Patents by Inventor Naoshi Masukawa

Naoshi Masukawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8105675
    Abstract: There is disclosed a honeycomb structure 1 which is made of a ceramic material and in which a plurality of honeycomb segments 12 having cell structures 5 and porous outer walls 7 on outer peripheries of the cell structures 5 are integrated by bonding the outer walls 7 to one another with a bonding material, each of the cell structures being provided with a plurality of cells 3 constituting fluid channels divided by porous partition walls 2, wherein the bonding material contains a bio-soluble fiber. The honeycomb structure 1 of the present invention has a performance equivalent to that of a honeycomb structure in which a heretofore used ceramic fiber is contained.
    Type: Grant
    Filed: September 4, 2008
    Date of Patent: January 31, 2012
    Assignees: NGK Insulators, Ltd., NGK Adrec Co., Ltd.
    Inventors: Naoshi Masukawa, Atsushi Watanabe, Shuichi Ichikawa, Osamu Yamakawa, Tetsuhiro Honjo
  • Patent number: 8053054
    Abstract: A honeycomb structure 1 comprising a honeycomb segment bonded body 10 having a number of honeycomb segments 2 integrated on each bonding planes via bonding material layers 9 has a structure so that a number of cells 5 providing fluid flow channels are disposed in parallel in the direction of center axis thereof. The honeycomb structure 1 is constructed so that the porosity of an outer portion of the bonding material layers 9 (an area from the interface with the honeycomb segment-bonding plane to a point apart from that interface by a distance equivalent to 20% of the entire layer thickness) is smaller than the porosity of a central portion located inward of the outer portion, and so that the bonding material layers 9 have a compression Young's modulus along the Z-axis of 5 to 100 MPa.
    Type: Grant
    Filed: September 18, 2008
    Date of Patent: November 8, 2011
    Assignee: NGK Insulators, Ltd.
    Inventors: Koichi Iwata, Naoshi Masukawa, Atsushi Watanabe, Shuichi Ichikawa
  • Patent number: 8039084
    Abstract: There is disclosed a honeycomb structure 1 having a plurality of cells 4 partitioned by cell walls 2 to function as fluid passages, a predetermined cell 4 being plugged by a plugging material at one end face, a remaining cell 4 being plugged by the plugging material at the other end face, wherein a Young's modulus of the plugging material is lower than that of the cell wall 2. A strength of the plugging material is lower than that of the cell wall. A porosity of the plugging material is 97% or more of that of the cell wall. There is provided a honeycomb structure whose end face is not easily cracked and which is superior in durability.
    Type: Grant
    Filed: November 17, 2003
    Date of Patent: October 18, 2011
    Assignee: NGK Insulators, Ltd.
    Inventors: Atsushi Kaneda, Naoshi Masukawa, Shuichi Ichikawa
  • Patent number: 8039085
    Abstract: There is provided a honeycomb structure 10 comprising a honeycomb segment joined body 10 having a plurality of honeycomb segments 2 integrally joined with one another at a joint face of each of the honeycomb segments by means of a bonding material layer 9 and having a plurality of cells 5 functioning as fluid passages disposed in parallel with one another in a direction of central axis. Porosity in an outside portion of the bonding material layer 9 (portion from the interface of the joint face of honeycomb segments to the point corresponding to 20% thickness of the total bonding material layer) is smaller than that in the central portion located on the inner side of the outside portion.
    Type: Grant
    Filed: March 7, 2006
    Date of Patent: October 18, 2011
    Assignee: NGK Insulators, Ltd.
    Inventors: Syuichi Ichikawa, Koichi Iwata, Naoshi Masukawa, Atsushi Watanabe
  • Patent number: 8039087
    Abstract: There is disclosed a honeycomb structure 1 having a plurality of cells 4 partitioned by cell walls 2 to function as fluid passages, a predetermined cell 4 being plugged by a plugging material at one end face, a remaining cell 4 being plugged by the plugging material at the other end face, wherein a Young's modulus of the plugging material is lower than that of the cell wall 2. A strength of the plugging material is lower than that of the cell wall. A porosity of the plugging material is 97% or more of that of the cell wall. There is provided a honeycomb structure whose end face is not easily cracked and which is superior in durability.
    Type: Grant
    Filed: December 5, 2008
    Date of Patent: October 18, 2011
    Assignee: NGK Insulators, Ltd.
