Patents by Inventor Naoshi Hamada

Naoshi Hamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6448357
    Abstract: A polyolefin resin composition comprising (A) an ethylene-based polyolefin having a density of 0.865 to 0.980 g/cm3 and MFR of 0.01 to 50 g/10 min, (B) a phosphorous compound, and (C) at least one heat stabilizer selected from the group consisting of a phenol-based heat stabilizer and a tocopherol-based heat stabilizer. The polyolefin resin composition has excellent heat resistance, moisture resistance and discoloration resistance, and also when used as a packaging material, does not impair the taste of contents to be packaged, such as flavor or odor, and therefore does not impair the taste of the contents.
    Type: Grant
    Filed: July 14, 2000
    Date of Patent: September 10, 2002
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Naoshi Hamada, Sadamu Hirakawa, Akihiko Yamamoto
  • Patent number: 6110549
    Abstract: A sealant resin composition for retort packaging film comprises a high density polyethylene as the main resin component and a linear low density polyethylene polymerized by use of the metallocene catalyst. A sealant film produced therefrom is resistant to whitening, heat fusion, heat deformation after being subjected to boiling sterilization treatment and prevent breakage of pouches produced therefrom even at low temperatures because of its high impact strength and heat sealing strength.
    Type: Grant
    Filed: April 30, 1998
    Date of Patent: August 29, 2000
    Assignee: Mitsui Chemicals Inc.
    Inventors: Naoshi Hamada, Sadamu Hirakawa, Shigeo Ozaki
  • Patent number: 5756193
    Abstract: Disclosed is a polyethylene resin composition for heavy-duty packaging bag, which has a specific MFR, a specific density and a specific melt tension and which comprises (I) a linear low-density polyethylene resin prepared from ethylene and an .alpha.-olefin of 4 or more carbon atoms and having a specific MFR, a specific molecular weight distribution and a density of 0.900 to 0.918 g/cm.sup.3, (II) a linear medium or high-density polyethylene resin having a density of 0.935 to 0.970 g/cm.sup.3 and (III) a high-pressure low-density polyethylene resin having a density of 0.915 to 0.924 g/cm.sup.3, in a specific ratio of components. Also disclosed is a polyethylene resin film prepared from said composition. The composition is able to provide a film which is excellent in low-temperature properties such as low-temperature drop-bag strength and can be advantageously used for a heavy-duty packaging bag even in a cold district of below-freezing temperature.
    Type: Grant
    Filed: March 28, 1996
    Date of Patent: May 26, 1998
    Assignee: Mitsui Petrochemical Industries, Ltd.
    Inventors: Akihiko Yamamoto, Naoshi Hamada, Toshihiro Nishimura, Kouji Kitahara