Abstract: The purpose of the present invention is to provide: novel thiol compounds; a method for synthesizing said thiol compounds; curing agents containing said thiol compounds; resin compositions containing said thiol compounds and an epoxy compound; and resin compositions containing said thiol compounds and an ene compound having a carbon-carbon double bond in a molecule. Furthermore, the purpose of the present invention is to provide adhesives and sealants having these resin compositions as ingredients. The thiol compounds of the present invention are represented by chemical formula (I) to chemical formula (VII).

Abstract: An objective of the present invention is to provide: a novel thiol compound; a method for synthesizing the thiol compound; a curing agent containing the thiol compound; a resin composition containing the thiol compound and an epoxy compound; and a resin composition containing the thiol compound and an enic compound having an intramolecular carbon-carbon double bond. The thiol compound of the present invention, as exemplified by the compounds listed below, is a reaction product of a certain type of dialkene compound and a thiol compound, and has two or more intramolecular thioether bonds but no ester bonds.

Abstract: An imaging apparatus includes a communication unit, a movement unit, an imaging unit, and a control unit. The communication unit receives first information including information on a shooting position of an external apparatus. The movement unit moves the imaging apparatus to a position at which a bird's eye view of subjects is made possible. The imaging unit performs shooting at the position at which the bird's eye view of the subject is made possible. The control unit acquires second information on the subjects from an image that is shot at the position at which the bird's eye view of the subject is made possible, determines priority for shooting each of the subjects based on the first information and the second information, and controls the movement unit and the imaging unit based on the determined priority.

Abstract: An objective of the present invention is to provide: a novel thiol compound; a method for synthesizing the thiol compound; a curing agent containing the thiol compound; a resin composition containing the thiol compound and an epoxy compound; and a resin composition containing the thiol compound and an enic compound having an intramolecular carbon-carbon double bond. The thiol compound of the present invention, as exemplified by the compounds listed below, is a reaction product of a certain type of dialkene compound and a thiol compound, and has two or more intramolecular thioether bonds but no ester bonds.

Abstract: An imaging apparatus includes a communication unit, a movement unit, an imaging unit, and a control unit. The communication unit receives first information including information on a shooting position of an external apparatus. The movement unit moves the imaging apparatus to a position at which a bird's eye view of subjects is made possible. The imaging unit performs shooting at the position at which the bird's eye view of the subject is made possible. The control unit acquires second information on the subjects from an image that is shot at the position at which the bird's eye view of the subject is made possible, determines priority for shooting each of the subjects based on the first information and the second information, and controls the movement unit and the imaging unit based on the determined priority.

Abstract: The purpose of the present invention is to provide: a novel curable compound which can be expected to be used as a raw material for photocurable resins and thermosetting resins; a method for synthesizing said compound; a resin composition containing said compound; and a cured product thereof. This compound is an epoxy-oxetane compound represented by a formula, and this compound has a structure in which two epoxycyclohexyl groups (groups in which an oxirane ring and a cyclohexane ring are condensed) are bonded to an oxetane ring via a connector having one ether bond. In formula (I?), R1 to R3 may be the same as, or different from, each other, and each denote a hydrogen atom or a methyl group. n is 1 or 2.

Abstract: The purpose of the present invention is to provide: novel thiol compounds; a method for synthesizing said thiol compounds; curing agents containing said thiol compounds; resin compositions containing said thiol compounds and an epoxy compound; and resin compositions containing said thiol compounds and an ene compound having a carbon-carbon double bond in a molecule. Furthermore, the purpose of the present invention is to provide adhesives and sealants having these resin compositions as ingredients. The thiol compounds of the present invention are represented by chemical formula (I) to chemical formula (VII).

Abstract: The purpose of the present invention is to provide: a novel curable compound which can be expected to be used as a raw material for photocurable resins and thermosetting resins; a method for synthesizing said compound; a resin composition containing said compound; and a cured product thereof. This compound is an epoxy-oxetane compound represented by a formula, and this compound has a structure in which two epoxycyclohexyl groups (groups in which an oxirane ring and a cyclohexane ring are condensed) are bonded to an oxetane ring via a connector having one ether bond. In formula (I?), R1 to R3 may be the same as, or different from, each other, and each denote a hydrogen atom or a methyl group. n is 1 or 2.

Abstract: The present invention provides a novel mercaptoethylglycoluril compound. The present invention also provides a curing agent for an epoxy resin using the substance, an epoxy resin composition using the curing agent for an epoxy resin, and an adhesive and a sealing agent each using the epoxy resin composition.

Abstract: There is provided a resin composition which can be thermoset at a temperature of approximately 80° C., and has excellent PCT resistance and a long pot life. This resin composition is suitable as a one-component adhesive agent to be used during the manufacture of image sensor modules or electronic components. The resin composition according to the present invention is a resin composition having the following characteristics. The resin composition includes (A) a compound represented by formula (1) below, an oligomer having as its basic skeleton a structure represented by formula (2) below, (C) an epoxy resin, and (D) a curing accelerator. The mass ratio ((B)/(A)) between the compound of the (A) component and the oligomer of the (B) component is 5 to 25%. Furthermore, the total content of the compound of the (A) component and the oligomer of the (B) component is 0.5 equivalents to 2.

