Patents by Inventor Naoto Maezawa

Naoto Maezawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer printed circuit board and method of making the same
    Patent number: 6531661
    Abstract: A multilayer printed circuit board is provided which includes a base member having a surface provided with a base wiring pattern, an inner buildup layer laminated on the base member and having a surface formed with an inner buildup wiring pattern, and an outer buildup layer laminated on the surface of the inner buildup layer and having a surface formed with an outer buildup wiring pattern. The wiring patterns are electrically connected to each other through vias. The inner buildup layer is formed of a resin material which is not reinforced by glass fibers, whereas the outer buildup layer is formed of a resin material reinforced by glass fibers.
    Type: Grant
    Filed: June 14, 2001
    Date of Patent: March 11, 2003
    Assignee: Fujitsu Limited
    Inventors: Katsumi Uchikawa, Keiji Arai, Kazuhiko Iijima, Naoto Maezawa
  • Multilayer printed circuit board and method of making the same
    Publication number: 20020108776
    Abstract: A multilayer printed circuit board is provided which includes a base member having a surface provided with a base wiring pattern, an inner buildup layer laminated on the base member and having a surface formed with an inner buildup wiring pattern, and an outer buildup layer laminated on the surface of the inner buildup layer and having a surface formed with an outer buildup wiring pattern. The wiring patterns are electrically connected to each other through vias. The inner buildup layer is formed of a resin material which is not reinforced by glass fibers, whereas the outer buildup layer is formed of a resin material reinforced by glass fibers.
    Type: Application
    Filed: June 14, 2001
    Publication date: August 15, 2002
    Applicant: Fujitsu Limited
    Inventors: Katsumi Uchikawa, Keiji Arai, Kazuhiko Iijima, Naoto Maezawa