Patents by Inventor Naoto ANDO

Naoto ANDO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10811371
    Abstract: A semiconductor device includes: a semiconductor substrate; a semiconductor layer on the semiconductor substrate; a source electrode and a drain electrode spaced apart from each other on the semiconductor layer; a gate electrode on the semiconductor layer between the source electrode and the drain electrode; and an insulating film covering the semiconductor layer, the source electrode, the drain electrode and the gate electrode, the gate electrode has an eaves structure including a lower electrode joined to the semiconductor layer and an upper electrode provided on the lower electrode and wider than the lower electrode, a principal ingredient of the insulating film is an oxide film where atomic layers are alternately arrayed for each monolayer, and a film thickness of the insulating film that covers the lower electrode of the gate electrode is equal to a film thickness of the insulating film that covers the upper electrode.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: October 20, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventor: Naoto Ando
  • Publication number: 20190123000
    Abstract: A semiconductor device includes: a semiconductor substrate; a semiconductor layer on the semiconductor substrate; a source electrode and a drain electrode spaced apart from each other on the semiconductor layer; a gate electrode on the semiconductor layer between the source electrode and the drain electrode; and an insulating film covering the semiconductor layer, the source electrode, the drain electrode and the gate electrode, the gate electrode has an eaves structure including a lower electrode joined to the semiconductor layer and an upper electrode provided on the lower electrode and wider than the lower electrode, a principal ingredient of the insulating film is an oxide film where atomic layers are alternately arrayed for each monolayer, and a film thickness of the insulating film that covers the lower electrode of the gate electrode is equal to a film thickness of the insulating film that covers the upper electrode.
    Type: Application
    Filed: December 12, 2018
    Publication date: April 25, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventor: Naoto ANDO
  • Publication number: 20170207183
    Abstract: A semiconductor device includes: a semiconductor substrate; a semiconductor layer on the semiconductor substrate; a source electrode and a drain electrode spaced apart from each other on the semiconductor layer; a gate electrode on the semiconductor layer between the source electrode and the drain electrode; and an insulating film covering the semiconductor layer, the source electrode, the drain electrode and the gate electrode, the gate electrode has an eaves structure including a lower electrode joined to the semiconductor layer and an upper electrode provided on the lower electrode and wider than the lower electrode, a principal ingredient of the insulating film is an oxide film where atomic layers are alternately arrayed for each monolayer, and a film thickness of the insulating film that covers the lower electrode of the gate electrode is equal to a film thickness of the insulating film that covers the upper electrode.
    Type: Application
    Filed: August 29, 2016
    Publication date: July 20, 2017
    Applicant: Mitsubishi Electric Corporation
    Inventor: Naoto ANDO
  • Patent number: D864768
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: October 29, 2019
    Assignee: FUJIMOTO CO., LTD.
    Inventors: Naoto Ando, Takaaki Fujimoto
  • Patent number: D927201
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: August 10, 2021
    Assignee: FUJIMOTO CO., LTD.
    Inventors: Naoto Ando, Takaaki Fujimoto