Abstract: In a semiconductor laser device, a supply path that guides a cooling fluid supplied from a supply port side, toward a disposition region, spray holes that spray the cooling fluid guided by the supply path, from below the disposition region, and a discharge path that guides the cooling fluid sprayed from the spray holes, toward a discharge port are provided within a body portion of a heat sink. The spray holes are disposed along a resonance direction of a semiconductor laser element disposed in the disposition region, and the discharge path extends in a direction intersecting with the resonance direction of the semiconductor laser element disposed in the disposition region.

Abstract: A QCL module according to an embodiment includes a package accommodating a QCL element and provided with a window material for extracting a laser beam emitted from the QCL element to the outside, a lens hold member for holding a lens on which the laser beam output from the window material is incident, a cooling fan for cooling the package, and a base for holding the package, the lens hold member, and the cooling fan. The package and the lens hold member are fastened together to the base by a common screw member.

Abstract: A quantum-cascade laser element includes: a semiconductor substrate; a semiconductor mesa formed on the semiconductor substrate to include an active layer having a quantum-cascade structure and to extend along a light waveguide direction; an embedding layer formed to interpose the semiconductor mesa along a width direction of the semiconductor substrate; a cladding layer formed over the semiconductor mesa and over the embedding layer; and a metal layer formed on the cladding layer. A pair of groove portions extending along the light waveguide direction are formed in a surface on an opposite side of the cladding layer from the semiconductor substrate. The pair of groove portions are disposed in two respective outer regions when the cladding layer is equally divided into four regions in the width direction of the semiconductor substrate. The metal layer enters the pair of groove portions.

Abstract: A quantum cascade laser device includes a QCL element; a lens; and a lens holder having a small-diameter hole, a large-diameter hole, and a counterbore surface. At least a part of a side surface of the lens is fixed to an inner surface of the large-diameter hole in a state where an edge portion of an incident surface of the lens is in contact with the counterbore surface. A central axis of the small-diameter hole is eccentric from that of the large-diameter hole. The side surface of the lens is positioned with respect to the inner surface of the large-diameter hole along a direction from the central axis of the large-diameter hole toward the central axis of the small-diameter hole. A central axis of the lens is disposed at a position closer to the central axis of the small-diameter hole than to the central axis of the large-diameter hole.

Abstract: A beating spectroscopy device includes: first and second quantum cascade lasers; a quantum cascade detector; and a sample holder configured to hold a sample on an optical path between the second quantum cascade laser and the quantum cascade detector. Lights from the first and second quantum cascade lasers are detected by the quantum cascade detector while a wavelength of the light from the second quantum cascade laser is changed to scan a frequency of a beating signal having a frequency in accordance with a wavelength difference between the lights from the first and second quantum cascade lasers.

Abstract: An external resonance-type laser module includes: a quantum cascade laser; a MEMS diffraction grating including a movable portion capable of swinging around an axis and a diffraction grating portion formed on the movable portion; and a lens. The diffraction grating portion includes a plurality of lattice grooves arranged in a first direction and each of the plurality of lattice grooves extends in a second direction perpendicular to the first direction. The MEMS diffraction grating is disposed such that a normal line of the diffraction grating portion is inclined with respect to an end surface and the first direction is along a lamination direction of a laminated structure when viewed in a direction perpendicular to the end surface. A length of the diffraction grating portion in the first direction exceeds a length of the diffraction grating portion in the second direction.

Abstract: The laser module includes a QCL element, a MEMS diffraction grating, a lens holder for holding a lens disposed between the QCL element and the MEMS diffraction grating, and a package. The package includes a bottom wall, a side wall erected on the bottom wall and formed in an annular shape so as to surround a region in which the QCL element is accommodated, and a top wall closing an opening of the side wall on a side opposite to a side where the bottom wall is disposed. The top wall faces the bottom wall in a direction orthogonal to the optical axis direction of the lens, and the distance between the top wall and a surface of the lens holder on a side where the top wall is disposed is smaller than a thickness of the lens holder along the optical axis direction of the lens.

Abstract: The laser module includes a QCL element, a MEMS diffraction grating, a first lens holder disposed on a side opposite to a side on which the MEMS diffraction grating is disposed with respect to the QCL element, a second lens holder disposed between the QCL element and the MEMS diffraction grating, a package, an electrode terminal disposed along an inner wall surface of the package, and a wire for electrically connecting the electrode terminal and the QCL element. An end portion of the wire on a side where the QCL element is disposed is disposed at a position between the first lens holder and the second lens holder when viewed from a direction orthogonal to a facing direction in which the first lens holder and the second lens holder face each other.

Abstract: The laser module includes a QCL element, a MEMS diffraction grating, a lens holder holding a lens disposed between the QCL element and the MEMS diffraction grating, a package, an electrode terminal disposed along an inner wall surface of the package, and a wire for electrically connecting the electrode terminal and a coil. The top wall of the package faces the bottom wall of the package in a direction orthogonal to the optical axis direction of the lens. The MEMS diffraction grating includes an electrode pad electrically connected to the coil. The electrode pad is connected to the electrode terminal via the wire. A height position of the electrode pad with respect to the bottom wall is equal to or higher than a height position of the electrode terminal with respect to the bottom wall.

