Patents by Inventor Naotaka Ikawa
Naotaka Ikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10483061Abstract: A protection device including: (i) a protection component having a first thermal fuse and a resistive body, the resistive body being supplied with a current in an abnormal state to generate heat, the heat activating the first thermal fuse to cut off the current; (ii) a PTC component; and (iii) a second thermal fuse, the second thermal fuse being electrically connected in series to the PTC component, the first thermal fuse of the protection component being electrically connected in parallel to the PTC component and to the second thermal fuse, and the protection component being activated in the abnormal state so that the PTC component trips to generate heat, the heat blowing the second thermal fuse.Type: GrantFiled: July 1, 2014Date of Patent: November 19, 2019Assignee: LITTELFUSE JAPAN G.K.Inventors: Takayuki Yokota, Masaaki Iwai, Hirotsugu Takegawa, Naotaka Ikawa
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Publication number: 20180040443Abstract: The object of the present invention is to provide a protection device capable of sufficiently suppressing the occurrence of arc at the time of activation with large rated voltage and rated current, as well as capable of fully opening the circuit. The present invention provides a protection device comprising: (i) a protection component comprising a first thermal fuse and a resistive body, the resistive body being supplied with a current in an abnormal state to generate heat, the heat activating the first thermal fuse to cut off the current; (ii) a PTC component; and (iii) a second thermal fuse, the second thermal fuse being electrically connected in series to the PTC component, the first thermal fuse of the protection component being electrically connected in parallel to the PTC component and to the second thermal fuse, and the protection component being activated in the abnormal state so that the PTC component trips to generate heat, the heat blowing the second thermal fuse.Type: ApplicationFiled: July 1, 2014Publication date: February 8, 2018Applicants: Tyco Electronics Japan G.K., Uchihashi Estec Co., Ltd.Inventors: Takayuki Yokota, Masaaki Iwai, Hirotsugu Takegawa, Naotaka Ikawa
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Patent number: 9595768Abstract: A glazing is disclosed comprising at least one ply of glass having an electrically conductive component on at least one surface, and an electrical connector electrically connected to the electrically conductive component through a soldered joint, the solder of the joint having a composition comprising 0.5 wt % or more indium, wherein the electrical connector comprises a nickel plated contact for contacting the solder. Also disclosed are solders having a composition comprising 14 to 75 wt % In, 14 to 75 wt % Sn, to 5 wt % Ag, to 5 wt % Ni, and less than 0.1 wt % Pb. Also disclosed is use of a solder having a composition comprising 0.5 wt % or more indium to solder a nickel plated electrical connector to an electrically conductive component on the surface of a ply of glass. The aspects of the invention improve the durability of electrical connections on glazing.Type: GrantFiled: May 2, 2012Date of Patent: March 14, 2017Assignees: Pilkington Group Limited, Nippon Sheet Glass Co. Ltd., Nishinihon Shoko Co., Ltd.Inventors: Michael Lyon, Naotaka Ikawa, Kazuo Inada, Mamoru Yoshida, Takashi Muromachi, Kazuhisa Ono, Kozo Okamoto, Takashi Suzuki
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Publication number: 20140138155Abstract: A glazing is disclosed comprising at least one ply of glass having an electrically conductive component on at least one surface, and an electrical connector electrically connected to the electrically conductive component through a soldered joint, the solder of the joint having a composition comprising 0.5 wt % or more indium, wherein the electrical connector comprises a nickel plated contact for contacting the solder. Also disclosed are solders having a composition comprising 14 to 75 wt % In, 14 to 75 wt % Sn, to 5 wt % Ag, to 5 wt % Ni, and less than 0.1 wt % Pb. Also disclosed is use of a solder having a composition comprising 0.5 wt % or more indium to solder a nickel plated electrical connector to an electrically conductive component on the surface of a ply of glass. The aspects of the invention improve the durability of electrical connections on glazing.Type: ApplicationFiled: May 2, 2012Publication date: May 22, 2014Applicants: PILKINGTON GROUP LIMITED, NIPPON SHEET GLASS CO., LTD., UCHIHASHI ESTEC CO., LTD., NISHINIHON SHOKO CO., LTDInventors: Michael Lyon, Naotaka Ikawa, Kazuo Inada, Mamoru Yoshida, Takashi Muromachi, Kazuhisa Ono, Kozo Okamoto, Takashi Suzuki
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Publication number: 20070188292Abstract: An alloy type thermal fuse is provided in which, although a fuse element essentially comprising an In-Sn alloy is used, shear breakage at the melting point or lower can be prevented from occurring even under long-term DC application, the operation stability to a heat cycle can be satisfactorily assured, and a process of drawing to the fuse element at a high yield can be ensured, and which has an operating temperature belonging to the range of 120 to 150° C. As a metal element for preventing long-term DC breakage which prevents the fuse element from being broken under long-term DC application, Cu is added to an In-Sn composition of 52 to 85% In and a balance Sn.Type: ApplicationFiled: March 27, 2007Publication date: August 16, 2007Applicant: UCHIHASHI ESTEC CO., LTD.Inventors: Miki IWAMOTO, Naotaka IKAWA, Toshiaki SARUWATARI, Yoshiaki TANAKA
