Patents by Inventor Naoya Adachi
Naoya Adachi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7508495Abstract: A positioning stage that can prevent an excessive force from being imparted to a positioned wafer, a bump forming apparatus equipped with such a positioning stage, and a bump forming method performed using such a positioning stage are provided. A biasing member that biases a wafer towards a positioning member has a contact surface that substantially faces a wafer-holding surface at an angle. The contact surface is in contact with an outer peripheral area of the wafer so as to bias the wafer slantwise towards the wafer-holding surface. With a resiliently deformable member, the positioning member is brought into contact with the wafer and is held at a predetermined position. When a bias force exceeding a predetermined magnitude is imparted to the positioning member, the resiliently deformable member becomes resiliently deformed so as to allow the positioning member to recede from the predetermined position.Type: GrantFiled: November 19, 2007Date of Patent: March 24, 2009Assignee: Murata Manufacturing Co., Ltd.Inventors: Naoya Adachi, Masayuki Sumita, Masaki Sekino
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Publication number: 20080068581Abstract: A positioning stage that can prevent an excessive force from being imparted to a positioned wafer, a bump forming apparatus equipped with such a positioning stage, and a bump forming method performed using such a positioning stage are provided. A biasing member that biases a wafer towards a positioning member has a contact surface that substantially faces a wafer-holding surface at an angle. The contact surface is in contact with an outer peripheral area of the wafer so as to bias the wafer slantwise towards the wafer-holding surface. With a resiliently deformable member, the positioning member is brought into contact with the wafer and is held at a predetermined position. When a bias force exceeding a predetermined magnitude is imparted to the positioning member, the resiliently deformable member becomes resiliently deformed so as to allow the positioning member to recede from the predetermined position.Type: ApplicationFiled: November 19, 2007Publication date: March 20, 2008Inventors: Naoya Adachi, Masayuki Sumita, Masaki Sekino
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Patent number: 6936676Abstract: This invention provides a one-part, room temperature moisture curable resin composition which comprises a ketimine prepared by reacting a ketone having a substituent at ? position and a polyamine having at least two amino groups within its molecule wherein ? position is methylene, and a main polymer which is an epoxy resin and/or a modified silicone having at least two hydrolyzable alkoxysilyl groups in its molecule, and which exhibits good shelf stability and high curing rate once taken out of the container, and which may further exhibit flexibility; a one-part, room temperature moisture curable resin composition which exhibits good shelf stability and curability as well as wet surface adhesion or initial thixotropic properties; a silicon containing compound having ketimine group whose reaction with the epoxy resin during the storage is prevented by the presence of a bulky alkyl group near the ketimine group and which exhibits good shelf stability and curability, and its production method; a one-part, room tType: GrantFiled: November 24, 2003Date of Patent: August 30, 2005Assignee: Yokohama Rubber Co., Ltd.Inventors: Hiroyuki Okuhira, Naoya Adachi, Kazunori Ishikawa, Toshimitsu Takeda, Yo Kotani
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Publication number: 20040192873Abstract: This invention provides a one-part, room temperature moisture curable resin composition which comprises a ketimine prepared by reacting a ketone having a substituent at &agr; position and a polyamine having at least two amino groups within its molecule wherein &agr; position is methylene, and a main polymer which is an epoxy resin and/or a modified silicone having at least two hydrolyzable alkoxysilyl groups in its molecule, and which exhibits good shelf stability and high curing rate once taken out of the container, and which may further exhibit flexibility; a one-part, room temperature moisture curable resin composition which exhibits good shelf stability and curability as well as wet surface adhesion or initial thixotropic properties; a silicon containing compound having ketimine group whose reaction with the epoxy resin during the storage is prevented by the presence of a bulky alkyl group near the ketimine group and which exhibits good shelf stability and curability, and its production method; a one-partType: ApplicationFiled: April 13, 2004Publication date: September 30, 2004Applicant: The Yokohama Rubber Co., Ltd.Inventors: Hiroyuki Okuhira, Naoya Adachi, Kazunori Ishikawa, Toshimitsu Takeda, Yo Kotani
