Abstract: A voltage detection unit includes a voltage detection terminal having a first location being conductively connected to a detection target, a board-shaped housing having a terminal accommodating recess in which the voltage detection terminal is accommodated, a cover locked to the housing at a first temporary locking position where the first location of the voltage detection terminal accommodated in the terminal accommodating recess is not covered and a final locking position where the first location is covered, and an electric wire conductively connected to a second location of the voltage detection terminal and drawn out toward the outside of the housing. The housing includes a guide portion guiding the cover from the outside toward the first temporary locking position, and a first wall abutting on the cover when the cover is positioned at the first temporary locking position in a moving direction in which the cover is guided.

Abstract: An image processing device according to the present invention includes: a processor; and a memory storing a program which, when executed by the processor, causes the image processing device to acquire a first image captured via a first optical system and a second image captured via a second optical system; detect, as a foreign object region, a region satisfying a predetermined condition in one image out of the first image and the second image; and correct a pixel value in the foreign object region in the one image by using a pixel value of another image out of the first image and the second image.

Abstract: A temperature detection unit includes a board-shaped housing having a board side face provided with a recess configured to be fitted with a side edge of a conductive board disposed between a plurality of stacked power storage modules, and a temperature detection sensor mounted on the housing and configured to measure a temperature of the power storage modules. The housing is provided with a sensor accommodating recess accommodating the temperature detection sensor. A plate end face on one side facing an intersecting direction with a direction that the board side face of the housing faces is provided with an opening configured to allow a temperature wire connected to the temperature detection sensor to extend toward the outside. The sensor accommodating recess extends obliquely to approach the conductive board from one side toward the other side in the intersecting direction.

Abstract: A first board-shaped member includes a conductive plate disposed between a plurality of stacked power storage modules, a battery stack plate including a board-shaped insulating housing having a fitting groove recessed in a side face of the board-shaped insulating housing so as to fit with a side edge of the conductive plate, a sealing material supply groove respectively provided in front and back faces of the insulating housing along an extension direction of the fitting groove, a through hole that communicates with the sealing material supply groove and the fitting groove, and a sealing material pre-filled into the fitting groove and extruded from the fitting groove to the front and back faces of the insulating housing through the through hole and the sealing material supply groove when the side edge of the conductive plate is fitted into the fitting groove.

Abstract: The extraction portion of a current collector plate is configured to include a first piece portion extending in a direction orthogonal to the first direction from an outer edge portion provided on an edge of the flat plate portion when viewed from the first direction, a second piece portion extending in the first direction and having an attachment portion that attaches the extraction portion, and a bent portion being where a plate material configuring the extraction portion bends, and connecting the first piece portion and the second piece portion. A spring portion that is configured to relieve a stress acting on the extraction portion is provided between the connection portion to the outer edge portion and the attachment portion in the extraction portion. The spring portion includes at least a first bent portion being where the plate material bends other than at the bent portion.

Abstract: The purpose of the present invention is to provide: novel thiol compounds; a method for synthesizing said thiol compounds; curing agents containing said thiol compounds; resin compositions containing said thiol compounds and an epoxy compound; and resin compositions containing said thiol compounds and an ene compound having a carbon-carbon double bond in a molecule. Furthermore, the purpose of the present invention is to provide adhesives and sealants having these resin compositions as ingredients. The thiol compounds of the present invention are represented by chemical formula (I) to chemical formula (VII).

Abstract: An objective of the present invention is to provide: a novel thiol compound; a method for synthesizing the thiol compound; a curing agent containing the thiol compound; a resin composition containing the thiol compound and an epoxy compound; and a resin composition containing the thiol compound and an enic compound having an intramolecular carbon-carbon double bond. The thiol compound of the present invention, as exemplified by the compounds listed below, is a reaction product of a certain type of dialkene compound and a thiol compound, and has two or more intramolecular thioether bonds but no ester bonds.

Abstract: An imaging apparatus includes a communication unit, a movement unit, an imaging unit, and a control unit. The communication unit receives first information including information on a shooting position of an external apparatus. The movement unit moves the imaging apparatus to a position at which a bird's eye view of subjects is made possible. The imaging unit performs shooting at the position at which the bird's eye view of the subject is made possible. The control unit acquires second information on the subjects from an image that is shot at the position at which the bird's eye view of the subject is made possible, determines priority for shooting each of the subjects based on the first information and the second information, and controls the movement unit and the imaging unit based on the determined priority.

Abstract: An objective of the present invention is to provide: a novel thiol compound; a method for synthesizing the thiol compound; a curing agent containing the thiol compound; a resin composition containing the thiol compound and an epoxy compound; and a resin composition containing the thiol compound and an enic compound having an intramolecular carbon-carbon double bond. The thiol compound of the present invention, as exemplified by the compounds listed below, is a reaction product of a certain type of dialkene compound and a thiol compound, and has two or more intramolecular thioether bonds but no ester bonds.

