Abstract: A sealing device includes a sealing main body surrounding a rotor shaft rotating about an axis from an outer periphery side. The sealing main body includes an inside surface facing an outside surface of the rotor shaft with clearance and a plurality of hole parts formed recessed to an outer side in a radial direction from the inside surface and arrayed in a circumferential direction of the inside surface and in a direction of the axis. The hole parts have an inner peripheral wall in which a spiral groove extending twisting toward the outer side in a radial direction is formed.

Abstract: A wired circuit board is provided that includes an insulating base layer, a conductor layer formed on the insulating base layer, and an insulating cover layer formed on the conductor layer and having an opening through which the conductor layer is exposed, an electrode is formed on the surface of the conductor layer exposed through the opening by forming a nickel plating layer by electroless nickel plating, and then forming a gold plating layer on the nickel plating layer by electrolytic gold plating. Thus, the invention provides a wired circuit board having enhanced connection reliability and reduced cost of manufacture among other benefits.

Abstract: In order to provide a wired circuit board capable of enhancing the connection reliability and reducing the cost, in a wired circuit board including an insulating base layer, a conductor layer formed on the insulating base layer, and an insulating cover layer formed on the conductor layer and having an opening through which the conductor layer is exposed, an electrode is formed on the surface of the conductor layer exposed through the opening by forming a nickel plating layer by electroless nickel plating, and then forming a gold plating layer on the nickel plating layer by electrolytic gold plating.