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Patent number: 6756466Abstract: This invention provides a one-part, room temperature moisture curable resin composition which comprises a ketimine prepared by reacting a ketone having a substituent at &agr; position and a polyamine having at least two amino groups within its molecule wherein &agr; position is methylene, and a main polymer which is an epoxy resin and/or a modified silicone having at least two hydrolyzable alkoxysilyl groups in its molecule, and which exhibits good shelf stability and high curing rate once taken out of the container, and which may further exhibit flexibility; a one-part, room temperature moisture curable resin composition which exhibits good shelf stability and curability as well as wet surface adhesion or initial thixotropic properties; a silicon containing compound having ketimine group whose reaction with the epoxy resin during the storage is prevented by the presence of a bulky alkyl group near the ketimine group and which exhibits good shelf stability and curability, and its production method; a one-partType: GrantFiled: November 12, 2002Date of Patent: June 29, 2004Assignee: The Yokohama Rubber Co., Ltd.Inventors: Hiroyuki Okuhira, Naoya Adachi, Kazunori Ishikawa, Toshimitsu Takeda, Yo Kotani
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Publication number: 20040106766Abstract: This invention provides a one-part, room temperature moisture curable resin composition which comprises a ketimine prepared by reacting a ketone having a substituent at a position and a polyamine having at least two amino groups within its molecule wherein &agr; position is methylene, and a main polymer which is an epoxy resin and/or a modified silicone having at least two hydrolyzable alkoxysilyl groups in its molecule, and which exhibits good shelf stability and high curing rate once taken out of the container, and which may further exhibit flexibility; a one-part, room temperature moisture curable resin composition which exhibits good shelf stability and curability as well as wet surface adhesion or initial thixotropic properties; a silicon containing compound having ketimine group whose reaction with the epoxy resin during the storage is prevented by the presence of a bulky alkyl group near the ketimine group and which exhibits good shelf stability and curability, and its production method; a one-part, roType: ApplicationFiled: November 24, 2003Publication date: June 3, 2004Applicant: The Yokohama Rubber Co., Ltd.Inventors: Hiroyuki Okuhira, Naoya Adachi, Kazunori Ishikawa, Toshimitsu Takeda, Yo Kotani
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Publication number: 20030139559Abstract: This invention provides a one-part, room temperature moisture curable resin composition which comprises a ketimine prepared by reacting a ketone having a substituent at &agr; position and a polyamine having at least two amino groups within its molecule wherein &agr; position is methylene, and a main polymer which is an epoxy resin and/or a modified silicone having at least two hydrolyzable alkoxysilyl groups in its molecule, and which exhibits good shelf stability and high curing rate once taken out of the container, and which may further exhibit flexibility; a one-part, room temperature moisture curable resin composition which exhibits good shelf stability and curability as well as wet surface adhesion or initial thixotropic properties; a silicon containing compound having ketimine group whose reaction with the epoxy resin during the storage is prevented by the presence of a bulky alkyl group near the ketimine group and which exhibits good shelf stability and curability, and its production method; a one-partType: ApplicationFiled: November 12, 2002Publication date: July 24, 2003Applicant: THE YOKOHAMA RUBBER CO., LTD.Inventors: Hiroyuki Okuhira, Naoya Adachi, Kazunori Ishikawa, Toshimitsu Takeda, Yo Kotani
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Patent number: 6525159Abstract: This invention provides a one-part, room temperature moisture curable resin composition which comprises a ketimine prepared by reacting a ketone having a substituent at &agr; position and a polyamine having at least two amino groups within its molecule wherein &agr; position is methylene, and a main polymer which is an epoxy resin and/or a modified silicone having at least two hydrolyzable alkoxysilyl groups in its molecule, and which exhibits good shelf stability and high curing rate once taken out of the container, and which may further exhibit flexibility; a one-part, room temperature moisture curable resin composition which exhibits good shelf stability and curability as well as wet surface adhesion or initial thixotropic properties; a silicon containing compound having ketimine group whose reaction with the epoxy resin during the storage is prevented by the presence of a bulky alkyl group near the ketimine group and which exhibits good shelf stability and curability, and its production method; a one-partType: GrantFiled: March 30, 1999Date of Patent: February 25, 2003Assignee: The Yokohama Rubber Co., Ltd.Inventors: Hiroyuki Okuhira, Naoya Adachi, Kazunori Ishikawa, Toshimitsu Takeda, Yo Kotani