Abstract: An imaging apparatus includes a communication unit, a movement unit, an imaging unit, and a control unit. The communication unit receives first information including information on a shooting position of an external apparatus. The movement unit moves the imaging apparatus to a position at which a bird's eye view of subjects is made possible. The imaging unit performs shooting at the position at which the bird's eye view of the subject is made possible. The control unit acquires second information on the subjects from an image that is shot at the position at which the bird's eye view of the subject is made possible, determines priority for shooting each of the subjects based on the first information and the second information, and controls the movement unit and the imaging unit based on the determined priority.

Abstract: The purpose of the present invention is to provide: a novel curable compound which can be expected to be used as a raw material for photocurable resins and thermosetting resins; a method for synthesizing said compound; a resin composition containing said compound; and a cured product thereof. This compound is an epoxy-oxetane compound represented by a formula, and this compound has a structure in which two epoxycyclohexyl groups (groups in which an oxirane ring and a cyclohexane ring are condensed) are bonded to an oxetane ring via a connector having one ether bond. In formula (I?), R1 to R3 may be the same as, or different from, each other, and each denote a hydrogen atom or a methyl group. n is 1 or 2.

Abstract: The purpose of the present invention is to provide: novel thiol compounds; a method for synthesizing said thiol compounds; curing agents containing said thiol compounds; resin compositions containing said thiol compounds and an epoxy compound; and resin compositions containing said thiol compounds and an ene compound having a carbon-carbon double bond in a molecule. Furthermore, the purpose of the present invention is to provide adhesives and sealants having these resin compositions as ingredients. The thiol compounds of the present invention are represented by chemical formula (I) to chemical formula (VII).

Abstract: The purpose of the present invention is to provide: a novel curable compound which can be expected to be used as a raw material for photocurable resins and thermosetting resins; a method for synthesizing said compound; a resin composition containing said compound; and a cured product thereof. This compound is an epoxy-oxetane compound represented by a formula, and this compound has a structure in which two epoxycyclohexyl groups (groups in which an oxirane ring and a cyclohexane ring are condensed) are bonded to an oxetane ring via a connector having one ether bond. In formula (I?), R1 to R3 may be the same as, or different from, each other, and each denote a hydrogen atom or a methyl group. n is 1 or 2.

Abstract: The present invention provides a novel mercaptoethylglycoluril compound. The present invention also provides a curing agent for an epoxy resin using the substance, an epoxy resin composition using the curing agent for an epoxy resin, and an adhesive and a sealing agent each using the epoxy resin composition.

Abstract: There is provided a resin composition which can be thermoset at a temperature of approximately 80° C., and has excellent PCT resistance and a long pot life. This resin composition is suitable as a one-component adhesive agent to be used during the manufacture of image sensor modules or electronic components. The resin composition according to the present invention is a resin composition having the following characteristics. The resin composition includes (A) a compound represented by formula (1) below, an oligomer having as its basic skeleton a structure represented by formula (2) below, (C) an epoxy resin, and (D) a curing accelerator. The mass ratio ((B)/(A)) between the compound of the (A) component and the oligomer of the (B) component is 5 to 25%. Furthermore, the total content of the compound of the (A) component and the oligomer of the (B) component is 0.5 equivalents to 2.

Abstract: There is provided a resin composition which can be thermoset at a temperature of approximately 80° C., and has excellent PCT resistance and a long pot life. This resin composition is suitable as a one-component adhesive agent to be used during the manufacture of image sensor modules or electronic components. The resin composition according to the present invention is a resin composition having the following characteristics. The resin composition includes (A) a compound represented by formula (1) below, an oligomer having as its basic skeleton a structure represented by formula (2) below, (C) an epoxy resin, and (D) a curing accelerator. The mass ratio ((B)/(A)) between the compound of the (A) component and the oligomer of the (B) component is 5 to 25%. Furthermore, the total content of the compound of the (A) component and the oligomer of the (B) component is 0.5 equivalents to 2.

Abstract: The present invention provides a novel mercaptoethylglycoluril compound. The present invention also provides a curing agent for an epoxy resin using the substance, an epoxy resin composition using the curing agent for an epoxy resin, and an adhesive and a sealing agent each using the epoxy resin composition.

Abstract: Objects are to provide a novel azole silane compound, a synthesis method thereof, and a silane coupling agent containing the azole silane compound as a component, and to provide a surface treatment solution using the azole silane compound, a surface treatment method, and a bonding method of two materials different in the quality of material. The azole silane compound of the present invention is a compound represented by the specific chemical formula (I-1) or (II-1).

Abstract: Objects are to provide a novel azole silane compound, a synthesis method thereof, and a silane coupling agent containing the azole silane compound as a component, and to provide a surface treatment solution using the azole silane compound, a surface treatment method, and a bonding method of two materials different in the quality of material. The azole silane compound of the present invention is a compound represented by the specific chemical formula (I-1) or (II-1).

Abstract: A branch/prefetch judgement portion, in receipt of a branch request signal, sets a cache access mode switch signal to an “H” level. Thus, a cache memory operates in the 1-cycle access mode consuming a large amount of power. In receipt of a prefetch request signal, the branch/prefetch judgement portion sets the cache access mode switch signal to an “L” level. Thus, the cache memory operates in the 2-cycle access mode consuming less power.