Abstract: A chip-type surge absorber and method for producing same, wherein the chip-type surge absorber includes an insulating substrate in the shape of a rectangular parallelepiped; an insulating hermetic cap open at a bottom side thereof, for forming, together with the insulating substrate, a box-shaped hermetically sealed cavity filled with a discharge gas; terminal electrodes disposed at both ends in the hermetically sealed cavity; a pair of discharge electrodes which are formed in the hermetically sealed cavity such that a discharge gap is formed between the discharge electrodes and such that the discharge electrodes are electrically connected to corresponding terminal electrodes; and connection surfaces for increasing the connection area for the connection between the discharge electrodes and the terminal electrodes.

Abstract: An antenna assembly having patterned conductive films on the surfaces of a dielectric hexahedron with compatibility to mass-production, wherein the conductive films are formed on protuberances formed on the surface of the dielectric hexahedron on which protuberances and depressions are formed. In one embodiment, the dielectric hexahedron includes convex portions serving as the protuberances and concave portions serving as the depressions. A conductive film may be formed on the protuberances by roll coating, sputtering, evaporative deposition, and electroless deposition, thereby producing inexpensively a high quality antenna assembly having a circuit pattern formed thereon.

Abstract: The present invention relates to an antenna device to be used for portable communication sets and a method for reducing the manufacturing cost thereof. The antenna device includes a substrate having at least one of a dielectric material and a magnetic material and having upper and lower faces as well as a pair of side faces on which convex portions and concave portions are alternately formed. Also included is a helical conductor layer formed on the upper and lower faces, and on the concave portion or convex portion on a pair of the side faces of the substrate so as to spirally surround the entire substrate.

Abstract: A chip-type surge absorber and method for producing same, wherein the chip-type surge absorber includes an insulating substrate in the shape of a rectangular parallelepiped; an insulating hermetic cap open at a bottom side thereof, for forming, together with the insulating substrate, a box-shaped hermetically sealed cavity filled with a discharge gas; terminal electrodes disposed at both ends in the hermetically sealed cavity; a pair of discharge electrodes which are formed in the hermetically sealed cavity such that a discharge gap is formed between the discharge electrodes and such that the discharge electrodes are electrically connected to corresponding terminal electrodes; and connection surfaces for increasing the connection area for the connection between the discharge electrodes and the terminal electrodes.

Abstract: An LC filter including a substrate having a magnetic and dielectric material. The LC filter includes inductors having two spiral structures arranged so that magnetic fluxes generated at the insides of the spiral structures are parallel and in mutually reverse directions. Also included are plane plate capacitors between the two spiral structures.

Abstract: This invention relates to an apparatus for shielding electromagnetic radiation which includes a casing made primarily of electromagnetic shielding material and an electromagnetic wave suppressor member having high permeability and/or permittivity. A method for using this apparatus also is described. The suppressor member has a high dielectric loss and/or high magnetic loss at a location close to the place in the casing where electromagnetic waves are less shielded, thereby reducing leakage of undesirable electromagnetic waves from the casing.

Abstract: There is provided a monolithic structure of an LC circuit incorporated component comprising at least one capacitor formed from internal electrodes in layered form in a ceramic monolithic structure, at least one inductor formed from internal conductive structure in coil form in said monolithic structure, internal connecting leads for connecting said capacitor(s) and inductor(s) to form said circuit, formed in said structure, and terminals for the circuit, formed at the surface(s) of the component.

Abstract: A multilayered ceramic capacitor includes glass melted layers and adhering layers containing conductive patters in which the combination of two or more different species of dielectric materials are used for ceramic layers in the stack of the multilayered capacitor.

Abstract: A multi-layered ceramic capacitor characterized by a structure containing glass material layers imposed between adjacent ceramic layers and conductive layers which sandwich the glass material therebetween. The conductive electrode layers and/or glass material layers bind the thin ceramic film pieces during firing at lower temperatures resulting in a strong bonded capacitor having numerous electrical applications.