    Inventors: Atsushi Kaneda, Naoshi Masukawa, Shuichi Ichikawa
  • Patent number: 7947103
    Abstract: Disclosed is a honeycomb structure which is bonded with a bonding material containing 0.1 to 10 mass % of a layered clay mineral. Also disclosed are a honeycomb structure which is bonded with a bonding material containing 0.1 to 10 mass % of an organic binder, and a honeycomb structure which is bonded with a bonding material having a Casson yield value of 6 Pa or more. Further disclosed is a method for producing such a honeycomb structure.
    Type: Grant
    Filed: September 22, 2008
    Date of Patent: May 24, 2011
    Assignee: MGK Insulators, Ltd.
    Inventors: Naoshi Masukawa, Atsushi Watanabe, Shuichi Ichikawa
  • Patent number: 7754309
    Abstract: A ceramic honeycomb structure body (1) including a configuration in which a plurality of porous honeycomb segments (2) are bound one another with an adhesive layer (3) interposed between each two neighboring porous honeycomb segments (2), where a plurality of protrusion portions (4) fixed to one of the adhesion surfaces (2a, 2b) respectively of two honeycomb segments (2, 2) opposed to each other with the adhesive layer (3) interposed between the two honeycomb segments (2, 2) are embedded into the adhesive layer (3).
    Type: Grant
    Filed: January 14, 2004
    Date of Patent: July 13, 2010
    Assignee: NGK Insulators, Ltd.
    Inventors: Jun Fujita, Naoshi Masukawa, Takashi Harada
  • Patent number: 7670664
    Abstract: In a honeycomb structure 1 which is made of a ceramic and in which a plurality of honeycomb segments 12 having cell structures 5 and porous outer walls 7 on outer peripheries of the cell structures 5 are integrated by bonding these outer walls 7 to one another with a bonding material 8, each of the cell structures being provided with a plurality of cells 3 constituting fluid channels divided by porous partition walls 2, a base material constituting the honeycomb structure 1 has a thermal conductivity of 0.1 to 20 W/mK. Moreover, an outer periphery coating material constituting the outer peripheral wall of the honeycomb structure 1 has a porosity of 10 to 60%. Furthermore, the outer periphery coating material constituting the outer peripheral wall of the honeycomb structure 1 has a thermal conductivity of 0.01 to 0.5 W/mK.
    Type: Grant
    Filed: September 26, 2008
    Date of Patent: March 2, 2010
    Assignee: NGK Insulators, Ltd.
    Inventors: Atsushi Watanabe, Naoshi Masukawa, Shuichi Ichikawa
  • Patent number: 7556703
    Abstract: A method of bonding at least a first ceramics structure (101) to a second ceramics structure (102), which includes the steps of applying a pressure to the first ceramics structure (101) and the second ceramics structure (102) in such a direction that these structures move close to each other with a bonding material layer (110) interposed between the first ceramics structure (101) and the second ceramics structure (102) (FIG. A), removing a bonding material (111a) extruded from the bonding material layer (110) to an end face of a stacked body including the first ceramics structure (101) and the second ceramics structure (102) by the application of the pressure thereto (FIG. B), drying a bonding material (111b) near the end face of the stacked body (120) after the extruded bonding material (111a) is removed (FIG. C), and drying the entire part of the stacked body (120).
    Type: Grant
    Filed: March 25, 2004
    Date of Patent: July 7, 2009
    Assignee: NGK Insulators, Ltd.
    Inventors: Jun Fujita, Naoshi Masukawa
  • Publication number: 20090098336
    Abstract: There is disclosed a honeycomb structure 1 having a plurality of cells 4 partitioned by cell walls 2 to function as fluid passages, a predetermined cell 4 being plugged by a plugging material at one end face, a remaining cell 4 being plugged by the plugging material at the other end face, wherein a Young's modulus of the plugging material is lower than that of the cell wall 2. A strength of the plugging material is lower than that of the cell wall. A porosity of the plugging material is 97% or more of that of the cell wall. There is provided a honeycomb structure whose end face is not easily cracked and which is superior in durability.
    Type: Application
    Filed: December 5, 2008
    Publication date: April 16, 2009
    Applicant: NGK Insulators, Ltd.
