Abstract: The present invention provides a functionalized mRNA including mRNA and double-stranded RNA including at least one RNA oligomer hybridized with mRNA. Functionalized mRNA is provided according to this configuration.

Abstract: The present invention provides a functionalized mRNA including mRNA and double-stranded RNA including at least one RNA oligomer hybridized with mRNA. Functionalized mRNA is provided according to this configuration.

Abstract: A pharmaceutical composition includes polymer units ? and ?, each having a hydrophilic polymer chain bound to a cationic polymer chain, and a drug. The polymer units ? and ? are radially arranged such that the cationic polymer chains are directed inward and the hydrophilic polymer chains are directed outward, thereby forming a micelle with the drug encapsulated in the micelle. The cationic polymer chain of the polymer unit ? has a phenylboronic acid group in a side chain, and the cationic polymer chain of the polymer unit ? has a phenylboronic acid binding site in a side chain. The phenylboronic acid group and the phenylboronic acid binding site form a cross-linked structure that can dissociate in an acidic environment and/or in the presence of a substance capable of competitive binding.

Abstract: A pharmaceutical composition includes polymer units ? and ?, each having a hydrophilic polymer chain bound to a cationic polymer chain, and a drug. The polymer units ? and ? are radially arranged such that the cationic polymer chains are directed inward and the hydrophilic polymer chains are directed outward, thereby forming a micelle with the drug encapsulated in the micelle. The cationic polymer chain of the polymer unit ? has a phenylboronic acid group in a side chain, and the cationic polymer chain of the polymer unit ? has a phenylboronic acid binding site in a side chain. The phenylboronic acid group and the phenylboronic acid binding site form a cross-linked structure that can dissociate in an acidic environment and/or in the presence of a substance capable of competitive binding.

Abstract: A complex of mRNA encoding a target gene with RNA oligomers, wherein the RNA oligomers are at least two kinds of RNA oligomers comprising RNA sequences of (a) or (b), the at least two kinds of RNA oligomers are hybridizable respectively with sequences, said sequences being different from each other, in the mRNA sequence, and the complex is formed when a first sequence of the RNA oligomers hybridizes with different mRNA from the second sequence of the RNA oligomers: (a) an RNA sequence which comprises a first sequence consisting of 12-40 bases and being complementary to the mRNA sequence, a linker sequence consisting of 0-100 bases and a sequence which is the same as the first sequence, in this order; and (b) an RNA sequence which comprises a first sequence, which has a 90% or more identity with a sequence consisting of 12-40 bases and being complementary to the mRNA sequence and is hybridizable with mRNA, a linker sequence consisting of 0-100 bases and a second sequence which is the same as the first sequence

Abstract: The present invention provides a functionalized mRNA including mRNA and double-stranded RNA including at least one RNA oligomer hybridized with mRNA. Functionalized mRNA is provided according to this configuration.

Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Abstract: Disclosed is a thermofusible and thermosetting phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This phenol resin powder preferably has an average particle diameter of not more than 10 ?m, a variation coefficient of the particle size distribution of not more than 0.65, a particle sphericity of not less than 0.5 and a free phenol content of not more than 1000 ppm. Also disclosed are a dispersion liquid of such a phenol resin powder, and a method for producing a phenol resin powder having such characteristics.

Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Abstract: Disclosed is a thermofusible and thermosetting phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This phenol resin powder preferably has an average particle diameter of not more than 10 ?m, a variation coefficient of the particle size distribution of not more than 0.65, a particle sphericity of not less than 0.5 and a free phenol content of not more than 1000 ppm. Also disclosed are a dispersion liquid of such a phenol resin powder, and a method for producing a phenol resin powder having such characteristics.

Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.