Abstract: This invention provides a metal foil and an etching process which overcomes the problem of etching of the copper foil layer and the plating copper layer formed on a metal clad laminate during the conventional semi-additive process for producing printed wire boards. In the present invention, the metal foil and the metal foil with carrier foil include a nickel or tin layer 0.5 to 3 ?m thick formed on the external surface of a metal clad laminate which protects the surface of the plated layer during the final flash etching of the copper foil layer.

Abstract: An object of the present invention is to provide a laminate for forming a capacitor layer for a printed wiring board which is capable of ensuring a higher capacitance and an inner layer core material using the laminate for example. In order to achieve this object, a material for forming a capacitor layer comprising a three-layered structure of an aluminum layer 2/a modified alumina barrier layer 3/an electrode copper layer 4 is used, such as a laminate 1a for forming a capacitor layer in which the above described modified alumina barrier layer 3 is obtained through subjecting one side of an aluminum plate or aluminum foil to an anodic treatment to form an alumina barrier layer as a uniform oxide layer and then subjecting the alumina material with the above described alumina barrier layer formed thereon to a boiling and modifying treatment in water and the above described modified aluminum barrier layer 3 is used as a dielectric layer.

Abstract: It is an object to provide a manufacturing process for a printed wiring board in which a copper foil and resin as a substrate material of a copper clad laminate are irradiated with carbon dioxide gas laser light to drill in both of them simultaneously. In forming a through hole or a hole such as IVH, BVH or the like in the copper clad laminate using carbon dioxide gas laser light, one of a nickel layer of 0.08 to 2 &mgr;m in thickness, a cobalt layer of 0.05 to 3 &mgr;m in thickness and a zinc layer of 0.03 to 2 &mgr;m in thickness is formed as an additional metal layer on a surface of the copper foil residing in an external layer of the copper clad laminate and thereafter, by performing laser drilling, the copper foil layer and the resin layer as a substrate material of the copper clad laminate are enabled to drill simultaneously.

Abstract: An object of the present invention is to provide a laminate for forming a capacitor layer for a printed wiring board which is capable of ensuring a higher capacitance and an inner layer core material using the laminate for example. In order to achieve this object, a material for forming a capacitor layer comprising a three-layered structure of an aluminum layer 2/a modified alumina barrier layer 3/an electrode copper layer 4 is used, such as a laminate 1a for forming a capacitor layer in which the above described modified alumina barrier layer 3 is obtained through subjecting one side of an aluminum plate or aluminum foil to an anodic treatment to form an alumina barrier layer as a uniform oxide layer and then subjecting the alumina material with the above described alumina barrier layer formed thereon to a boiling and modifying treatment in water and the above described modified aluminum barrier layer 3 is used as a dielectric layer.

Abstract: There are provided an electrodeposited copper foil with carrier that can be used for manufacturing a printed wiring board that excels in the finished accuracy of the resistor circuit in comparison with a conventional printed wiring board with resistor circuits, and a method for manufacturing such a printed wiring board with resistor circuits.

Abstract: An object of the present invention is to reduce and to stabilize peel strength of a carrier foil in an electrodeposited copper foil with carrier employing an organic adhesive interface, thereby facilitating peeling of the carrier foil. The electrodeposited copper foil with carrier of the present invention contains a carrier foil layer, an organic adhesive interface layer formed on the carrier foil layer, and an electrodeposited copper foil layer formed on the organic adhesive interface layer, wherein the difference between the coefficient of thermal expansion of material forming the carrier foil layer at a certain temperature and that of material forming the electrodeposited copper foil at the same temperature is 4×10−7/deg.C or more.

Abstract: The present invention provides a filtration method of copper electrolyte that can remove minute electrolytic by-products and dirt and may improve filtration efficiency by improving a conventional filtration method, the so-called precoating method. In a filtration method of copper electrolyte for removing electrolytic by-products and dirt which affect copper electrolysis, by passing copper electrolyte through a filter element precoated with a filtering aid, in the present invention, a precoated layer of a filtering aid is formed on a filter element in advance. Activated carbon preliminary treatment solution containing powdery activated carbon is passed through the filter element formed with the precoated layer, and is also circulated until no powdery activated carbon leaks from an outlet of the filter element, thus forming a powdery activated carbon layer on the precoated layer. Subsequently, the copper electrolyte is passed through for filtration.

