Abstract: A head module includes a head chip provided with an array of heat generating elements, a nozzle sheet provided with nozzles, a barrier layer for forming ink liquid chambers, a module frame adhered to the nozzle sheet to thereby support the nozzle sheet and provided with a head chip arranging hole for arranging the head chip therein, and a buffer tank which is so disposed as to cover the head chip arranging hole from a surface, on the opposite side of the surface of adhesion to the nozzle sheet, of the module frame and which is for forming a common liquid conduit communicated with all the ink chambers of the head chip.

Abstract: A line head includes a nozzle plate, a frame-shaped outer frame, a plurality of head chips, and a head support member arranged within the outer frame. The linear expansion coefficients of the nozzle plate and the head support member are larger than that of the outer frame. The nozzle plate is joined onto the outer frame and a tensile stress is produced in the nozzle plate by the outer frame. The head support member is joined and fitted with the outer frame. When the head support member thermally expands relative to the outer frame, a compression stress is produced in the head support member while a strain of the head support member is restricted by the outer frame.

Abstract: A liquid ejection head mounted in a liquid ejection apparatus for ejecting liquid includes a first substrate including a pressure generating element for applying pressure to the liquid, a second substrate including a control circuit for controlling the drive of the pressure generating element, an external wiring member for electrically connecting the first substrate to the second substrate, a nozzle sheet having a nozzle for ejecting the liquid and a window portion through which a connection portion between the external wiring member and the first substrate is exposed to the outside. The window portion is sealed with a resin material and a seal portion formed from the resin material is cured so as to have a Shore D hardness of more than or equal to 55.

Abstract: A line head includes a nozzle plate, a frame-shaped outer frame, a plurality of head chips, and a head support member arranged within the outer frame. The linear expansion coefficients of the nozzle plate and the head support member are larger than that of the outer frame. The nozzle plate is joined onto the outer frame and a tensile stress is produced in the nozzle plate by the outer frame. The head support member is joined and fitted with the outer frame. When the head support member thermally expands relative to the outer frame, a compression stress is produced in the head support member while a strain of the head support member is restricted by the outer frame.

Abstract: A head module includes a head chip provided with an array of heat generating elements, a nozzle sheet provided with nozzles, a barrier layer for forming ink liquid chambers, a module frame adhered to the nozzle sheet to thereby support the nozzle sheet and provided with a head chip arranging hole for arranging the head chip therein, and a buffer tank which is so disposed as to cover the head chip arranging hole from a surface, on the opposite side of the surface of adhesion to the nozzle sheet, of the module frame and which is for forming a common liquid conduit communicated with all the ink chambers of the head chip.