Abstract: A laminating device includes: a plurality of laminating heads that each holds a unit laminated body; a drum section in which the plurality of laminating heads are arranged, which holds each laminating head swingably via a support shaft, and which rotates to advance each laminating head to a laminating position facing a lamination stage; a cam section which is in contact with each laminating head and which causes each laminating head to swing around the support shaft in association with a movement of each laminating head caused by a rotation of the drum section; and a biasing member that biases each laminating head in a radial direction of the drum section.

Abstract: A method for manufacturing a carbon fiber bundle includes a stabilization process of subjecting an acrylic fiber bundle to a heat treatment within a range of 200° C. to 300° C. in an oxidizing atmosphere; a pre-carbonization process of performing a heat treatment within a range of 300° C. to 1,000° C. using a heat treatment furnace having at least one inert gas supply port on each of an incoming side and an outgoing side of the fiber bundle and at least one exhaust port between the incoming-side and outgoing-side inert gas supply ports, the heat treatment being performed with a temperature of an inert gas supplied being higher on the outgoing side than on the incoming side; and a carbonization process of performing a heat treatment at a temperature of 1,000° C. to 2,000° C. in an inert gas atmosphere, in which from a position at which an atmospheric temperature in the heat treatment furnace is 300° C.

Abstract: Efficient production of high quality oxidized fiber bundles and carbon fiber bundles is described, comprising a step for heat-treating aligned acryl based fiber bundles in an oxidizing atmosphere while turning them back on guide rollers installed on both ends outside the furnace body of a hot gas heating type oxidation furnace wherein: supply nozzles for supplying hot gas into a heat treatment chamber are installed at an end in the traveling direction of the acryl based fiber bundles; a fiber bundle traveling passage(s) exists above and/or below each nozzle; hot gas is supplied from the supply face(s) located above and/or below the acryl based fiber bundle; and the requirements (1) and (2) are satisfied where Vf and V are defined as described. 1.5 m/s?Vf?15 m/s ??(1) 1.

Abstract: A method of producing an oxidized fiber bundle includes heat-treating an acrylic fiber bundle aligned in a heat treatment chamber in which hot air is circulated while causing the acrylic fiber bundle to run on direction-changing rollers disposed on both ends of an outside of the heat treatment chamber, wherein first hot air is supplied in a direction substantially parallel to a running direction of the acrylic fiber bundle, and second hot air is supplied from above the acrylic fiber bundle at an angle of 20 to 160° with respect to a wind direction of the first hot air, so that the second hot air passes at least a part of a running acrylic fiber bundle in a longitudinal direction.

Abstract: There is provided an oxidation heat treatment oven including a heat treatment chamber configured to heat-treat a fiber bundle that is an aligned acrylic fiber bundle in an oxidizing atmosphere to form an oxidized fiber bundle; a slit-shaped opening configured to take the fiber bundle in and out of the heat treatment chamber; guide rollers installed at both ends of the heat treatment chamber and configured to turn the fiber bundle back; a hot air supply nozzle that has a longitudinal axis along the width of the fiber bundle traveling and that blows out hot air, in a direction substantially parallel to a traveling direction of the fiber bundle, above and/or below the fiber bundle traveling in the heat treatment chamber; and a suction nozzle configured to suck the hot air blown out from the hot air supply nozzle, in which the hot air supply nozzle satisfies disclosed conditions (1) to (3).

Abstract: A method of manufacturing a stabilized fiber bundle is described, which includes subjecting an acrylic fiber bundle aligned, to a heat treatment in an oxidizing atmosphere, with the acrylic fiber bundle being turned around by a guide roller placed on each of both ends outside a hot air heating-type oxidation oven, wherein an air velocity Vm of first hot air sent through a supply nozzle(s) disposed above and/or under a fiber bundle travelled in the oxidation oven, in a substantially horizontal direction to a travelling direction of the fiber bundle, and an air velocity Vf of second hot air flowing in a fiber bundle passing a flow channel in which the fiber bundle is travelled that satisfies expression 1) 0.2?Vf/Vm?2.0 ??1) to produce a high-quality stabilized fiber bundle and a high-quality carbon fiber bundle at high efficiencies without any process troubles.

Abstract: The present invention provides a battery block that accommodates unit cells having higher capacities, and, even in case of abnormal heat generation in the unit cell, does not cause abnormal heat generation in the neighboring unit cells, thereby preventing a chain reaction of degradations and abnormalities of the accommodated unit cells. The battery block of the present invention includes a battery case having a minimum thickness section satisfying the relationship “K2/K1?K3?1”. K1 is the thermal conductance between the battery case and the unit cell. K2 is the thermal conductance of the minimum thickness section of the battery case between two neighboring holes for accommodating the respective unit cells. K3 is a ratio between the abnormal heat temperature of a reference cell and the ambient temperature causing abnormal heat generation in this cell.

Abstract: A battery module in which the temperature of a cell with an increased high temperature due to an abnormal state can be quickly reduced so that the high temperature does not affect adjacent cells is provided. A battery module 200 has a configuration in which a plurality of cells 100 as secondary batteries are housed in a case 90 having a plurality of housing parts housing, but not in contact with, the cells 100, and when a gas is generated in one of the cells 100 to cause the cell 100 to expand, this cell 100 comes into contact with the associated one of the housing parts.

