Patents by Inventor Naotake Hirano

Naotake Hirano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9644251
    Abstract: Provided are a Cu—Zr-based copper alloy plate which retains satisfactory mechanical strength and, at the same time, has a good balance of bending formability and bending elastic limit at a high level and a process for manufacturing the Cu—Zr-based copper alloy plate. The copper alloy plate contains 0.05% to 0.2% by mass of Zr and a remainder including Cu and unavoidable impurities, and the average value of KAM values measured by an EBSD method using a scanning electron microscope equipped with a backscattered electron diffraction pattern system is 1.5° to 1.8°, the R/t ratio is 0.1 to 0.6 wherein R represents the minimum bending radius which does not cause a crack and t represents the thickness of the plate in a W bending test, and the bending elastic limit is 420 N/mm2 to 520 N/mm2.
    Type: Grant
    Filed: February 10, 2012
    Date of Patent: May 9, 2017
    Assignee: Mitsubishi Shindoh Co., Ltd.
    Inventors: Takeshi Sakurai, Yoshio Abe, Naotake Hirano
  • Publication number: 20130319584
    Abstract: Provided are a Cu—Zr-based copper alloy plate which retains satisfactory mechanical strength and, at the same time, has a good balance of bending formability and bending elastic limit at a high level and a process for manufacturing the Cu—Zr-based copper alloy plate. The copper alloy plate contains 0.05% to 0.2% by mass of Zr and a remainder including Cu and unavoidable impurities, and the average value of KAM values measured by an EBSD method using a scanning electron microscope equipped with a backscattered electron diffraction pattern system is 1.5° to 1.8°, the R/t ratio is 0.1 to 0.6 wherein R represents the minimum bending radius which does not cause a crack and t represents the thickness of the plate in a W bending test, and the bending elastic limit is 420 N/mm2 to 520 N/mm2.
    Type: Application
    Filed: February 10, 2012
    Publication date: December 5, 2013
    Applicant: MITSUBISHI SHINDOH CO., LTD.
    Inventors: Takeshi Sakurai, Yoshio Abe, Naotake Hirano