Abstract: A lithography apparatus that transfers a pattern of an original to a substrate, includes a stage mechanism including a stage configured to hold the substrate, and an encoder system including an encoder head and an encoder scale. The stage includes a scale holding portion configured to hold the encoder scale by an attraction force. The scale holding portion includes a plurality of attractors capable of individually controlling attraction.

Abstract: The present invention provides an imprint apparatus that forms a pattern in an imprint material on a substrate using a mold including a pattern region, the apparatus comprising: a stage configured to be movable while holding the substrate; and a dispenser configured to discharge the imprint material, wherein a sensor, a receptor, and a mark are provided around a holding region where the substrate is held, in an upper surface of the stage, and the upper surface of the stage includes a first region that passes below the pattern region during movement of the stage between a position below the dispenser and a position below the mold, and a second region that does not pass below the pattern region during the movement, and the sensor, the receptor, and the mark are arranged in the second region.

Abstract: The present invention provides a lithography apparatus for performing a process of transferring a pattern of an original to each of shot regions two-dimensionally arrayed on a substrate, including a stage that moves while holding one of the substrate and the original, a measurement unit configured to measure, when performing the process, a positional shift amount between a mark provided on the original and a mark provided in each of the shot regions, and a control unit configured to control the process for the shot region so that after the process is performed successively for a plurality of first shot regions included in a first row, the process is performed successively for a plurality of second shot regions included in a second row adjacent to the first row.

Abstract: The present invention provides an imprint method of forming, using a mold, a pattern of an imprint material on a substrate having a dimension smaller than a dimension of a holding surface of a substrate stage, comprising: causing the holding surface to hold a plate; causing the plate to support the substrate, by causing the holding surface to hold the substrate by via the plate; bringing the mold into contact with the imprint material on the substrate; curing the imprint material on the substrate; and separating the mold from the cured imprint material, wherein holding of the plate by the substrate stage is controlled while maintaining supporting of the substrate by the plate, such that the substrate is deformed into a convex shape together with the plate upon in the separating.

Abstract: An imprint apparatus forms a pattern on a substrate by an imprint process which includes a process of bringing an imprint material on the substrate into contact with a mold, a process of curing the imprint material, and a separating process of separating a cured product of the imprint material and the mold. The apparatus includes a substrate holding mechanism which includes a substrate chuck configured to chuck the substrate by sucking the substrate. The substrate chuck has a through hole, and the substrate holding mechanism suppresses a state in which a suction force by which the substrate chuck sucks the substrate is reduced due to the through hole and a gap which is formed between a back surface of the substrate and an upper surface of the substrate chuck in the separating process.

Abstract: The present invention provides a lithography apparatus for performing a process of transferring a pattern of an original to each of shot regions two-dimensionally arrayed on a substrate, including a stage that moves while holding one of the substrate and the original, a measurement unit configured to measure, when performing the process, a positional shift amount between a mark provided on the original and a mark provided in each of the shot regions, and a control unit configured to control the process for the shot region so that after the process is performed successively for a plurality of first shot regions included in a first row, the process is performed successively for a plurality of second shot regions included in a second row adjacent to the first row.

Abstract: The present invention provides an imprint apparatus that forms a pattern in an imprint material on a substrate using a mold including a pattern region, the apparatus comprising: a stage configured to be movable while holding the substrate; and a dispenser configured to discharge the imprint material, wherein a sensor, a receptor, and a mark are provided around a holding region where the substrate is held, in an upper surface of the stage, and the upper surface of the stage includes a first region that passes below the pattern region during movement of the stage between a position below the dispenser and a position below the mold, and a second region that does not pass below the pattern region during the movement, and the sensor, the receptor, and the mark are arranged in the second region.

Abstract: The present invention provides a lithography apparatus for performing a process of transferring a pattern of an original to each of shot regions two-dimensionally arrayed on a substrate, including a stage that moves while holding one of the substrate and the original, a measurement unit configured to measure, when performing the process, a positional shift amount between a mark provided on the original and a mark provided in each of the shot regions, and a control unit configured to control the process for the shot region so that after the process is performed successively for a plurality of first shot regions included in a first row, the process is performed successively for a plurality of second shot regions included in a second row adjacent to the first row.

Abstract: The present invention provides a lithography apparatus for performing a process of transferring a pattern of an original to each of shot regions two-dimensionally arrayed on a substrate, including a stage that moves while holding one of the substrate and the original, a measurement unit configured to measure, when performing the process, a positional shift amount between a mark provided on the original and a mark provided in each of the shot regions, and a control unit configured to control the process for the shot region so that after the process is performed successively for a plurality of first shot regions included in a first row, the process is performed successively for a plurality of second shot regions included in a second row adjacent to the first row.