Abstract: The present invention provides a battery block that accommodates unit cells having higher capacities, and, even in case of abnormal heat generation in the unit cell, does not cause abnormal heat generation in the neighboring unit cells, thereby preventing a chain reaction of degradations and abnormalities of the accommodated unit cells. The battery block of the present invention includes a battery case having a minimum thickness section satisfying the relationship “K2/K1?K3?1”. K1 is the thermal conductance between the battery case and the unit cell. K2 is the thermal conductance of the minimum thickness section of the battery case between two neighboring holes for accommodating the respective unit cells. K3 is a ratio between the abnormal heat temperature of a reference cell and the ambient temperature causing abnormal heat generation in this cell.

Abstract: A battery module in which the temperature of a cell with an increased high temperature due to an abnormal state can be quickly reduced so that the high temperature does not affect adjacent cells is provided. A battery module 200 has a configuration in which a plurality of cells 100 as secondary batteries are housed in a case 90 having a plurality of housing parts housing, but not in contact with, the cells 100, and when a gas is generated in one of the cells 100 to cause the cell 100 to expand, this cell 100 comes into contact with the associated one of the housing parts.

Abstract: A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

Abstract: A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

Abstract: A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

Abstract: When a component, that has a connection portion to be connected to an electrode of a board and a weak heat-resistant portion of a lower heat-resisting property than a fusing point of a connection material for connecting the electrode of the board with the connection portion, is connected to the board with interposition of connection material between the electrode of the board and the connection portion, a cooling member is brought into contact with the weak heat-resistant portion or its neighborhood while heating the connection material by heating the board brought in contact with a placement member, and a quantity of heat conducted to the weak heat-resistant portion via the board is reduced by being conducted to the cooling member, thereby performing fusing of the connection material while preventing occurrence of thermal damage to the weak heat-resistant portion.

Abstract: A pressurizing method for pressurizing a second component arranged on a first component, against the first component by using a pressurizing apparatus having a stage on which the first component is mounted, a tool, and a protection sheet supplying section. The tool is disposed so as to face the stage and moved between a first position at which the tool faces the first and second components while spaced therefrom, and a second position at which the tool is biased toward the stage to pressurize the second component against the first component. When the tool is at the second position, the protection sheet supplying section supplies a protection sheet so that the protection sheet is placed between the second component and the tool.

Abstract: Disclosed are an apparatus and a method for bonding electronic components, a circuit board, and an electronic component mounting apparatus, whereby various kinds of circuit boards can be manufactured, each by a small amount, with high productivity as compared with the conventional art. There are provided a stage member and a heating device, so that a circuit board is heated by the heating device while held in contact with the stage member, which stage member has a size almost equal to that of one circuit board. Generation of losses can be reduced for compact circuit boards, and heating can be performed individually, correspondingly, for each kind of circuit board. Manufacturing various kinds of circuit boards, each by a small amount, with high productivity as compared with the conventional art is enabled accordingly.

Abstract: A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

Abstract: When a component that has a connection portion to be connected to the electrode of a board and a weak heat-resistant portion of a lower heat-resisting property than the fusing point of a connection material for connecting the electrode of the board with the connection portion is connected to the board with interposition of the connection material between the electrode of the board and the connection portion, a cooling member is brought in contact with the weak heat-resistant portion or its neighborhood while heating the connection material by heating the board brought in contact with a placement member, and the quantity of heat conducted to the weak heat-resistant portion via the board is reduced by being conducted to the cooling member, carrying out the fusing of the connection material while preventing the occurrence of thermal damage to the weak heat-resistant portion.

Abstract: Disclosed are an apparatus and a method for bonding electronic components, a circuit board, and an electronic component mounting apparatus, whereby various kinds of circuit boards can be manufactured, each by a small amount, with high productivity as compared with the conventional art. There are provided a stage member and a heating device, so that a circuit board is heated by the heating device while held in contact with the stage member, which stage member has a size almost equal to that of one circuit board. Generation of losses can be reduced for compact circuit boards, and heating can be performed individually, correspondingly, for each kind of circuit board. Manufacturing various kinds of circuit boards, each by a small amount, with high productivity as compared with the conventional art is enabled accordingly.

Abstract: There are disclosed an apparatus for mounting electronic components, with which the electronic components can be reversed, up and down, and mounted onto a circuit board in a short mounting process time by performing picking up, delivering and receiving of components between heads, and mounting of the components onto the circuit board in parallel. A plurality of reverse-supply heads are mounted on a component supply holder for performing indexing rotation, while a plurality of mounting heads are mounted on a component mounting holder for performing indexing rotation in synchronization with the indexing rotation of the component supply holder. By (i) picking up an electronic component, (ii) delivering the electronic component from the reverse-supply head to the mounting head, and (iii) mounting the electronic component onto the circuit board at prescribed positions, operations from (i) to (iii) can be carried out in parallel.