Abstract: A device of the present disclosure includes an electronic component, a metal plate, a housing, and a wavelength selective heat radiating member. The metal plate is thermally coupled to the electronic component. The housing houses the electronic component and the metal plate. The wavelength selective heat radiating member is mounted on a surface of the metal plate, so as to face an inner side surface of a specific portion of the housing. The wavelength selective heat radiating member is configured to convert thermal energy from the electronic component into heat radiation having a wavelength that penetrates the specific portion of the housing, and emit the heat radiation toward the inner side surface of the specific portion of the housing.

Abstract: A device of the present disclosure includes an electronic component, a metal plate, a housing, and a wavelength selective heat radiating member. The metal plate is thermally coupled to the electronic component. The housing houses the electronic component and the metal plate. The wavelength selective heat radiating member is mounted on a surface of the metal plate, so as to face an inner side surface of a specific portion of the housing. The wavelength selective heat radiating member is configured to convert thermal energy from the electronic component into heat radiation having a wavelength that penetrates the specific portion of the housing, and emit the heat radiation toward the inner side surface of the specific portion of the housing.

Abstract: An object is to provide a method for manufacturing a wavelength selective heat radiation material in which a surface roughness of an upper portion of a cavity wall defining each microcavity is suppressed or in which microcavities each having an aspect ratio larger than 3.0 are formed. For the wavelength selective heat radiation material, a base material having a mask having predetermined openings tightly adhered to a surface thereof, or a base material in which depressions are previously formed on one surface thereof by pressing a die having projections arrayed so as to correspond to positions of microcavities thereagainst, is subjected to anisotropic etching, thereby providing a wavelength selective heat radiation material in which the surface roughness of the upper portion of the cavity wall defining each of the microcavities is suppressed or a wavelength selective heat radiation material having microcavities whose each aspect ratio is larger than 3.0.

Abstract: An object is to provide a method for manufacturing a wavelength selective heat radiation material in which a surface roughness of an upper portion of a cavity wall defining each microcavity is suppressed or in which microcavities each having an aspect ratio larger than 3.0 are formed. For the wavelength selective heat radiation material, a base material having a mask having predetermined openings tightly adhered to a surface thereof, or a base material in which depressions are previously formed on one surface thereof by pressing a die having projections arrayed so as to correspond to positions of microcavities thereagainst, is subjected to anisotropic etching, thereby providing a wavelength selective heat radiation material in which the surface roughness of the upper portion of the cavity wall defining each of the microcavities is suppressed or a wavelength selective heat radiation material having microcavities whose each aspect ratio is larger than 3.0.