Abstract: There is provided a resin composition which can be thermoset at a temperature of approximately 80° C., and has excellent PCT resistance and a long pot life. This resin composition is suitable as a one-component adhesive agent to be used during the manufacture of image sensor modules or electronic components. The resin composition according to the present invention is a resin composition having the following characteristics. The resin composition includes (A) a compound represented by formula (1) below, an oligomer having as its basic skeleton a structure represented by formula (2) below, (C) an epoxy resin, and (D) a curing accelerator. The mass ratio ((B)/(A)) between the compound of the (A) component and the oligomer of the (B) component is 5 to 25%. Furthermore, the total content of the compound of the (A) component and the oligomer of the (B) component is 0.5 equivalents to 2.

Abstract: The present invention provides a novel mercaptoethylglycoluril compound. The present invention also provides a curing agent for an epoxy resin using the substance, an epoxy resin composition using the curing agent for an epoxy resin, and an adhesive and a sealing agent each using the epoxy resin composition.

Abstract: Objects are to provide a novel azole silane compound, a synthesis method thereof, and a silane coupling agent containing the azole silane compound as a component, and to provide a surface treatment solution using the azole silane compound, a surface treatment method, and a bonding method of two materials different in the quality of material. The azole silane compound of the present invention is a compound represented by the specific chemical formula (I-1) or (II-1).

Abstract: Objects are to provide a novel azole silane compound, a synthesis method thereof, and a silane coupling agent containing the azole silane compound as a component, and to provide a surface treatment solution using the azole silane compound, a surface treatment method, and a bonding method of two materials different in the quality of material. The azole silane compound of the present invention is a compound represented by the specific chemical formula (I-1) or (II-1).

Abstract: A branch/prefetch judgement portion, in receipt of a branch request signal, sets a cache access mode switch signal to an “H” level. Thus, a cache memory operates in the 1-cycle access mode consuming a large amount of power. In receipt of a prefetch request signal, the branch/prefetch judgement portion sets the cache access mode switch signal to an “L” level. Thus, the cache memory operates in the 2-cycle access mode consuming less power.

Abstract: An integrated circuit device capable of effectively shutting off the power supply in a powerdown mode. The integrated circuit device is connected to a first (ground) power supply, a second power supply that continuously provides power, and a third power supply that halts power supply during the powerdown mode. It includes a controller and a CMOS tri-state driver consisting of a series connection of a P-channel MOS transistor and an N-channel MOS transistor. The P-channel MOS transistor has its source connected to the third power supply, its backgates connected to the second power supply and its gate connected to the controller. The N-channel MOS transistor has its source and backgate connected to the first power supply, its drain connected to the drain of the P-channel MOS transistor and its gate connected to the controller.

Abstract: An integrated circuit device capable of effectively shutting off the power supply in a powerdown mode. The integrated circuit device is connected to a first (ground) power supply, a second power supply that continuously provides power, and a third power supply that halts power supply during the powerdown mode. It includes a controller and a CMOS tri-state driver consisting of a series connection of a P-channel MOS transistor and an N-channel MOS transistor. The P-channel MOS transistor has its source connected to the third power supply, its backgates connected to the second power supply and its gate connected to the controller. The N-channel MOS transistor has its source and backgate connected to the first power supply, its drain connected to the drain of the P-channel MOS transistor and its gate connected to the controller.

Abstract: An integrated circuit device capable of effectively shutting off the power supply in a powerdown mode. The integrated circuit device is connected to a first (ground) power supply, a second power supply that continuously provides power, and a third power supply that halts power supply during the powerdown mode. It includes a controller and a CMOS tri-state driver consisting of a series connection of a P-channel MOS transistor and an N-channel MOS transistor. The P-channel MOS transistor has its source connected to the third power supply, its backgates connected to the second power supply and its gate connected to the controller. The N-channel MOS transistor has its source and backgate connected to the first power supply, its drain connected to the drain of the P-channel MOS transistor and its gate connected to the controller.

Abstract: A microprocessor having a built-in DRAM performs following processes: data stored in the buffer 14a is transferred to the DRAM 16 through the internal bus 15 whose data transfer speed is higher than that of the system bus 13a, the transferring occurring when the number of data input operations by the bus interface unit 14 reaches a predetermined number “p”, and an operation result obtained by execution of the CPU 17 and then stored in the DRAM 16 is read through the internal bus 15 and then output to the system bus 13b.

Abstract: A first memory of a large storage capacity is connected to a DQ pad for inputting and outputting an information signal through a bus interface unit. A first bidirectional transfer circuit and a second bidirectional transfer circuit for bidirectionally transmitting an information signal are provided between a high-speed memory and the memory of the large storage capacity. The first bidirectional transfer circuit is connected with the large storage capacity memory through a common bus, and the high-speed memory is interconnected with the second transfer circuit through a fifth bus. This second bidirectional transfer circuit is connected to an instruction register and a data register through a sixth bus. A processor is arranged in proximity to this instruction register and the data register, so that the processor processes an instruction from the instruction register and data from the data register and stores a processing result in the data register again.