Patents by Inventor Naotoshi Hosoya

Naotoshi Hosoya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polisher for polishing end surface of semiconductor wafer
    Patent number: 6736710
    Abstract: A polishing head for polishing the end surface of a semiconductor wafer has a driver roller, a driving motor for rotating it, a pair of upper and lower follower rollers one above the other parallel to and horizontally separated from the driver roller and an endless polishing belt around these rollers. As the driving motor causes the polishing belt to run around the rollers, the semiconductor wafer is pushed against the polishing belt between the upper and lower follower rollers. A pair of upper and lower tension-controlling rollers are provided for controlling the tension in the polishing belt between the two follower rollers. At least one of these tension-controlling rollers is movable vertically. A polisher is formed with such a polishing head, a holder for holding and rotating the wafer and an attaching device for attaching the polishing head to the polisher.
    Type: Grant
    Filed: March 26, 2003
    Date of Patent: May 18, 2004
    Assignee: Nihon Microcoating Co., Ltd.
    Inventors: Kazunari Osawa, Izuru Morioka, Naotoshi Hosoya
  • Polisher for polishing end surface of semiconductor wafer
    Publication number: 20030166384
    Abstract: A polishing head for polishing the end surface of a semiconductor wafer has a driver roller, a driving motor for rotating it, a pair of upper and lower follower rollers one above the other parallel to and horizontally separated from the driver roller and an endless polishing belt around these rollers. As the driving motor causes the polishing belt to run around the rollers, the semiconductor wafer is pushed against the polishing belt between the upper and lower follower rollers. A pair of upper and lower tension-controlling rollers are provided for controlling the tension in the polishing belt between the two follower rollers. At least one of these tension-controlling rollers is movable vertically. A polisher is formed with such a polishing head, a holder for holding and rotating the wafer and an attaching device for attaching the polishing head to the polisher.
    Type: Application
    Filed: March 26, 2003
    Publication date: September 4, 2003
    Applicant: Nihon Microcoating Co., Ltd.
    Inventors: Kazunari Osawa, Izuru Morioka, Naotoshi Hosoya