Abstract: A water-soluble inorganic composition obtained by reacting an inorganic dissolution promoter with at least one solute selected from the group consisting of metal silicon, boric acid, and borax at a ratio of the inorganic dissolution promoter to the solute of 1:10 to 1:100 by weight, wherein the inorganic dissolution promoter is obtained by mixing in water (A) at least one compound selected from the group consisting of an alkali metal fluoride, an alkali metal phosphite, an alkali metal sulfite, an Alkali metal nitrite, sulfurous acid, nitrous acid, and phosphorous acid, alkali metal phosphate, alkali metal nitrate, alkali metal sulfate, phosphoric acid, nitric acid, sulfuric acid and (B) at least one alkali metal hydroxide at a ratio of (A):(B) of 1:9 to 4:1 by weight; a plasticized substance; and a foamed inorganic substance are provided.

Abstract: The invention provides an inorganic dissolution accelerator used for obtaining a water-soluble inorganic compound(s), high in concentration and containing a large solid content, which accelerator is prepared by making one or more compounds selected from fluorides, mineral acids, mineral “ous” acids and salts thereof, and boric acid compounds, all either natural or synthetic, coexist with an alkali metal and/or substance containing an alkaline metal, and is able to transform metals and inorganic substances present in water, either natural or synthetic, containing as the main component silicon Si, aluminum Al, and/or boron B, into amorphous highly water-soluble inorganic compounds having the solubilities equal to, or larger than those well known in the art.

Abstract: An aqueous film forming inorganic composition which is prepared by reacting metallic silicon and an alkali metal hydroxide in an aqueous solvent in the presence of at least one compound selected from the group consisting of a fluoride and sulfurous acid, nitrous acid, phosphorous acid and a salt of the acid, characterized in that it has a pH value of 10 to 13 at 20° C. and comprises colloidal particles of the product of the above reaction having various, that is, relatively large, medium and relatively small particle diameters; an inorganic foam prepared by heating the composition to 150° C. or higher; and methods for preparing the composition and the foam. The aqueous film forming inorganic composition can be suitably used for preparing an inorganic foam and a thermally insulating composite material which are excellent in thermal insulation, and is not pollutant to the environment and can be recycled in the environment.

Abstract: Water-soluble film-forming inorganic compounds having a specific gravity of 1.1 or more and capable of being formed into a film at ordinary temperature or by heating. The compounds are formed by a reaction of a metal, a hydroxide of an alkali metal, and hydrofluoric acid or boric acid and their salts or their submineral acid salts. The water-soluble film-forming inorganic compounds are superior in refractory, heat-resistant and heat-insulating properties, also have rust-inhibitory properties. The compounds are useful as heat-resistant adhesives in fireproof and heat-resistant layered composites made of metal, wood, and the like. A process of coating materials with a layer of these compounds is also provided.

Abstract: Water-soluble film-forming inorganic compounds having a specific gravity of 1.1 or more and capable of being formed into a film at ordinary temperature or by heating. The compounds are formed by a reaction of a metal, a hydroxide of an alkali metal, and hydrofluoric acid or boric acid and their salts or their submineral acid salts. The water-soluble film-forming inorganic compounds are superior in refractory, heat-resistant and heat-insulating properties, also have rust-inhibitory properties. The compounds are useful as heat-resistant adhesives in fireproof and heat-resistant layered composites made of metal, wood, and the like. A process of coating materials with a layer of these compounds is also provided.

Abstract: Water-soluble film-forming inorganic compounds having a specific gravity of 1.1 or more and capable of being formed into a film at ordinary temperature or by heating. The compounds are formed by a reaction of a metal, a hydroxide of an alkali metal, and hydrofluoric acid or boric acid and their salts or their submineral acid salts. The water-soluble film-forming inorganic compounds are superior in refractory, heat-resistant and heat-insulating properties, also have rust-inhibitory properties. The compounds are useful as heat-resistant adhesives in fireproof and heat-resistant layered composites made of metal, wood, and the like. A process of coating materials with a layer of these compounds is also provided.