Abstract: An imprint apparatus forms a pattern on a substrate by an imprint process which includes a process of bringing an imprint material on the substrate into contact with a mold, a process of curing the imprint material, and a separating process of separating a cured product of the imprint material and the mold. The apparatus includes a substrate holding mechanism which includes a substrate chuck configured to chuck the substrate by sucking the substrate. The substrate chuck has a through hole, and the substrate holding mechanism suppresses a state in which a suction force by which the substrate chuck sucks the substrate is reduced due to the through hole and a gap which is formed between a back surface of the substrate and an upper surface of the substrate chuck in the separating process.

Abstract: The present invention provides a drawing apparatus for performing drawing on a substrate with a charged particle beam, the apparatus comprising an optical system configured to irradiate the substrate with the charged particle beam, a substrate stage configured to hold the substrate, an aperture member provided with the substrate stage, a detector configured to detect a charged particle beam having passed through an aperture of the aperture member, and a support configured to support the detector, wherein the support and the substrate stage are separated from each other.

Abstract: The present invention provides a drawing apparatus for performing drawing on a substrate with a charged particle beam, the apparatus comprising an optical system configured to irradiate the substrate with the charged particle beam, a substrate stage configured to hold the substrate, an aperture member provided with the substrate stage, a detector configured to detect a charged particle beam having passed through an aperture of the aperture member, and a support configured to support the detector, wherein the support and the substrate stage are separated from each other.

Abstract: A load-lock apparatus includes a housing having a movable member, a first opening to allow a load-lock chamber to communicate with a processing chamber and a second opening, different from the first opening. The housing defines a volume of the load-lock chamber. A driving mechanism drives the movable member. A first gate valve is provided at the first opening, a second gate valve is provided at the second opening, and a pump reduces a pressure in the load-lock chamber. The driving mechanism drives the movable member, after loading an object into the load-lock chamber and before unloading the object from the load-lock chamber, to change the volume of the load-lock chamber.

Abstract: A stage apparatus includes a base, a stage movable on the base in first and second directions, a first member movable relative to the base in the first direction, and a second member movable relative to the base in the second direction. The first member is placed on the second member. With this arrangement, drive reaction-forces generated due to movement of the stage can be canceled by moving the first and second members, resulting in a smaller space needed for accommodating a canceling mechanism.

Abstract: The start of exposure or a process delays because reference alignment such as abutment must be executed along the optical axis after a substrate stage is moved between the exposure position and the processing position. To solve this problem, an exposure apparatus according to this invention includes an exposure optical system which exposes a substrate to a pattern, a substrate processing system which performs a predetermined process for the substrate at a position apart from the exposure optical system, a substrate stage which moves along a plane perpendicular to the optical axis of the exposure optical system, and a measurement device which continuously measures the position of the substrate stage along the optical axis in the moving range of the substrate stage while the substrate stage moves from below the substrate processing system to below the exposure optical system.

Abstract: A load-lock apparatus comprises a housing including a movable member and configured to define a volume of a load-lock chamber, and a driving mechanism configured to drive the movable member. The driving mechanism is configured to drive the movable member, after loading an object into the load-lock chamber and before unloading the object from the load-lock chamber, to change the volume of the load-lock chamber.

Abstract: A stage apparatus includes a base, a stage movable on the base in first and second directions, a first member movable relative to the base in the first direction, and a second member movable relative to the base in the second direction. The first member is placed on the second member. With this arrangement, drive reaction-forces generated due to movement of the stage can be canceled by moving the first and second members, resulting in a smaller space needed for accommodating a canceling mechanism.

Abstract: The start of exposure or a process delays because reference alignment such as abutment must be executed along the optical axis after a substrate stage is moved between the exposure position and the processing position. To solve this problem, an exposure apparatus according to this invention includes an exposure optical system which exposes a substrate to a pattern, a substrate processing system which performs a predetermined process for the substrate at a position apart from the exposure optical system, a substrate stage which moves along a plane perpendicular to the optical axis of the exposure optical system, and a measurement device which continuously measures the position of the substrate stage along the optical axis in the moving range of the substrate stage while the substrate stage moves from below the substrate processing system to below the exposure optical system.

Abstract: A substrate temperature adjustment apparatus includes a temperature adjustment device for adjusting a temperature of a substrate, and a temperature measurement device for measuring a temperature of the temperature adjustment device, when the temperature is out of a target temperature range. The time taken until the temperature of the substrate falls within the target temperature range is predicted on the basis of the temperature of the temperature adjustment device measured by the temperature measurement device.

Abstract: A temperature adjustment time of a wafer (6) as a substrate is determined by a temperature adjustment unit (1) for performing temperature adjustment of the substrate and a temperature sensor (5) serving as a temperature measurement unit for measuring the temperature of a plate (2) included in the temperature adjustment unit (1) and on the basis of the measured temperature of the plate (2). The initial temperature of the wafer (6) is estimated on the basis of the temperature measurement result of the plate (2) obtained by the temperature sensor (5). The temperature adjustment time of the wafer (6) upon a lapse of a predetermined period of time is determined on the basis of the temperature of the plate (2) obtained the predetermined period of time after the wafer (6) is placed on the plate (2).