the second circuit wire and the second conductive layer. The first and second conductive layers are electrically insulated from each other for enabling to examine an electrical connection between the first and second conductive layers and determine, from the result of the examination, whether a short circuit is developed between the first and second circuit wires.

Abstract: In a ceramic package main body having a circuit wiring provided to a ceramic substrate and including first and second independent circuit wires, first and second conductive layers are formed on the ceramic substrate. A first connection wire is provided to connect between the first circuit wire and the first conductive layer. A second connection wire is provided to connect between the second circuit wire and the second conductive layer. The first and second conductive layers are electrically insulated from each other for enabling to examine an electrical connection between the first and second conductive layers and determine, from the result of the examination, whether a short circuit is developed between the first and second circuit wires.

Abstract: Disclosed is a high heat conductive body which consists of 30-99 wt. % of at least one of molybdenum and tungsten and 1 or more wt. % ceramic. A wiring base substrate fitted with such a high heat conductive body is also disclosed. Methods of producing such a high heat conductive body and a wiring base substrate are further disclosed.

Abstract: A ceramic base of an IC package has a laminated structure and has two conductive layers sandwiched between insulating ceramic layers. One of the conductive layers is used as a power source layer and electrically connects a plurality of power source terminals of an IC chip to a single power source lead. The other conductive layer is used as an earth layer and electrically connects a plurality of earth terminals of the IC chip to a single earth lead.

Abstract: A ceramic multilayer wiring substrate is provided on which the metallized wirings are partially altered to provide multiple resistivities without changing the other electrical properties associated with a particular physical wiring geometry. Sequentially positioning conductive materials of different resistivities along the length of each individual wiring produces a final wiring pattern where each individual wiring can have a different resistance from the other wirings. A multiple resistivity wiring pattern can maximize the operation of a semiconductor chip attached thereto, for example, by reducing the effect of electronic noise on the semiconductor.