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Publication number: 20020169259Abstract: A composition comprising an epoxy resin and a ketimine compound, wherein the epoxy resin is either (1) an epoxy resin having a content of an epoxy resin having no hydroxyl group in the molecule in a range of more than 90 mol % to 100 mol % or less, (2) an epoxy resin wherein hydroxyl groups are capped with an isocyanate group-containing compound, (3) an epoxy resin wherein hydroxyl groups are capped with an alkoxysilyl group-containing compound, or (4) an epoxy resin containing an alkoxysilyl group-containing compound which is capable of capping hydroxyl groups of the epoxy resin. When either of the those epoxy resins is used and also the ketimine compound having high steric hindrance is used, a one-pack epoxy resin composition having good curing property and particularly excellent storage stability can be provided.Type: ApplicationFiled: July 16, 1999Publication date: November 14, 2002Inventors: HIROYUKI OKUHIRA, NAOYA ADACHI
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Patent number: 6476160Abstract: A composition comprising an epoxy resin and a ketimine compound, wherein the epoxy resin is either (1) an epoxy resin having a content of an epoxy resin having no hydroxyl group in the molecule in a range of more than 90 mol % to 100 mol % or less, (2) an epoxy resin wherein hydroxyl groups are capped with an isocyanate group-containing compound, (3) an epoxy resin wherein hydroxyl groups are capped with an alkoxysilyl group-containing compound, or (4) an epoxy resin containing an alkoxysilyl group-containing compound which is capable of capping hydroxyl groups of the epoxy resin. When either of the those epoxy resins is used and also the ketimine compound having high steric hindrance is used, a one-pack epoxy resin composition having good curing property and particularly excellent storage stability can be provided.Type: GrantFiled: July 16, 1999Date of Patent: November 5, 2002Assignee: The Yokohama Rubber Co., Ltd.Inventors: Hiroyuki Okuhira, Naoya Adachi
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Patent number: 6329460Abstract: A polysiloxane composition comprising (i) an alkoxysilyl group-containing polysiloxane containing at least six siloxane structures having the following formula (I) in a molecule wherein R1 represents a methyl group, ethyl group or phenyl group, and R2 represents a group selected from the group consisting of hydrocarbon group and ether bond-containing hydrocarbon groups having 1 to 6 carbon atoms; and (ii) an alcohol having the formula R4(OR5)p—OH wherein R4 represents a C1-C18 alkyl group, a phenyl group or a benzyl group, R5 represents C1-C6 alkylene group and p is an integer of 0-20.Type: GrantFiled: April 11, 2000Date of Patent: December 11, 2001Assignee: The Yokohama Rubber Co., Ltd.Inventors: Kazunori Ishikawa, Fumito Yatsuyanagi, Hiroyuki Kaido, Naoya Adachi
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Patent number: 6221998Abstract: An isocyanate-based one-part moisture curable composition having excellent storage stability and high curing rate, and use of this composition enables production of a cured product of high flexibility without using any plasticizer. The composition comprises (A) an isocyanate compound having a structure wherein all of the isocyanate (NCO) groups in the molecule have secondary or tertiary carbon bonded thereto, and (B) a ketimine having ketimine (C═N) bond derived from a ketone or an aldehyde and an amine having a structure wherein &agr;-position of at least one of the carbon or the nitrogen of the ketimine bond has a branched carbon atom or a ring member carbon atom bonded thereto. A urethane prepolymer having such structure is preferable for use as the isocyanate compound (A).Type: GrantFiled: November 24, 1999Date of Patent: April 24, 2001Assignee: The Yokohama Rubber Co., Ltd.Inventors: Hiroyuki Okuhira, Naoya Adachi
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Patent number: 5292812Abstract: Adhesive compositions of a selected class of epoxy resins combined with a selected class of carboxylic group-containing acrylonitrile-butadiene and methacrylonitrile-butadiene copolymers, maleimide derivatives and an imidazole compound. The resultant compositions are electrically insulative, thermally resistant, highly capable of fabrication at low pressure and storage stable.Type: GrantFiled: March 17, 1993Date of Patent: March 8, 1994Assignee: The Yokohama Rubber Co., Ltd.Inventors: Hajime Yamazaki, Hiroyuki Wakamatsu, Toshinobu Takahashi, Naoya Adachi