Abstract: An automated external defibrillator includes: a detector that detects an abnormality of the automated external defibrillator; and a notifier that notifies a user of the detection of the abnormality. The notifier has a display unit that includes a light source, and a sounder that generates an alert sound. The display unit executes a first mode and a second mode lower in power consumption alternately. The sounder executes a third mode and a fourth mode lower in power consumption alternately. At least a half part of each of periods in which the first mode is executed overlaps timewise with a corresponding one of periods in which the fourth mode is executed. At least a half part of each of periods in which the third mode is executed overlaps timewise with a corresponding one of periods in which the second mode is executed.

Abstract: An automated external defibrillator includes: a self-test executor that executes a self-test for checking a state of the automated external defibrillator; and a display unit that indicates the state of the automated external defibrillator. The display unit makes: a first display when the automated external defibrillator is in a normal state; a second display when the automated external defibrillator is in an abnormal state, and the first display and the second display simultaneously or in a predetermined pattern when the automated external defibrillator is self-testing.

Abstract: An automated external defibrillator (AED) includes: a battery configured to supply electric power to the AED; an indicator configured to visually provide predetermined information related to the AED and a remaining level of the battery; and an indicator controller configured to change a visual aspect of the indicator according to the remaining level.

Abstract: A compression depth calculating device (1000) including: an acceleration sensor (13); a magnetic sensor (19); a first calculation section (233A) which obtains a correlation; and a second calculation section (233B) which calculates a compression depth Dr of a compression operation performed after the correlation (R) has been calculated, based on a coil-to-coil distance AD acquired from the magnetic sensor (19) and the correlation (R), when the compression operation is performed after the correlation has been calculated.

Abstract: A blood pressure information measurement device cuff includes a wide blood pressure value measurement air bladder wrapped around a fitting area when in a fitted state, and a narrow pulse wave measurement air bladder disposed so as to be closer to the fitting area than the blood pressure value measurement air bladder when in the fitted state, and covered by the blood pressure value measurement air bladder when wrapped around the fitting area. The pulse wave measurement air bladder includes an anchored portion anchored to the blood pressure value measurement air bladder so as to be immobile relative to the blood pressure value measurement air bladder and a mobile portion that is not anchored to the blood pressure value measurement air bladder so as to be mobile relative to the blood pressure value measurement air bladder along a wrapping direction in which the cuff is wrapped around the measurement area.

Abstract: A medical apparatus communication system includes a first medical apparatus and a second medical apparatus. The first medical apparatus includes a first communicating unit which establishes a communication connection with the second medical apparatus to communicate with the second medical apparatus, and a first controlling unit which controls the first medical apparatus. The second medical apparatus includes a second communicating unit which establishes a communication connection with the first medical apparatus to communicate with the first medical apparatus, a second controlling unit which controls the second medical apparatus, and a second sound outputting unit which performs a sound output in accordance with a control of the second controlling unit. The second controlling unit controls the sound output of the second sound outputting unit in a predetermined timing after establishment of the communication connection between the first and second communicating units.

Abstract: A package-on-package (POP), including a semiconductor device, and a multi-chip-package located above the semiconductor device, wherein the semiconductor device includes a substrate including a first surface, a plurality of electrodes formed on the first surface, a second surface opposite to the first surface, a plurality of lands formed on the second surface, and a plurality of wirings, (a2) a semiconductor chip mounted over the first surface of the substrate, and (a3) a plurality of first solder balls formed on the lands, respectively, wherein the multi-chip-package is electrically connected with the semiconductor device via a plurality of second solder balls, wherein the plurality of second solder balls are connected with the plurality of electrodes, respectively.

Abstract: A medical apparatus which is communicable with a plurality of CPR assisting devices, the medical apparatus includes: a connection destination determining unit which is configured to determine a connection destination CPR assisting device that is a connection destination, from the plurality of CPR assisting devices based on a predetermined rule; and a communicating unit which is configured to communicate only with the connection destination CPR assisting device.

Abstract: A medical apparatus communication system includes a first medical apparatus and a second medical apparatus. The first medical apparatus includes a first communicating unit which establishes a communication connection with the second medical apparatus to communicate with the second medical apparatus, and a first controlling unit which controls the first medical apparatus. The second medical apparatus includes a second communicating unit which establishes a communication connection with the first medical apparatus to communicate with the first medical apparatus, a second controlling unit which controls the second medical apparatus, and a second sound outputting unit which performs a sound output in accordance with a control of the second controlling unit. The second controlling unit controls the sound output of the second sound outputting unit in a predetermined timing after establishment of the communication connection between the first and second communicating units.

Abstract: A tool housing case includes a main body case, for holding a power tool, for example, and an accessory case, for holding a power tool accessory, for example, which accessory case is connectable to the main body case on a handle side of the main body case near a main body case handle. The accessory case has an opening that can be selectively closed by a cover element. A space is provided between the handle and the accessory case for receiving a user's hand when the handle is gripped, and when a user's hand is not gripping the handle, this space allows access to the accessory case.

Abstract: A package-on-package (POP), including a semiconductor device, and a multi-chip-package located above the semiconductor device, wherein the semiconductor device includes a substrate including a first surface, a plurality of electrodes formed on the first surface, a second surface opposite to the first surface, a plurality of lands formed on the second surface, and a plurality of wirings, (a2) a semiconductor chip mounted over the first surface of the substrate, and (a3) a plurality of first solder balls formed on the lands, respectively, wherein the multi-chip-package is electrically connected with the semiconductor device via a plurality of second solder balls, wherein the plurality of second solder balls are connected with the plurality of electrodes, respectively.