    Inventors: Atsushi Kaneda, Naoshi Masukawa, Shuichi Ichikawa
  • Patent number: 7510755
    Abstract: There is provided a honeycomb structured body having improved durability in a honeycomb structure body obtained by unitarily bonding a plurality of honeycomb segments. There is provided a honeycomb structure body 1 including a plurality of honeycomb segments 12 each having an outer wall 7, partition walls 2 disposed in the outer wall 7, and a plurality of cells 3 separated from each other by the partition walls 2 and extending in an axial direction, a bonding layer 8 interposed between the plurality of honeycomb segments 12 to unitarily bond the honeycomb segments 12, and an intermediate layer 9 interposed between the bonding layer 8 and the honeycomb segments 9. In the honeycomb structure body 1, pores having a diameter of 0.5 ?m or more of the intermediate layer 9 occupies 25% by volume or less of the whole volume of the intermediate layer 9.
    Type: Grant
    Filed: April 27, 2005
    Date of Patent: March 31, 2009
    Assignee: NGK Insulators, Ltd.
    Inventors: Naoshi Masukawa, Shuichi Ichikawa
  • Publication number: 20090035512
    Abstract: The present invention provides: a honeycomb structure produced by bonding with a bonding material containing 0.1 mass % or more of a heat-gelling organic binder having a thickening-initiating temperature of 75° C. or lower, or a honeycomb structure produced by bonding with a thermosetting resin; and a process for producing a honeycomb structure, which comprises a bonding step of coating a bonding material containing 0.1 mass % or more of a heat-gelling organic binder having a thickening-initiating temperature of 75° C. or lower, on the porous outer wall provided at the periphery of each cell structure, drying the coated bonding material at a temperature of 100° C. or higher to form a bonding layer, and bonding the outer walls to each other via the bonding layer.
    Type: Application
    Filed: September 18, 2008
    Publication date: February 5, 2009
    Applicant: NGK INSULATORS, LTD.
    Inventors: Naoshi MASUKAWA, Atsushi WATANABE, Shuichi ICHIKAWA
  • Publication number: 20090029104
    Abstract: A honeycomb structure 1 comprising a honeycomb segment bonded body 10 having a number of honeycomb segments 2 integrated on each bonding planes via bonding material layers 9 has a structure so that a number of cells 5 providing fluid flow channels are disposed in parallel in the direction of center axis thereof. The honeycomb structure 1 is constructed so that the porosity of an outer portion of the bonding material layers 9 (an area from the interface with the honeycomb segment-bonding plane to a point apart from that interface by a distance equivalent to 20% of the entire layer thickness) is smaller than the porosity of a central portion located inward of the outer portion, and so that the bonding material layers 9 have a compression Young's modulus along the Z-axis of 5 to 100 MPa.
    Type: Application
    Filed: September 18, 2008
    Publication date: January 29, 2009
    Applicant: NGK INSULATORS, LTD.
    Inventors: Koichi IWATA, Naoshi MASUKAWA, Atsushi WATANABE, Shuichi ICHIKAWA
  • Publication number: 20090029105
    Abstract: Disclosed is a honeycomb structure which is bonded with a bonding material containing 0.1 to 10 mass % of a layered clay mineral. Also disclosed are a honeycomb structure which is bonded with a bonding material containing 0.1 to 10 mass % of an organic binder, and a honeycomb structure which is bonded with a bonding material having a Casson yield value of 6 Pa or more. Further disclosed is a method for producing such a honeycomb structure.
    Type: Application
    Filed: September 22, 2008
    Publication date: January 29, 2009
    Applicant: NGK INSULATORS, LTD.
    Inventors: Naoshi MASUKAWA, Atsushi WATANABE, Shuichi ICHIKAWA
  • Publication number: 20090022944
    Abstract: In a honeycomb structure 1 which is made of a ceramic and in which a plurality of honeycomb segments 12 having cell structures 5 and porous outer walls 7 on outer peripheries of the cell structures 5 are integrated by bonding these outer walls 7 to one another with a bonding material 8, each of the cell structures being provided with a plurality of cells 3 constituting fluid channels divided by porous partition walls 2, a base material constituting the honeycomb structure 1 has a thermal conductivity of 0.1 to 20 W/mK. Moreover, an outer periphery coating material constituting the outer peripheral wall of the honeycomb structure 1 has a porosity of 10 to 60%. Furthermore, the outer periphery coating material constituting the outer peripheral wall of the honeycomb structure 1 has a thermal conductivity of 0.01 to 0.5 W/mK.
    Type: Application
    Filed: September 26, 2008
    Publication date: January 22, 2009
    Applicant: NGK INSULATORS, LTD.
