Abstract: A piezoelectric sensing module includes a polyvinylidene fluoride (PVDF) piezoelectric film, a first electrode layer that includes multiple receiver electrodes arranged in a first pattern enabling a sensing of a position of an input object on a touch surface using the PVDF piezoelectric film, and a second electrode layer that includes at least one common electrode. The PVDF piezoelectric film is arranged between the first electrode layer and the second electrode layer, with the second electrode layer between the PVDF piezoelectric film and the touch surface.

Abstract: A degradable adsorbent includes a porous degradable polymeric substrate, and nanoparticles bound to the porous degradable polymeric substrate. A method for removing an impurity from a fluid includes immersing a degradable adsorbent in the fluid containing the impurity, adsorbing the impurities in the degradable adsorbent, and disintegrating the degradable adsorbent in an aqueous solvent to produce a mixture containing the aqueous solvent, a degraded substrate and the impurity.

Abstract: A resin composition for encapsulation, which contains 100 parts by weight of a synthetic resin, 10 to 500 parts by weight of a carbon precursor having a volume resistivity of 102 to 1010 ?·cm, 0 to 60 parts by weight of a conductive filler having a volume resistivity lower than 102 ?·cm and 100 to 1,500 parts by weight of an other inorganic filler.

Abstract: A resin composition for encapsulation, which contains 100 parts by weight of a synthetic resin, 10 to 500 parts by weight of a carbon precursor having a volume resistivity of 102 to 1010 ?·cm, 0 to 60 parts by weight of a conductive filler having a volume resistivity lower than 102 ?·cm and 100 to 1,500 parts by weight of an other inorganic filler.

Abstract: A semiconductive film formed from a resin composition comprising poly(ether ether ketone) and a conductive filler, wherein the average value of its thickness is 30 to 250 ?m, the maximum value of the thickness is 1 to 1.3 times as much as the minimum value thereof, the average value of its volume resistivity is 1.0×102 to 1.0×1014 ?cm, the maximum value of the volume resistivity is 1 to 30 times as much as the minimum value thereof, and the number of reciprocating folds as determined in accordance with the testing method for folding endurance is at least 5,000 times, and a production process thereof.

Abstract: A resin composition for encapsulation, which contains 100 parts by weight of a synthetic resin, 10 to 500 parts by weight of a carbon precursor having a volume resistivity of 102 to 1010 ?·cm, 0 to 60 parts by weight of a conductive filler having a volume resistivity lower than 102 ?·cm and 100 to 1,500 parts by weight of an other inorganic filler.

Abstract: A stock shape for machining, which is composed of an extruded product of a resin composition comprising 30 to 94% by mass of a thermoplastic resin (A), 5 to 40% by mass of a carbon precursor (B) having a volume resistivity of 102 to 1010 ?cm and 1 to 30% by mass of a conductive filler (C) having a volume resistivity lower than 102 ?cm and has a thickness or diameter exceeding 3 mm, and a process for producing the stock shape by extrusion and solidification of the resin composition.

Abstract: A stock shape for machining, which is composed of an extruded product of a resin composition comprising 30 to 94% by mass of a thermoplastic resin (A), 5 to 40% by mass of a carbon precursor (B) having a volume resistivity of 102 to 1010 ?cm and 1 to 30% by mass of a conductive filler (C) having a volume resistivity lower than 102 ?·cm and has a thickness or diameter exceeding 3 mm, and a process for producing the stock shape by extrusion and solidification of the resin composition.

Abstract: A stock shape for machining, which is composed of an extruded product of a resin composition comprising 30 to 94% by mass of a thermoplastic resin (A), 5 to 40% by mass of a carbon precursor (B) having a volume resistivity of 102 to 1010 ?cm and 1 to 30% by mass of a conductive filler (C) having a volume resistivity lower than 102 ?·cm and has a thickness or diameter exceeding 3 mm, and a process for producing the stock shape by extrusion and solidification of the resin composition.

Abstract: A resin composition for encapsulation, which contains 100 parts by weight of a synthetic resin, 10 to 500 parts by weight of a carbon precursor having a volume resistivity of 102 to 1010 ?·cm, 0 to 60 parts by weight of a conductive filler having a volume resistivity lower than 102 ?·cm and 100 to 1,500 parts by weight of an other inorganic filler.

Abstract: A stock shape for machining, which is composed of an extruded product of a resin composition comprising 30 to 94% by mass of a thermoplastic resin (A), 5 to 40% by mass of a carbon precursor (B) having a volume resistivity of 102 to 1010 ?cm and 1 to 30% by mass of a conductive filler (C) having a volume resistivity lower than 102 ?cm and has a thickness or diameter exceeding 3 mm, and a process for producing the stock shape by extrusion and solidification of the resin composition.

