Patents by Inventor Naoto Ishida
Naoto Ishida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9433106Abstract: A method for manufacturing a printed wiring board includes forming on a support sheet an intermediate body including a first insulation layer, a second insulation layer and a first conductive layer interposed between the first insulation layer and the second insulation layer, and separating the support sheet from the intermediate body including the insulation layer, the first conductive layer and the second insulation layer such that the intermediate body is detached from the support sheet.Type: GrantFiled: July 23, 2013Date of Patent: August 30, 2016Assignee: IBIDEN Co., Ltd.Inventor: Naoto Ishida
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Patent number: 9374903Abstract: A multilayer printed wiring board for mounting a semiconductor element includes a core substrate, a first laminated structure on first surface of the substrate and including a conductive circuit layer on the first surface of the substrate, a resin insulating layer and the outermost conductive circuit layer, and a second laminated structure on second surface of the substrate and including a conductive circuit layer on the second surface of the substrate, a resin insulating layer and the outermost conductive circuit layer. The outermost conductive layer in the first structure has solder pads positioned to mount a semiconductor element and solder bumps formed on the pads, respectively, the outermost conductive layer in the second structure has solder pads positioned to mount a wiring board, and the outermost conductive layers in the first and second structures have thicknesses formed greater than thicknesses of the conductive layers on the surfaces of the substrate.Type: GrantFiled: March 14, 2014Date of Patent: June 21, 2016Assignee: IBIDEN CO., LTD.Inventors: Naoki Katsuda, Naoto Ishida, Kota Noda, Nobuhisa Kuroda
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Patent number: 9185799Abstract: A printed wiring board includes a core substrate including an insulative substrate, a first conductive layer formed on first surface of the insulative substrate, and a second conductive layer formed on second surface of the insulative substrate, a first buildup laminated on first surface of the core and including an interlayer insulation layer, a conductive layer formed on the insulation layer, and a via conductor penetrating through the insulation layer and connected to the conductive layer, and a second buildup laminated on second surface of the core and including an interlayer insulation layer, a conductive layer formed on the interlayer insulation layer, and a via conductor penetrating through the insulation layer and connected to the conductive layer. The insulation layer of the first buildup has thermal expansion coefficient set higher than thermal expansion coefficient of the insulation layer of the second buildup.Type: GrantFiled: March 15, 2013Date of Patent: November 10, 2015Assignee: IBIDEN CO., LTD.Inventors: Naoto Ishida, Takema Adachi
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Patent number: 9048229Abstract: A printed wiring board includes a core substrate, an electronic component accommodated in the substrate, a first buildup layer laminated on first surface of the substrate and including the outermost interlayer resin insulation layer and the outermost conductive layer formed on the outermost interlayer resin insulation layer of the first buildup layer, and a second buildup layer laminated on second surface of the substrate and including the outermost interlayer resin insulation layer and the outermost conductive layer formed on the outermost interlayer resin insulation layer of the second buildup layer. The outermost interlayer resin insulation layer of the first buildup layer has thermal expansion coefficient which is set lower than thermal expansion coefficient of the outermost interlayer resin insulation layer of the second buildup layer.Type: GrantFiled: May 14, 2014Date of Patent: June 2, 2015Assignee: IBIDEN CO., LTD.Inventors: Naoto Ishida, Takema Adachi
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Publication number: 20150008021Abstract: A printed wiring board includes an interlayer resin insulation layer, multiple pads formed on the interlayer resin insulation layer, and multiple metal posts having bonding material portions and positioned on the pads, respectively, such that the metal posts are bonded to the pads through the bonding material portions of the metal posts, respectively.Type: ApplicationFiled: June 27, 2014Publication date: January 8, 2015Applicant: IBIDEN CO., LTD.Inventors: Naoto Ishida, Kota Noda
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Publication number: 20140262447Abstract: A multilayer printed wiring board for mounting a semiconductor element includes a core substrate, a first laminated structure on first surface of the substrate and including a conductive circuit layer on the first surface of the substrate, a resin insulating layer and the outermost conductive circuit layer, and a second laminated structure on second surface of the substrate and including a conductive circuit layer on the second surface of the substrate, a resin insulating layer and the outermost conductive circuit layer. The outermost conductive layer in the first structure has solder pads positioned to mount a semiconductor element and solder bumps formed on the pads, respectively, the outermost conductive layer in the second structure has solder pads positioned to mount a wiring board, and the outermost conductive layers in the first and second structures have thicknesses formed greater than thicknesses of the conductive layers on the surfaces of the substrate.Type: ApplicationFiled: March 14, 2014Publication date: September 18, 2014Applicant: IBIDEN CO., LTD.Inventors: Naoki KATSUDA, Naoto ISHIDA, Kota NODA, Nobuhisa KURODA