Abstract: An external resonance-type laser module includes: a quantum cascade laser; a MEMS diffraction grating including a movable portion capable of swinging around an axis and a diffraction grating portion formed on the movable portion; a lens; a magnet; and a yoke. The MEMS diffraction grating includes a pair of coils respectively disposed on one side and the other side with respect to the axis when viewed in a normal direction parallel to a normal line of the diffraction grating portion, and each of the pair of coils includes an inside part extending along the axis. A recess portion is formed in the magnet, and at least a part of the recess portion overlaps the inside part when viewed in the normal direction.

Abstract: A light source module includes a light source; an optical fiber configured to guide light output from the light source; a pair of holding members configured to hold both ends of a first portion of the optical fiber such that the first portion extends linearly; a first vibrator configured to vibrate the first portion along a first direction intersecting an extending direction of the first portion; and a second vibrator configured to vibrate the first portion along a second direction intersecting the extending direction and differing from the first direction.

Abstract: A quantum cascade laser device has a light-absorbing cover member located between one emission end face of a quantum cascade laser element and an emission window of a housing. The emission end face and an opposing surface of a submount with respect to the cover member are flush with each other. The cover member has an opening at a position opposing the emission end face. The opening has a tapered first opening part increasing its diameter from the emission end face side to the emission window side and a second opening part formed with a fixed diameter not smaller than the smallest diameter of the first opening part.

Abstract: A wavelength variable light source includes a housing, a heat sink disposed in the housing, an excitation light source disposed on the heat sink and configured to output excitation light, a gain medium disposed on the heat sink and including an active layer and a lower DBR, a MEMS mechanism including a movable film facing the gain medium via a gap, disposed on the gain medium, and configured to control the gap, an upper DBR provided in the movable film and configuring a resonator together with the lower DBR, a reflector configured to reflect the excitation light output from the excitation light source toward the gain medium in the housing, and a window formed in the housing and configured to transmit light output from the gain medium.

Abstract: A dental therapy apparatus which enables a dental therapy more surely and less invasively is provided. A dental therapy apparatus (10A) comprises a laser light source (11) emitting laser light (L) having a wavelength within a wavelength region of 5.7 to 6.6 ?m; a controller (12) pulse-driving the laser light source and controlling at least one of pulse width and repetition frequency of pulsed laser light emitted from the laser light source; and an irradiation optical system for irradiating a tooth (20) including a carious part (21) with the light emitted from the laser light source. In this dental therapy apparatus, the controller controls at least one of the pulse width and repetition frequency of the pulsed light, so as to selectively cut the carious part (21).

Abstract: A quantum cascade laser device has a light-absorbing cover member located between one emission end face of a quantum cascade laser element and an emission window of a housing. The emission end face and an opposing surface of a submount with respect to the cover member are flush with each other. The cover member has an opening at a position opposing the emission end face. The opening has a tapered first opening part increasing its diameter from the emission end face side to the emission window side and a second opening part formed with a fixed diameter not smaller than the smallest diameter of the first opening part.

Abstract: A wavelength variable light source includes a housing, a heat sink disposed in the housing, an excitation light source disposed on the heat sink and configured to output excitation light, a gain medium disposed on the heat sink and including an active layer and a lower DBR, a MEMS mechanism including a movable film facing the gain medium via a gap, disposed on the gain medium, and configured to control the gap, an upper DBR provided in the movable film and configuring a resonator together with the lower DBR, a reflector configured to reflect the excitation light output from the excitation light source toward the gain medium in the housing, and a window formed in the housing and configured to transmit light output from the gain medium.

Abstract: A quantum cascade laser manufacturing method includes: a step of pressing a mother stamper against a resin film having flexibility to make a resin stamper 201 having a second groove pattern P2; a step of making a wafer with an active layer formed on a semiconductor substrate; a step of forming a resist film 304 on a surface on the active layer side of the wafer; a step of pressing the resin stamper against the resist film 304 by air pressure to form a third groove pattern P3 on the resist film 304; and a step of etching the wafer with the resist film 304 serving as a mask to form a diffraction grating on a surface of the wafer.

Abstract: A quantum cascade laser is configured with a semiconductor substrate and first and second active layers provided in series on the substrate. A unit laminate structure of the first active layer has a subband level structure having an emission upper level and an emission lower level, and is configured so as to be able to generate light of a first frequency ?1, a unit laminate structure of the second active layer has a subband level structure having a first emission upper level, a second emission upper level, and a plurality of emission lower levels, and is configured so as to be able to generate light of a second frequency ?2, and light of a difference frequency ? is generated by difference frequency generation from the light of the first frequency ?1 and the light of the second frequency ?2.

Abstract: A quantum cascade laser is configured with a semiconductor substrate and first and second active layers provided in series on the substrate. A unit laminate structure of the first active layer has a subband level structure having an emission upper level and an emission lower level, and is configured so as to be able to generate light of a first frequency ?1, a unit laminate structure of the second active layer has a subband level structure having a first emission upper level, a second emission upper level, and a plurality of emission lower levels, and is configured so as to be able to generate light of a second frequency ?2, and light of a difference frequency ? is generated by difference frequency generation from the light of the first frequency ?1 and the light of the second frequency ?2.

Abstract: A quantum cascade laser includes a semiconductor substrate, and an active layer being provided on the substrate, and having a cascade structure in which quantum well emission layers and injection layers are alternately laminated, and the laser has a base portion including the substrate, and a stripe-shaped ridge portion including the active layer. Further, a reflection control film is formed from a ridge end face over a base end face on an end face in a resonating direction of the laser, and, on the base end face, for a second side and a third side adjacent to a first side on the ridge portion side of the base end face, and a fourth side facing the first side, the reflection control film is formed on a region other than regions near those three sides with predetermined widths.