Abstract: An oil dilution inhibiting apparatus is configured to inhibit oil dilution caused by mixture of fuel into engine oil. The oil dilution inhibiting apparatus includes a control unit. The control unit is configured to estimate friction of an engine and determine that the oil dilution occurs when the friction of the engine is decreased to a value lower than or equal to a predetermined threshold value to perform control so that the engine is operated at a higher speed.

Abstract: According to one embodiment, a fastener installed between a blower fan and a rotating mechanism includes a fastener main body, a first flange portion, a second flange portion, and a slit portion. The fastener main body has a cylindrical outline which is partly cut. The slit portion is continuously cut from the first flange portion to the second flange portion via the fastener main body.

Abstract: According to one embodiment, a fastener installed between a blower fan and a rotating mechanism includes a fastener main body, a first flange portion, a second flange portion, and a slit portion. The fastener main body has a cylindrical outline which is partly cut. The slit portion is continuously cut from the first flange portion to the second flange portion via the fastener main body.

Abstract: According to one embodiment, an electronic component structure includes an electronic component, an electrode, and a restriction portion. The electrode is connected to the electronic component in a multilayer state and comprises a plurality of solder regions on a side opposite to a side of the electronic component. Each of the solder regions is soldered to a substrate by separate solders. The restriction portion is connected to a periphery of the solder regions, and has a level difference relative to the solder regions.

Abstract: In one embodiment, there is provided a wiring substrate. The wiring substrate includes: a substrate body comprising a first surface and a second surface opposite to the first surface, wherein the substrate body has a plurality of first through holes; a plurality of first pads on the first surface of the substrate body; a plurality of second pads on the first surface of the substrate body, wherein the second pads are surrounded by the first pads. Each of the second pads has at least one second through hole, and the second pads are disposed on the first surface of the substrate body such that each of the second through holes is communicated with a corresponding one of the first through holes.

Abstract: According to one embodiment, an electronic component structure includes an electronic component, an electrode, and a restriction portion. The electrode is connected to the electronic component in a multilayer state and comprises a plurality of solder regions on a side opposite to a side of the electronic component. Each of the solder regions is soldered to a substrate by separate solders. The restriction portion is connected to a periphery of the solder regions, and has a level difference relative to the solder regions.