Abstract: An object of the invention is to provide a blade for cutting a copper foil being capable of further decreasing the amount of slivers generated at the time of processing, e.g., cutting, punching, and perforating a copper foil and also capable of making the size of the slivers smaller. To achieve the purpose, a disk-like blade to be employed for a copper foil-slitting apparatus is coated with diamond-like carbon (DLC) or diamond-like carbon soft (DLC-soft) on at least a part to be brought into contact with a copper foil at the time of cutting. The coating reduces the unevenness of a blade surface, thereby providing a face being scarcely scratched with the copper foil. Subsequently, the amount of the slivers generated is remarkably decreased and the cutting property is improved.

Abstract: The present invention is directed to provision of a surface-treated copper foil exhibiting a maximum effect of a silane coupling agent which is adsorbed onto the copper foil and is employed in order to enhance adhesion between the copper foil and a substrate during manufacture of printed wiring boards. The invention is also directed to provision of a method for producing such a copper foil. To attain these goals, a surface-treated copper foil for producing printed wiring boards is provided, wherein an anti-corrosion treatment comprises forming a zinc layer or a zinc alloy layer on a surface of the copper foil and forming an electrodeposited chromate layer on the zinc or zinc alloy layer; forming a silane-coupling-agent-adsorbed layer on the electrodeposited chromate layer without causing the electrodeposited chromate layer of the nodular-treated surface to dry; and drying.

Abstract: The purpose is to provide a surface treated copper foil and an electrodeposited copper foil with carrier to be employed for a copper clad laminate capable to be processed for simultaneous hole formation in the copper foil layer and a substrate resin layer using carbon dioxide gas laser. The purpose can be achieved by using a surface treated copper foil bearing a nickel layer or a cobalt layer with a prescribed thickness in one side of a copper foil or an electrodeposited copper foil with carrier provided with a nickel layer or a cobalt layer with a prescribed thickness between a carrier foil and an electrode posited copper foil layer. When a copper clad laminate is manufactured using these foils, the copper clad laminate is capable to be processed to easily and simultaneously form a hole in the copper foil layer and the substrate resin layer using carbon dioxide gas laser.

Abstract: An object of the invention is to provide a surface-treated copper foil capable of consistently attaining a percent loss of peel strength in resistance against hydrochloric acid degradation of 10% or less as measured on a copper pattern prepared from the copper foil and having a line width of 0.2 mm, by bringing out the maximum effect of the silane coupling agent employed in brass-plated anti-corrosive copper foil. The Another object is to impart excellent moisture resistance to the surface-treated copper foil.

Abstract: An object of the invention is to provide a surface-treated copper foil capable of consistently attaining a percent loss in peel strength against hydrochloric acid degradation of 10% or less as measured on a copper pattern prepared from the copper foil and having a line width of 0.2 mm, by bringing out the maximum effect of the silane coupling agent employed in zinc-plated or zinc-alloy-plated anti-corrosive copper foil. Another object is to impart excellent moisture resistance, heat resistance, and long-term storage stability to the surface-treated copper foil.

Abstract: A copper foil for use in making a printed wiring board and a copper clad laminate comprising the copper foil are herein disclosed and the copper foil is characterized in that a metal chromium layer is formed on at least one side of the copper foil by vapor deposition or characterized in that one side of the copper foil is supported by a carrier through a releasing layer and a metal chromium layer is formed on the other side of the foil by vapor deposition. The copper foil is excellent in the adhesion to various substrates (the peel strength between the substrate and the copper foil), moisture resistance, chemical resistance and heat resistance and therefore, the copper foil can suitably be used in the production of printed wiring boards.