Abstract: The invention provides an IC socket of synthetic resin, whose surface resistivity is strictly controlled to the desired level and which is much more improved in terms of electrical insulation properties, mechanical properties, heat resistance, chemical resistance, dimensional stability, etc. The IC socket is obtained by molding or otherwise forming a thermoplastic resin composition comprising 40 to 94% by mass of a thermoplastic resin, 5 to 30% by mass of a carbon precursor having a volume resistivity of 102 to 1010 ?·cm and 1 to 30% by mass of an electrical conductive filler having a volume resistivity of less than 102 ?·cm.

Abstract: A semiconductive film formed from a resin composition comprising poly(ether ether ketone) and a conductive filler, wherein the average value of its thickness is 30 to 250 ?m, the maximum value of the thickness is 1 to 1.3 times as much as the minimum value thereof, the average value of its volume resistivity is 1.0×102 to 1.0×1014 ?cm, the maximum value of the volume resistivity is 1 to 30 times as much as the minimum value thereof, and the number of reciprocating folds as determined in accordance with the testing method for folding endurance is at least 5,000 times, and a production process thereof.

Abstract: A resin composition comprises a resin component containing 40 to 99% by mass of a poly(aryl ketone) and 1 to 60% by mass of a poly(arylene sulfide), and 0.1 to 5 parts by mass, per 100 parts by mass of the resin component, of at least one thermosetting imide resin selected from the group consisting of a polyfunctional unsaturated imide compound and its thermoset product. The resin composition is improved in terms of compatibility, moldability or formability, melt flowability, mechanical properties, etc. while maintaining high levels of various properties such as heat resistance, flame retardancy, chemical resistance and dimensional stability.

Abstract: The invention provides a solid polymer fuel cell separator that is molded or formed of a resin composition comprising a thermoplastic resin, a conductive carbon black having a bulk density of at least 0.3 g/ml and a DBP oil absorption of up to 150 ml/100 g and optionally a conductive filler having a volume resistivity of less than 1 ?·cm. The invention also provides a solid polymer fuel cell separator production process involving injection molding of the resin composition.

Abstract: The invention provides a solid polymer fuel cell separator that is molded or formed of a resin composition comprising a thermoplastic resin, a conductive carbon black having a bulk density of at least 0.3 g/ml and a DBP oil absorption of up to 150 ml/100 g and optionally a conductive filler having a volume resistivity of less than 1 &OHgr;·cm. The invention also provides a solid polymer fuel cell separator production process involving injection molding of the resin composition.

Abstract: A poly(arylene sulfide) resin composition comprising a poly(arylene sulfide) and, as a modifier, an organic amide compound compounded in a proportion of 0.2 to 10 parts by weight per 100 parts by weight of the poly(arylene sulfide).

Abstract: A resin composition comprises a resin component containing 40 to 99% by mass of a poly(aryl ketone) and 1 to 60% by mass of a poly(arylene sulfide), and 0.1 to 5 parts by mass, per 100 parts by mass of the resin component, of at least one thermosetting imide resin selected from the group consisting of a polyfunctional unsaturated imide compound and its thermoset product. The resin composition is improved in terms of compatibility, moldability or formability, melt flowability, mechanical properties, etc. while maintaining high levels of various properties such as heat resistance, flame retardancy, chemical resistance and dimensional stability.

Abstract: The invention provides an IC socket of synthetic resin, whose surface resistivity is strictly controlled to the desired level and which is much more improved in terms of electrical insulation properties, mechanical properties, heat resistance, chemical resistance, dimensional stability, etc. The IC socket is obtained by molding or otherwise forming a thermoplastic resin composition comprising 40 to 94% by mass of a thermoplastic resin, 5 to 30% by mass of a carbon precursor having a volume resistivity of 102 to 1010 &OHgr;·cm and 1 to 30% by mass of an electrical conductive filler having a volume resistivity of less than 102 &OHgr;·cm.

Abstract: A thermoplastic resin composition is formed by mixing (A) 30-84.9 wt. % of a crystalline thermoplastic resin, (B) 15-65 wt. % of a graft copolymer obtained by graft-polymerizing an ethylenically unsaturated monomer onto a rubber trunk polymer having an alkylene oxide group and (C) 0.1-5 wt. % of an anionic surfactant. As a result, it is possible to obtain a non-black thermoplastic resin composition which shows an antistatic property at a level suitable for use as an ESD (electrical static dissipative) and can be colored into arbitrary hues.