    Inventors: Atsushi WATANABE, Naoshi MASUKAWA, Shuichi ICHIKAWA
  • Publication number: 20090011178
    Abstract: There is disclosed a honeycomb structure 1 which is made of a ceramic material and in which a plurality of honeycomb segments 12 having cell structures 5 and porous outer walls 7 on outer peripheries of the cell structures 5 are integrated by bonding the outer walls 7 to one another with a bonding material, each of the cell structures being provided with a plurality of cells 3 constituting fluid channels divided by porous partition walls 2, wherein the bonding material contains a bio-soluble fiber. The honeycomb structure 1 of the present invention has a performance equivalent to that of a honeycomb structure in which a heretofore used ceramic fiber is contained.
    Type: Application
    Filed: September 4, 2008
    Publication date: January 8, 2009
    Applicants: NGK INSULATORS, LTD., NGK ADREC CO., LTD.
    Inventors: Naoshi MASUKAWA, Atsushi WATANABE, Shuichi ICHIKAWA, Osamu YAMAKAWA, Tetsuhiro HONJO
  • Patent number: 7455710
    Abstract: A honeycomb structure includes honeycomb segments separated by porous partitions and having circulation holes through the honeycomb segments in an axial direction; a spacer positioned between neighboring honeycomb segments of the honeycomb segments; and a bonding layer located between honeycomb segments where the spacers are positioned and bonding the neighboring honeycomb segments. The spacer has Young's modulus in a range of 0.1 to 1.5 GPa. A ratio of area of the spacer to area of the bonding layer between the neighboring honeycomb segments is in a range of 0.2 to 30%.
    Type: Grant
    Filed: March 18, 2004
    Date of Patent: November 25, 2008
    Assignee: NGK Insulators, Ltd.
    Inventors: Naoshi Masukawa, Shuichi Ichikawa
  • Patent number: 7435279
    Abstract: The honeycomb structure of the present invention has a construction wherein a plurality of cells 5 each functioning as a passage of a fluid, surrounded by porous partition walls 6 are arranged so as to be parallel to each other in the central axis direction of the honeycomb structure, and has such a constitution that a plurality of honeycomb segments 2 are bonded integrally by a bonding material 9 containing a ceramic as a main component and a particulate filler. In the honeycomb structure, generation of drawbacks such as peeling of bonded area, cracking and the like is suppressed reliably, and the honeycomb structure is superior in durability.
    Type: Grant
    Filed: November 11, 2004
    Date of Patent: October 14, 2008
    Assignee: NGK Insulators, Ltd.
    Inventors: Naoshi Masukawa, Shuichi Ichikawa
  • Publication number: 20080187712
    Abstract: There is provided a honeycomb structure 10 comprising a honeycomb segment joined body 10 having a plurality of honeycomb segments 2 integrally joined with one another at a joint face of each of the honeycomb segments by means of a bonding material layer 9 and having a plurality of cells 5 functioning as fluid passages disposed in parallel with one another in a direction of central axis. Porosity in an outside portion of the bonding material layer 9 (portion from the interface of the joint face of honeycomb segments to the point corresponding to 20% thickness of the total bonding material layer) is smaller than that in the central portion located on the inner side of the outside portion.
    Type: Application
    Filed: March 7, 2006
    Publication date: August 7, 2008
    Inventors: Syuichi Ichikawa, Koichi Iwata, Naoshi Masukawa, Atsushi Watanabe
  • Patent number: 7396576
    Abstract: The present invention provides a honeycomb structure in which a plurality of honeycomb segments each constituted by a cell structure having a plurality of cells divided from each other by partition walls and functioning as a passage for fluid and an outer wall provided at the circumference of the cell structure are bonded to each other at the outer walls by a bonding layer made of a bonding agent and converted into one piece, which honeycomb structure is characterized in that the bonding agent does not contain inorganic particles having diameters (?m) of at least 1.1 times the average surface roughness Ra (?m) of the outer wall, in an amount exceeding 30% by mass relative to the total of the bonding agent. In the honeycomb structure, the honeycomb segments as a constituent are strongly bonded to each other by a bonding agent and converted into one piece.
    Type: Grant
    Filed: October 3, 2003
    Date of Patent: July 8, 2008
    Assignee: NGK Insulators, Ltd.
    Inventors: Naoshi Masukawa, Shuichi Ichikawa