Abstract: The invention provides a surface-treated copper foil for producing printed wiring boards whose surface has,,been subjected to nodular treatment and anti-corrosion treatment, wherein the anti-corrosion treatment includes forming a-zinc-copper-tin ternary alloy anti-corrosive plating layer on a surface of the copper foil; forming an electrolytic chromate layer on the anti-corrosive plating layer; forming a silane-coupling-agent-adsorbed layer on the electrolytic chromate layer; and drying the copper foil for 2-6 seconds such that the copper foil reaches 105° C.-200° C.

Abstract: The invention provides a surface-treated copper foil for producing printed wiring boards whose surface has been subjected to nodular treatment and anti-corrosion treatments, wherein the anti-corrosion treatment includes forming a zinc-copper-nickel ternary alloy anti-corrosive plating layer on a surface of the copper foil; forming an electrolytic chromate layer on the anti-corrosive plating layer; forming a silane-coupling-agent-absorbed layer on the electrolytic chromate layer; and drying the copper foil for 2-6 seconds such that the copper foil reaches 105° C.-200° C.

Abstract: To provide a copper foil roll, which is a final product form of copper foil, in which wrinkles generating in the vicinity of a core tube of the copper foil roll are restrained to the utmost, and a better winding balance is provided. A method for winding copper foil on a core tube, in which the copper foil is spliced to a core tube with use of a pressure-sensitive double-sided adhesive coated tape with releasing paper and is wound into a roll form.

Abstract: The present invention provides an electrodeposited copper foil which solves problems of electrodeposited-copper-clad laminates to which the foil has been incorporated, such as bow, twist, and poor dimensional stability, and a method of inspecting an electrodeposited copper foil so as to assure the quality of the foil. In the invention, there is employed an electrodeposited copper foil which recrystallizes by heating at low temperature during production of a copper-clad laminate employing an electrodeposited copper foil and which exhibits an elongation as high as 18% or more in an atmosphere of 180° C., wherein the maximum rate of decrease in maximum tensile strength falls within the aging time ranging from 5 to 10 minutes in a process in which tensile strength decreases as time elapses during aging in an atmosphere at 170° C., and the change in tensile strength in a knick portion shown in a {tensile strength} vs.

Abstract: It is an object to provide a manufacturing process for a printed wiring board in which a copper foil and resin as a substrate material of a copper clad laminate are irradiated with carbon dioxide gas laser light to drill in both of them simultaneously. In forming a through hole or a hole such as IVH, BVH or the like in the copper clad laminate using carbon dioxide gas laser light, one of a nickel layer of 0.08 to 2 &mgr;m in thickness, a cobalt layer of 0.05 to 3 &mgr;m in thickness and a zinc layer of 0.03 to 2 &mgr;m in thickness is formed as an additional metal layer on a surface of the copper foil residing in an external layer of the copper clad laminate and thereafter, by performing laser drilling, the copper foil layer and the resin layer as a substrate material of the copper clad laminate are enabled to drill simultaneously.

Abstract: This invention aims at providing metal foil and an etching process which can overcome the problem exists on the conventional semi-additive process for producing printed wiring boards, the problem being such that not only the copper foil layer but also the plating copper layer formed on a metal clad laminate is etched and thereby the edge portion of the circuit is attacked during the flash etching carried out in the final step of the production process. In light of the above problem, the metal foil and the metal foil with carrier foil of this invention are characterized in that a nickel or tin layer 0.5 to 3 &mgr;m thick can be formed on the external surface of the metal clad laminate.

Abstract: To provide a cathodic electrode material widely applicable to electro winning of a metal, easy in maintenance and capable of producing a deposited metal good in physical properties and shapes. For this purpose, a cathodic electrode material used for electrolytic deposition of a metal, characterized in that the cathodic electrode is made of titanium and the surface on which a metal is electrolytically deposited is provided with a ceramic layer is used. Furthermore, applying this cathodic electrode material to a cathode used for production of an electrolytic copper foil permits an electrolytic copper foil excellent in quality to be obtained.