Abstract: Provided is a sheet-type heat pipe that has a sufficient heat transport capability and can be effortlessly installed in a thin chassis. The sheet-type heat pipe is made of a sealed container formed by stacking and joining together at least two etched sheet bodies formed as metal foil sheets. Particularly, etching or pressing is performed on the surface of the sheet bodies to join at least two sheet bodies such that fine concavities and convexities can be formed on the inner surface of the container and the sheet-type heat pipe with a sufficient heat transport capability can thus be obtained even when the sealed container is thinly formed with its thickness not larger than, e.g. 0.5 mm. More particularly, since the thickness of the container is thinly formed, the sheet-type heat pipe of the present invention can be effortlessly installed in a thin chassis of a mobile terminal.

Abstract: Provided is a mobile terminal capable of allowing a heat generating component such as a CPU to make best use of its capabilities. The sheet-shaped heat pipe, according to the present invention, is provided either between the rear surface of the touch panel and motherboard, or between the one and the battery pack. In this case, since the sheet-shaped heat pipe is arranged opposite to the rear surface of the touch panel which is a part of the chassis of the mobile terminal, a favorable heat diffusion from the heat generating components such as the CPU to a large area on the chassis can be achieved through these sheet-shaped heat pipe, thus allowing the heat generating component such as the CPU to make best use of its capabilities.

Abstract: Provided is a sheet-type heat pipe that has a sufficient heat transport capability and can be effortlessly installed in a thin chassis. The sheet-type heat pipe is made of a sealed container having a thickness of not larger than 0.5 mm. This container is formed by stacking and diffusion-joining together etched sheet bodies. Particularly, etching is performed on one side surface of each of the sheet bodies such that fine concavities and convexities can be formed on the inner surface of the container and the sheet-type heat pipe with a sufficient heat transport capability can thus be obtained even when the thickness of the container is not larger than 0.5 mm. More particularly, since the thickness of the container is formed to not larger than 0.5 mm, the sheet-type heat pipe can be effortlessly installed in a thin chassis such as that of a mobile terminal.

Abstract: Provided is a sheet-type heat pipe that has a sufficient heat transport capability and can be effortlessly installed in a thin chassis. The sheet-type heat pipe is made of a sealed container formed by stacking and joining together at least two etched sheet bodies formed as metal foil sheets. Particularly, etching or pressing is performed on the surface of the sheet bodies to join at least two sheet bodies such that fine concavities and convexities can be formed on the inner surface of the container and the sheet-type heat pipe with a sufficient heat transport capability can thus be obtained even when the sealed container is thinly formed with its thickness not larger than, e.g. 0.5 mm. More particularly, since the thickness of the container is thinly formed, the sheet-type heat pipe of the present invention can be effortlessly installed in a thin chassis of a mobile terminal.

Abstract: Provided is a mobile terminal capable of allowing a heat generating component such as a CPU to make best use of its capabilities. The sheet-shaped heat pipe, according to the present invention, is provided either between the rear surface of the touch panel, and motherboard, or between the one and the battery pack. In this case, since the sheet-shaped heat pipe is arranged opposite to the rear surface of the touch panel which is a part of the chassis of the mobile terminal a favorable heat diffusion from the heat generating components such as the CPU to a large area on the chassis can be achieved through these sheet-shaped heat pipe, thus allowing the heat generating component such as the CPU to make best use of its capabilities.

Abstract: Provided is a sheet-type heat pipe that has a sufficient heat transport capability and can be effortlessly installed in a thin chassis. The sheet-type heat pipe is made of a sealed container having a thickness of not larger than 0.5 mm. This container is formed by stacking and diffusion-joining together etched sheet bodies. Particularly, etching is performed on one side surface of each of the sheet bodies such that fine concavities and convexities can be formed on the inner surface of the container and the sheet-type heat pipe with a sufficient heat transport capability can thus be obtained even when the thickness of the container is not larger than 0.5 mm. More particularly, since the thickness of the container is formed to not larger than 0.5 mm, the sheet-type heat pipe can be effortlessly installed in a thin chassis such as that of a mobile terminal.

Abstract: There is provided a cooling device not affected by gravity by exerting a strong capillary attraction to be hard to deteriorate in transportation function. Unidirectionally-aligned copper fiber assembly 8 is mounted, by a sintering process, on an inner wall of a heat pipe 3 along the longitudinal direction of the heat pipe 3. Therefore, by a strong capillary attraction caused by fine copper fiber assembly 8, purified water can be transported without being affected by gravity. A flow volume just enough for the purified water to be prevented from drying out by its evaporation can be maintained, thus making it hard for a function in the transportation of the purified water to be deactivated. Further, the unidirectionally-aligned copper fiber assembly 8 is mounted along the longitudinal direction of heat pipe 3 and hence the purified water smoothly flows in the longitudinal direction of heat pipe 3.

Abstract: A server system has, in addition to extensibility of scale-out type of a braid server system, extensibility of scale-up type by making SMP coupling among nodes. Each node has a unit for SMP coupling to other nodes. A module management unit responds to system configuration information to switch between a mode in which the node operates singularly as a braid server and a mode in which the node operates as a constituent module of an SMP server. Links among individual nodes are laid through equidistant wiring lines on a back plane and additionally a loop wiring line having a length equal to that of the inter-node link on the back plane is also laid in each node, thereby setting up synchronization among the nodes. Synchronization of reference clocks for SMP coupled nodes is also established.

Abstract: A server system has, in addition to extensibility of scale-out type of a braid server system, extensibility of scale-up type by making SMP coupling among nodes. Each node has a unit for SMP coupling to other nodes. A module management unit responds to system configuration information to switch between a mode in which the node operates singularly as a braid server and a mode in which the node operates as a constituent module of an SMP server. Links among individual nodes are laid through equidistant wiring lines on a back plane and additionally a loop wiring line having a length equal to that of the inter-node link on the back plane is also laid in each node, thereby setting up synchronization among the nodes. Synchronization of reference clocks for SMP coupled nodes can be is also established.

Abstract: A server system has, in addition to extensibility of scale-out type of a braid server system, extensibility of scaleup type by making SMP coupling among nodes. Each node has a unit for SMP coupling to other nodes and a module management unit of each node responds to system configuration information to switch between mode in which the node operates singularly as a braid server and mode in which the node operates as a constituent module of an SMP server. Links among individual nodes are laid through equidistant wiring lines on a back plane and besides a loop wiring line having length equal to that of the inter-node link on back plane is also laid in each node, thereby setting up synchronization among nodes. Each node has a reference clock distribution unit mounted on back plane and adapted to distribute reference clocks to individual nodes and by switching reference clocks by a clock distributor inside each node, synchronization of reference clocks for SMP coupled nodes can be established.