Abstract: A semiconductor device includes a substrate, a first land formed in a first surface of the substrate, a second land formed in a second surface of the substrate, a first terminal coupled to the second land, a line coupled to the first land and the second land, a second terminal formed in the second surface of the substrate and a branch line coupled to the line and the second terminal. The second terminal is coupled to the first land and the second land and is not coupled to other lands in the first surface. The second surface is different surface from the first surface.

Abstract: A tool housing case includes a main body case, for holding a power tool, for example, and an accessory case, for holding a power tool accessory, for example, which accessory case is connectable to the main body case on a handle side of the main body case near a main body case handle. The accessory case has an opening that can be selectively closed by a cover element. A space is provided between the handle and the accessory case for receiving a user's hand when the handle is gripped, and when a user's hand is not gripping the handle, this space allows access to the accessory case.

Abstract: Provided is a semiconductor device in which a connection between connection terminals and land of the semiconductor device can be checked with the semiconductor device kept in a sound condition, the connection not being allowed to be checked with a semiconductor chip. The semiconductor device of the present invention includes: a package substrate; a semiconductor chip mounted on the package substrate; a first land formed in a first principal surface of the package substrate; a second land formed in a second principal surface of the package substrate; first connection terminals connected to the second land and having the connection thereto not allowed to be checked with the semiconductor chip; a connection interconnection for connecting the first land and the second land; a second connection terminal formed in the second principal surface of the package substrate; and a branch interconnection for connecting the connection interconnection and the second connection terminal.

Abstract: A blood pressure information measurement device cuff includes a wide blood pressure value measurement air bladder wrapped around a fitting area when in a fitted state, and a narrow pulse wave measurement air bladder disposed so as to be closer to the fitting area than the blood pressure value measurement air bladder when in the fitted state, and covered by the blood pressure value measurement air bladder when wrapped around the fitting area. The pulse wave measurement air bladder includes an anchored portion anchored to the blood pressure value measurement air bladder so as to be immobile relative to the blood pressure value measurement air bladder and a mobile portion that is not anchored to the blood pressure value measurement air bladder so as to be mobile relative to the blood pressure value measurement air bladder along a wrapping direction in which the cuff is wrapped around the measurement area.

Abstract: Provided is a semiconductor chip in which a first rewiring connection part located in the peripheral electrode pad or relatively close to the peripheral electrode pad in the V/G line and a second rewiring connection part located relatively distant from the peripheral electrode pad in the V/G line and having a lower potential than the first rewiring connection part before formation of a rewiring line are connected by the rewiring line. The semiconductor chip includes an inspection part for wafer test in the second rewiring connection part, a part on the V/G line close to the second rewiring connection part and having a lower potential than the first rewiring connection part before the rewiring line formation, or a conductive part extended from the V/G line to a proximity of the second rewiring connection part and having a lower potential than the first rewiring connection part before the rewiring line formation.

Abstract: A semiconductor device including a pillar formed in a highly reliable manner and a method of manufacturing the semiconductor device are disclosed. The semiconductor device includes a semiconductor chip including an internal circuit area and an I/O area disposed outside the internal circuit area, a package substrate coupled in a flip-chip manner to the semiconductor chip, and an electrically conductive pillar disposed between the semiconductor chip and the package substrate such that the electrically conductive pillar is located over two or more wirings in an uppermost wiring layer of the semiconductor chip and such that the two or more wirings are coupled together via the electrically conductive pillar.

Abstract: In a casing structure of an electronic apparatus according to the present invention, a chassis is installed inside a casing. The casing includes a metal cabinet component and a resin cabinet component that are provided on two sides of the chassis so as to be coupled with each other. A tongue piece that protrudes in a direction approaching the resin cabinet component is formed in the metal cabinet component. A latching hole is formed in the tongue piece. A latching claw capable of penetrating the latching hole of the tongue piece is protrudingly provided in the resin cabinet component. The resin cabinet component is latched to the metal cabinet component by the latching claw penetrating the latching hole in a direction from the outer side of the tongue piece towards the inner side of the casing.

Abstract: A semiconductor chip includes a plurality of electrode terminals having a fixed terminal which is supplied with a signal, an outside terminal for the signal being fixed when the semiconductor chip is mounted in both a face-up configuration and a face-down configuration on a package substrate that has the outside terminal, and which is arranged within 50% of the width of the semiconductor chip with a symmetric line of the semiconductor chip as a center. According to the present invention, it is possible to reduce the variation of the wiring delays of the fixed terminal and to keep the wiring routes from being complicated, when the semiconductor chip is mounted in both the face-up configuration and the face-down configuration.

Abstract: Provided is a semiconductor device in which a connection between connection terminals and land of the semiconductor device can be checked with the semiconductor device kept in a sound condition, the connection not being allowed to be checked with a semiconductor chip. The semiconductor device of the present invention includes: a package substrate; a semiconductor chip mounted on the package substrate; a first land formed in a first principal surface of the package substrate; a second land formed in a second principal surface of the package substrate; first connection terminals connected to the second land and having the connection thereto not allowed to be checked with the semiconductor chip; a connection interconnection for connecting the first land and the second land; a second connection terminal formed in the second principal surface of the package substrate; and a branch interconnection for connecting the connection interconnection and the second connection terminal.