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Publication number: 20140246765Abstract: A printed wiring board includes a core substrate, an electronic component accommodated in the substrate, a first buildup layer laminated on first surface of the substrate and including the outermost interlayer resin insulation layer and the outermost conductive layer formed on the outermost interlayer resin insulation layer of the first buildup layer, and a second buildup layer laminated on second surface of the substrate and including the outermost interlayer resin insulation layer and the outermost conductive layer formed on the outermost interlayer resin insulation layer of the second buildup layer. The outermost interlayer resin insulation layer of the first buildup layer has thermal expansion coefficient which is set lower than thermal expansion coefficient of the outermost interlayer resin insulation layer of the second buildup layer.Type: ApplicationFiled: May 14, 2014Publication date: September 4, 2014Applicant: IBIDEN CO., LTD.Inventors: Naoto ISHIDA, Takema Adachi
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Patent number: 8742553Abstract: A printed wiring board includes a core substrate, a first buildup layer laminated on a first surface of the core substrate and including the outermost interlayer resin insulation layer and the outermost conductive layer formed on the outermost interlayer resin insulation layer of the first buildup layer, and a second buildup layer laminated on a second surface of the core substrate and including the outermost interlayer resin insulation layer and the outermost conductive layer formed on the outermost interlayer resin insulation layer of the second buildup layer. The outermost conductive layer of the first buildup layer includes pads positioned to mount a semiconductor device on a surface of the first buildup layer, and the outermost interlayer resin insulation layer of the first buildup layer has a thermal expansion coefficient which is set lower than a thermal expansion coefficient of the outermost interlayer resin insulation layer of the second buildup layer.Type: GrantFiled: November 30, 2012Date of Patent: June 3, 2014Assignee: Ibiden Co., Ltd.Inventors: Naoto Ishida, Takema Adachi
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Publication number: 20140026412Abstract: A method for manufacturing a printed wiring board includes forming on a support sheet an intermediate body including a first insulation layer, a second insulation layer and a first conductive layer interposed between the first insulation layer and the second insulation layer, and separating the support sheet from the intermediate body including the insulation layer, the first conductive layer and the second insulation layer such that the intermediate body is detached from the support sheet.Type: ApplicationFiled: July 23, 2013Publication date: January 30, 2014Applicant: IBIDEN Co., Ltd.Inventor: Naoto ISHIDA
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Publication number: 20130240258Abstract: A printed wiring board includes a core substrate including an insulative substrate, a first conductive layer formed on first surface of the insulative substrate, and a second conductive layer formed on second surface of the insulative substrate, a first buildup laminated on first surface of the core and including an interlayer insulation layer, a conductive layer formed on the insulation layer, and a via conductor penetrating through the insulation layer and connected to the conductive layer, and a second buildup laminated on second surface of the core and including an interlayer insulation layer, a conductive layer formed on the interlayer insulation layer, and a via conductor penetrating through the insulation layer and connected to the conductive layer. The insulation layer of the first buildup has thermal expansion coefficient set higher than thermal expansion coefficient of the insulation layer of the second buildup.Type: ApplicationFiled: March 15, 2013Publication date: September 19, 2013Applicant: IBIDEN CO., LTD.Inventors: Naoto ISHIDA, Takema ADACHI
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Publication number: 20120125680Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 ?m) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be prevented. Thus, the reliability of the connection of the via holes can be improved.Type: ApplicationFiled: January 25, 2012Publication date: May 24, 2012Applicant: IBIDEN CO., LTDInventors: Naohiro Hirose, Kouta Noda, Hiroshi Segawa, Honjin En, Kiyotaka Tsukada, Naoto Ishida, Kouji Asano, Atsushi Shouda
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Patent number: 8148643Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 ?m) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.Type: GrantFiled: October 19, 2007Date of Patent: April 3, 2012Assignee: IBIDEN Co., Ltd.Inventors: Naohiro Hirose, Kouta Noda, Hiroshi Segawa, Honjin En, Kiyotaka Tsukada, Naoto Ishida, Kouji Asano, Atsushi Shouda
