Patents by Inventor Naotaka IWAMOTO

Naotaka IWAMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component unit
    Patent number: 10602604
    Abstract: An electronic component unit includes: first electronic components which do not need to be cooled; second electronic components which are cooled; a first circuit board in which the first electronic component is mounted on a first surface and in which the second electronic component is mounted on a second surface; a second circuit board in which the first electronic component is mounted on a first surface and in which the second electronic component is mounted on a second surface; and one cooling plate which includes a first cooling surface and a second cooling surface, the second electronic component mounted on the second surface of the first circuit board is cooled by contact with the first cooling surface of the cooling plate, and the second electronic component mounted on the second surface of the second circuit board is cooled by contact with the second cooling surface of the cooling plate.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: March 24, 2020
    Assignee: FANUC CORPORATION
    Inventor: Naotaka Iwamoto
  • ELECTRONIC COMPONENT UNIT
    Publication number: 20190191542
    Abstract: An electronic component unit includes: first electronic components which do not need to be cooled; second electronic components which are cooled; a first circuit board in which the first electronic component is mounted on a first surface and in which the second electronic component is mounted on a second surface; a second circuit board in which the first electronic component is mounted on a first surface and in which the second electronic component is mounted on a second surface; and one cooling plate which includes a first cooling surface and a second cooling surface, the second electronic component mounted on the second surface of the first circuit board is cooled by contact with the first cooling surface of the cooling plate, and the second electronic component mounted on the second surface of the second circuit board is cooled by contact with the second cooling surface of the cooling plate.
    Type: Application
    Filed: November 9, 2018
    Publication date: June 20, 2019
    Applicant: FANUC CORPORATION
    Inventor: Naotaka IWAMOTO