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Patent number: 6963264Abstract: The invention relates to an alloy type thermal fuse and a wire member for a thermal fuse element, and provides an alloy type thermal fuse in which a fuse element does not contain a harmful metal, the operating temperature is about 150° C., the dispersion of the operating temperature can be sufficiently suppressed, and the operation stability to a heat cycle can be satisfactorily assured. The thermal fuse has an alloy composition of 30 to 70% Sn, 0.3 to 20% Sb, and a balance Bi.Type: GrantFiled: June 27, 2003Date of Patent: November 8, 2005Assignee: Uchihashi Estec Co., Ltd.Inventors: Miki Iwamoto, Naotaka Ikawa, Toshiaki Saruwatari, Yoshiaki Tanaka
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Publication number: 20050220661Abstract: An In—Sn alloy of 85 to 52% In provides advantages that dispersion of an operating temperature can be sufficiently eliminated, and that a high yield can be ensured by adequate ductility, but has a defect which is fatal to a DC fuse, or in which troubles due to long-term DC application such as long-term DC application breakage occurs. In view of this fact, when an alloy type thermal fuse in which an In—Sn alloy is used as a fuse element is used under DC application, stability under long-term DC application that is a condition severer than that under AC application is imposed on the alloy type thermal fuse, whereby the fuse can be rationally used.Type: ApplicationFiled: March 21, 2005Publication date: October 6, 2005Inventors: Yoshiaki Tanaka, Naotaka Ikawa, Miki Iwamoto, Toshiaki Saruwatari
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Publication number: 20050128044Abstract: An alloy type thermal fuse is provided in which, although a fuse element essentially comprising an In—Sn alloy is used, shear breakage at the melting point or lower can be prevented from occurring even under long-term DC application, the operation stability to a heat cycle can be satisfactorily assured, and a process of drawing to the fuse element at a high yield can be ensured, and which has an operating temperature belonging to the range of 120 to 150° C. As a metal element for preventing long-term DC breakage which prevents the fuse element from being broken under long-term DC application, Cu is added to an In—Sn composition of 52 to 85% In and a balance Sn.Type: ApplicationFiled: September 30, 2004Publication date: June 16, 2005Inventors: Miki Iwamoto, Naotaka Ikawa, Toshiaki Saruwatari, Yoshiaki Tanaka
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Patent number: 6841845Abstract: An alloy type thermal fuse is provided in which, although a fuse element essentially comprising an In-Sn alloy is used, the operation stability to a heat cycle can be satisfactorily assured, and, even when the amount of In is large, a process of drawing to the fuse element at a high yield can be ensured, and which has an operating temperature belonging to the range of 120 to 150° C. The fuse element has an alloy composition in which 0.1 to 7 weight parts of one, or two or more metals selected from the group consisting of Ag, Au, Cu, Ni, Pd, Pt, and Sb are added to 100 weight parts of an alloy of 52 to 85% In and a balance Sn.Type: GrantFiled: July 8, 2003Date of Patent: January 11, 2005Assignee: Uchihashi Estec Co., Ltd.Inventors: Miki Iwamoto, Naotaka Ikawa, Toshiaki Saruwatari, Yoshiaki Tanaka
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Publication number: 20040066268Abstract: The invention relates to an alloy type thermal fuse and a wire member for a thermal fuse element, and provides an alloy type thermal fuse in which a fuse element does not contain a harmful metal, the operating temperature is about 150° C., the dispersion of the operating temperature can be sufficiently suppressed, and the operation stability to a heat cycle can be satisfactorily assured. The thermal fuse has an alloy composition of 30 to 70% Sn, 0.3 to 20% Sb, and a balance Bi.Type: ApplicationFiled: June 27, 2003Publication date: April 8, 2004Applicant: Uchihashi Estec Co., Ltd.Inventors: Miki Iwamoto, Naotaka Ikawa, Toshiaki Saruwatari, Yoshiaki Tanaka
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Publication number: 20040021499Abstract: An alloy type thermal fuse is provided in which, although a fuse element essentially comprising an In-Sn alloy is used, the operation stability to a heat cycle can be satisfactorily assured, and, even when the amount of In is large, a process of drawing to the fuse element at a high yield can be ensured, and which has an operating temperature belonging to the range of 120 to 150° C.Type: ApplicationFiled: July 8, 2003Publication date: February 5, 2004Applicant: Uchihashi Estec Co., Ltd.Inventors: Miki Iwamoto, Naotaka Ikawa, Toshiaki Saruwatari, Yoshiaki Tanaka