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Patent number: 7843769Abstract: An information processing device includes: timing means for performing a timing action thereby to output time information indicating the result of the timing action; unit time outputting means for converting the time, as indicated by the time information outputted from the timing means, into individual unit times, as expressed by using a plurality of time units individually, thereby to output the plural unit times individually; unit-by-unit contents decision means for individually deciding the unit presentation contents of an object to be presented to a user, individually for the plural time units, on the basis of such one of the plural unit times outputted from the unit time outputting means as is expressed by a target time unit; general contents decision means for deciding the general presentation contents of the object at the time which is indicated by the time information outputted from the timing means, on the basis of the unit presentation contents for every the time units decided by the unit-by-unit coType: GrantFiled: December 11, 2006Date of Patent: November 30, 2010Assignee: Sony CorporationInventors: Naoto Ishida, Masafumi Hatanaka, Eiji Kawai, Eriko Takeo, Toshitake Mashiko
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Patent number: 7832098Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 ?m) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.Type: GrantFiled: April 7, 2008Date of Patent: November 16, 2010Assignee: IBIDEN Co., Ltd.Inventors: Naohiro Hirose, Kouta Noda, Hiroshi Segawa, Honjin En, Kiyotaka Tsukada, Naoto Ishida, Kouji Asano, Atsushi Shouda
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Patent number: 7415761Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 ?m) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.Type: GrantFiled: February 3, 2003Date of Patent: August 26, 2008Assignee: IBIDEN Co., Ltd.Inventors: Naohiro Hirose, Kouta Noda, Hiroshi Segawa, Honjin En, Kiyotaka Tsukada, Naoto Ishida, Kouji Asano, Atsushi Shouda
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Publication number: 20080189943Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 ?m) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.Type: ApplicationFiled: April 7, 2008Publication date: August 14, 2008Applicant: IBIDEN CO., LTD.Inventors: Naohiro HIROSE, Kouta Noda, Hiroshi Segawa, Honjin En, Kiyotaka Tsukada, Naoto Ishida, Kouji Asano, Atsushi Shouda
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Publication number: 20080173473Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 ?m) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.Type: ApplicationFiled: October 19, 2007Publication date: July 24, 2008Applicant: IBIDEN CO., LTDInventors: Naohiro HIROSE, Kouta Noda, Hiroshi Segawa, Honjin En, Kiyotaka Tsukada, Naoto Ishida, Kouji Asano, Atsushi Shouda
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Publication number: 20070213955Abstract: An information processing device includes: timing means for performing a timing action thereby to output time information indicating the result of the timing action; unit time outputting means for converting the time, as indicated by the time information outputted from the timing means, into individual unit times, as expressed by using a plurality of time units individually, thereby to output the plural unit times individually; unit-by-unit contents decision means for individually deciding the unit presentation contents of an object to be presented to a user, individually for the plural time units, on the basis of such one of the plural unit times outputted from the unit time outputting means as is expressed by a target time unit; general contents decision means for deciding the general presentation contents of the object at the time which is indicated by the time information outputted from the timing means, on the basis of the unit presentation contents for every the time units decided by the unit-by-unit coType: ApplicationFiled: December 11, 2006Publication date: September 13, 2007Inventors: Naoto Ishida, Masafumi Hatanaka, Eiji Kawai, Eriko Takeo, Toshitake Mashiko
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Patent number: 7222776Abstract: A printed wiring board has a circuit substrate 6 having a conductor circuit 5 and a through hole 60, and also has a joining pin 1 inserted into the through hole. The joining pin is manufactured by using a material unmelted at a heating temperature in joining the joining pin to an opposite party pad 81. The joining pin is constructed by a joining head portion 11 having a greater diameter than an opening diameter of the through hole. The joining pin forms a joining portion for joining and connection to the opposite party pad. The joining pin has a leg portion 12 having a diameter smaller than the through hole. The leg portion is inserted into the through hole and is joined to the through hole by a conductive material such as a soldering material 20, etc. In lieu of a joining pin, a joining ball approximately having a spherical shape can be joined to the through hole by the conductive material.Type: GrantFiled: August 26, 2004Date of Patent: May 29, 2007Assignee: IBIDEN Co., Ltd.Inventors: Naoto Ishida, Kouji Asano
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Patent number: 7116328Abstract: The present invention is intended to provide a information processing apparatus that includes information accumulating means for accumulating image motion information, display means for displaying images, and control means for detecting, from music information, a division at which tune change occurs and/or a climax section of music, selecting said image motion information on the basis of a result of the detection, and displaying on said display means a moving image in accordance with the reproduction of said music information by use of the selected image motion information in accordance with the reproduction of said music information.Type: GrantFiled: October 1, 2003Date of Patent: October 3, 2006Assignee: Sony CorporationInventors: Eiji Kawai, Naoto Ishida, Masaaki Miyazawa, Masafumi Hatanaka, Makoto Okazaki, Nao Tazaki